Claims
- 1. A giant magnetoresistive transducer for reading data signals recorded on a surface of a magnetic medium, said transducer having an air bearing surface comprising:a giant magnetoresistive sensor having a sensing surface and side surfaces, said sensor being recessed at a distance S from said air bearing surface to define a gap between said sensor and said air bearing surface; magnetic shield members spaced from each of said side surfaces and at a distance G between said shield members wherein said distance S is less than half of said distance G for preventing signal loss caused by said shields shunting away incoming transition flux from said magnetic medium; and a dielectric layer disposed within said gap, said dielectric layer extending from said sensing surface to separate said sensing surface from said surface of said magnetic medium on which data signals are recorded which are to be read out by said transducer.
- 2. A transducer in accordance with claim 1 in which said giant magnetoresistive sensor comprises a spin valve structure.
- 3. A transducer in accordance with claim 1 in which S is between 500-1250 Å.
- 4. A transducer in accordance with claim 1 in which said giant magnetoresistive sensor comprises a multilayer structure.
- 5. A transducer in accordance with claim 1 in which said giant magnetoresistive sensor is made to operate in a current-perpendicular-to-the-plane mode.
- 6. a transducer in accordance with claim 1 in which said giant magnetoresistive sensor is made to operate in a current-in-the-plane mode.
CROSS-REFERENCE TO RELATED APPLICATION
Copending application Ser. No. 08/509,118, filed Jul. 31, 1995 for “Method And Apparatus For Controlling The Lapping Of Magnetic Heads”, assigned to the same assignee as the present application, discloses and claims the detection of the sensing surface of a magnetoresistive (MR) sensor in an MR transducer structure by applying a magnetic field to the structure and detecting the changing electrical response of the sensor to the magnetic field as the transducer structure is lapped during manufacture.
US Referenced Citations (4)