This invention relates to the field of desalination of saline solutions, from highly concentrated sea water to brackish water by conventional technologies that range from reverse osmosis and forward osmosis to thermal distillation systems, membrane distillation systems, electro-oxidation, and dialysis. In particular, embodiments of the invention relate to the use of heat pipes, pulsed heat pipes, advanced heat pipes and thermosiphons for heat transfer and recovery, thereby achieving significant advantages in overall energy efficiency.
Two groups of technology predominate in water desalination applications: one based on osmosis phenomena and one on distillation phenomena under partial vacuum. Under the first group, reverse osmosis (RO) is dominant in terms of existing industrial plants, although forward osmosis (FO) systems are receiving increasing attention notwithstanding the fact that the technology is commercially less developed. In the case of distillation systems, multiple effect distillation (MED) appears to provide superior energy efficiency over multi-flash systems (MSF), particularly in combination with vapor compression that reduce energy consumption further.
However, osmosis-based systems provide increased efficiencies when employed at higher than ambient operating temperature. Thus, it is advantageous to provide efficient heat transfer technology to such systems in order to increase their performance. Since most desalination plants operate in areas with significant waste heat sources that are readily available, many such plants make use of heat exchangers to re-utilize such waste heat sources. However, heat exchangers operate on the basis of thermal conductivity, in which a hot fluid transfers heat energy across a metal plate to a lower-temperature fluid. Accordingly, conventional heat exchangers are characterized by requiring substantial surface area and comparatively large temperature differentials between the hot and cool fluids of many degrees. There is a need for improved heat transfer devices that can operate with lower temperature differentials and that make use of waste heat sources for desalination.
Embodiments of the present invention provide an improved method for transferring heat efficiently in a number of industrial applications, including desalination of saline aqueous solutions using either osmosis-based technologies, thermal distillation systems, membrane distillation systems, electro-oxidation, or electro-dialysis systems. The present invention provides embodiments that replace conventional heat exchangers, including thin film evaporators, by advanced heat pipes that are characterized by very thin walls of less than 1-2 millimeters and superior wick materials that provide for minimal temperature differentials and uncommonly high heat transfer coefficients.
Some embodiments of the invention provide a heat management system including heat pipes, thermosiphons, or advanced heat pipes that replaces conventional heat exchangers, including thin-film evaporators, that effect heat transfer in distillation systems that operate above ambient temperature and that can transfer heat at temperatures in the range of 20 C to 800 C from a variety of heat sources.
Some embodiments of the invention provide a heat management system in which the distillation system can be MED, MSF, vapor compression, membrane distillation, electro-oxidation, or electro-dialysis systems, or the like.
Some embodiments of the invention provide a heat management system in which heat pipes, thermosiphons, or advanced heat pipes can replace conventional heat exchangers in forward and reverse osmosis systems, or the like.
Conventional heat pipes are normally manufactured from commercial metal tubes that have wall thicknesses commonly in the range of 1/16″ to ¼″. Advanced heat pipes rely on metal screen scaffolds for mechanical integrity and can have wall thicknesses of less than 1-2 millimeters, and occasionally as low as a fraction of a millimeter, thus greatly enhancing the thermal conductivity of the encapsulating material. The heat pipes can have a wall thickness of about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, millimeters or more. Likewise, conventional wicks can include grooves, metal screens, and sintered metal particles with good open porosity. Metal sintered wicks can include microspheres of metal (e.g., copper, steel, titanium, or various metal alloys, or the like) that are a few microns or, in special cases, submicron in size and that have been sintered together. The microspheres of metal can be about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.5, 4.0, 4.5, 5.0 microns or more. While such wick materials can assist in the phase change of the internal working fluid, they can also represent a thermal barrier to heat transfer. Superior wick materials can include grooves, screens, and sintered metals of smaller pore size, of the order of 60 nanometers to several hundreds of nanometers (for example, about 60, 75, 100, 125, 150, 175, 200, 225, 250, 275, 300, 325, 350, 375, 400 nanometers, or more), and thinner overall thickness, of the order of several microns (for example, about 1, 1.2, 1.4, 1.6, 1.8, 2.0, 2.2, 2.4, 2.6, 2.8, 3.0, 3.2, 3.4, 3.6, 3.8, 4.0 microns, or more). Alternatively, superior wick materials can include porous materials that can be placed axially along the center of the heat pipe, so as not to contribute to a barrier to heat transfer.
Embodiments of the invention are disclosed herein, in some cases in exemplary form or by reference to one or more Figures. However, any such disclosure of a particular embodiment is exemplary only, and is not necessarily indicative of the full scope of the invention.
Thermal distillation systems, such as MED, use horizontal thin film evaporating tubes to transfer and re-use thermal energy. However, such systems suffer from several operating problems such as dry-spots that cause local crystallization of salts, thermal inefficiencies caused by the condensation of liquid inside the horizontal tube, and temperature losses caused by the progressive vapor condensation inside the horizontal tube. There is a need for heat transfer devices that overcome these problems.
Membrane distillation systems rely on the increase in vapor pressure caused by the curvature of very small menisci at the liquid/vapor interface. Higher temperatures in the feedwater liquid naturally can increase the vapor pressure at the interface, thus rendering the system more thermally efficient. While there can be multiple ways of increasing the temperature of a system, heat pipes can be most efficient at transferring heat energy and, thus, can be used to increase the overall efficiency of such distillation systems.
Electro-oxidation systems operate by oxidizing dissolved contaminants by means of charged electrodes. Again, higher temperatures in the liquid phase can increase the kinetic energy of molecules in the liquid, thus can improve the electrical performance of the electrodes and heat pipes can be an optimal way of providing the additional heat energy required.
In dialysis, particularly in electro-dialysis, the diffusion of impurities across a semi-permeable membrane is enhanced by an electromagnetic potential. As in other liquid systems, higher temperature can markedly increase molecular and ionic diffusion. Heat pipes can be well suited to provide the necessary heat energy.
An important advantage of the present invention described herein is the heat transfer mechanism by using heat pipes. As described in the present application, heat pipes can provide a means of transferring heat that is near thermodynamically reversible, that is, a system that transfers enthalpy with almost no losses in efficiency.
In some embodiments, the system for heat transfer, embodiments of which are disclosed herein, can be combined with other systems and devices to provide further beneficial features. For example, the system can be used in conjunction with any of the devices or methods disclosed in U.S. Provisional Patent Application No. 60/676,870, entitled SOLAR ALIGNMENT DEVICE, filed May 2, 2005; U.S. Provisional Patent Application No. 60/697,104, entitled VISUAL WATER FLOW INDICATOR, filed Jul. 6, 2005; U.S. Provisional Patent Application No. 60/697,106, entitled APPARATUS FOR RESTORING THE MINERAL CONTENT OF DRINKING WATER, filed Jul. 6, 2005; U.S. Provisional Patent Application No. 60/697,107, entitled IMPROVED CYCLONE DEMISTER, filed Jul. 6, 2005; PCT Application No: US2004/039993, entitled AN IMPROVED SELF-CLEANING WATER PROCESSING APPARATUS, filed Dec. 1, 2004; PCT Application No: US2004/039991, entitled FULLY AUTOMATED WATER PROCESSING CONTROL SYSTEM, filed Dec. 1, 2004; PCT Application No: US2006/040103, entitled WATER PURIFICATION SYSTEM, filed Oct. 13, 2006; U.S. patent application Ser. No. 12/281,608, entitled CONTAMINANT PREVENTION, filed Sep. 3, 2008; PCT Application No. US2008/03744, entitled WATER PURIFICATION SYSTEM, filed Mar. 21, 2008; U.S. Provisional Patent Application No. 60/526,580, entitled SELF-CLEANING WATER PROCESSING APPARATUS, filed Dec. 2, 2003; U.S. Provisional Patent Application No. 61/532,766 of Sylvan Source, Inc., entitled INDUSTRIAL WATER PURIFICATION AND DESALINATION, filed Sep. 9, 2011; PCT Application No: US2013/51730, entitled EFFECTIVE DEWATERING FOR BIOFUEL PRODUCTION, filed on Jul. 23, 2013; U.S. Provisional Patent Application No. 62/041,556, entitled ENERGY EFFICIENT EOR, filed on Aug. 25, 2014; U.S. Provisional Patent Application No. 62/087,122, entitled ENERGY EFFICIENT WATER PURIFICATION AND DESALINATION, filed on Dec. 3, 2014; and U.S. Pat. No. 8,771,477, entitled LARGE-SCALE WATER PURIFICATION AND DESALINATION, filed on Jun. 1, 2011 each of the foregoing applications and patent is hereby incorporated by reference in its entirety.
A common problem with any thermal transfer based on thermal conductivity is that the rate of heat flow across a thermally conductive material is rather slow, which requires fairly large surface areas, which directly influences the cost of a device. Another problem with conventional thermal transfer that relies on conductivity is that as a fluid transfers heat it necessarily cools down, thereby reducing the temperature differential across the material that transfers heat. Thus, both the surface area and the temperature differential which directly affect heat transfer are influenced by the mechanism that relies solely on thermal conductivity. In contrast, a heat pipe transfers heat primarily through phase change and the mass transfer of the working fluid that has been volatilized. As a result, conventional heat pipes can exhibit thermal conductivities of about one thousand times greater than silver metal (“Heat Pipes or Heat Exchangers”. Ivan Catton, UCLA, Sep. 12, 2014), and advanced heat pipes can have conductivities of nearly 30,000 time that of silver (“Thermal Property Analysis of the Qu Supertube”. Michael McKubre, SRI International, July 1999).
In addition, since heat exchangers intentionally establish direct contact between fluids and metal pieces, they can become fouled, whereas heat pipes, being sealed tubes, can protect the inner working fluid from scaling up or fouling, and their outer surfaces can be smooth and easy to clean.
The horizontal tube effectiveness in lower parts of the bundle can be impacted by the thin film arriving from above, as illustrated in
Few, if any, of the above problems are encountered if the horizontal thin-film tubes of an MED are replaced by heat pipes, as illustrated in
There can be barriers to heat transfer in both heat pipes and conventional thin-film heat exchangers. One of the most important barriers is the thermal resistance at the interface between the heat pipe surface layer and the evaporator chamber fluid phase, which is commonly known as the “double layer.” This double layer is composed of molecules that are more concentrated and ordered than in the bulk of the fluid phase, and results from a combination of electrostatic forces and ionic concentration. Consequently, the strength of this barrier decreases with salinity. Conventional thin-film heat exchangers can be limited in their ability to operate at high salinities because of fouling and hot spots, while heat pipes can operate at salinities exceeding 200,000 parts per million because of nucleate pool boiling. Thus, for salinity ranges and concentration ratios normally encountered in industrial practice, this barrier can become fairly minor when using heat pipes but remains significant for thin-film heat exchangers.
Heat pipes can be manufactured in sizes from microns to meters while being tailored to meet the heat transfer requirements. There are examples of thermosyphons in the range of 2 cm and up to 100 meters long. For example, thermosyphones can be about 2 cm, 50 cm, 100 cm, 500 cm, 750 cm, 1 meter, 25 meters, 50 meters, 75 meters or 100 meters. The ability to remove or add heat pipes to an operational exchanger allows the system to be fine-tuned to ensure optimum heat recovery. Similarly, pulsating heat pipes are designed for long-distance heat transfer, in the range of a few meters and up to thousands of meters; they normally operate without internal wicks and have optional internal valves that ensure flow in only one direction. The heat pipes can be about 2, 10, 50, 100, 200, 250, 500, 750, 1000, 2000, 3000, 4000, 5000 meters or more. Advanced heat pipes can include centrally located axial wicks, ultra-thin metallic foils (with wall thickness below 1 min) that can optimize heat transfer and that can be wrapped around metal screens for structural strength. Metal screens can be chemically compatible with the working fluid, and the metals for such screens can include copper, steel, titanium, and other base metals and their alloys, or the like. These features are entirely unique to heat pipe recovery units.
Having no moving mechanical parts in a heat pipe yields a device that has exceptionally high reliability. There are many reliable material and fluid combinations that can be used without fouling or degradation over time; such as copper/water heat pipes. This is one of the most common combinations, as are aluminum/ammonia and ammonia/steel. Each individual heat pipe can operate independently, hence a single pipe failure will not incapacitate the system. Failed heat pipes can be replaced at the next scheduled maintenance event. The independent operation of a heat pipe system also can mean zero cross contamination between the pipes.
Heat can be used in forward osmosis in two separate ways. First, the osmosis rate of diffusion across the semi-permeable membrane can accelerate with temperatures higher than ambient. Second, distillation and some forms of precipitation require heat and, therefore, being able to use low-temperature forms of heat energy can become a significant economic advantage. The key concept here is the ability to use heat pipes in configurations similar to those illustrated in
The invention illustratively described herein suitably can be practiced in the absence of any element or elements, limitation or limitations which are not specifically disclosed herein. The terms and expressions which have been employed are used as terms of description and not of limitation, and there is no intention that in the use of such terms and expressions indicates the exclusion of equivalents of the features shown and described or portions thereof. It is recognized that various modifications are possible within the scope of the invention disclosed. Thus, it should be understood that although the present invention has been specifically disclosed by preferred embodiments and optional features, modification and variation of the concepts herein disclosed may be resorted to by those skilled in the art, and that such modifications and variations are considered to be within the scope of this invention as defined by the disclosure.
Those skilled in the art recognize that the aspects and embodiments of the invention set forth herein can be practiced separate from each other or in conjunction with each other. Therefore, combinations of separate embodiments are within the scope of the invention as disclosed herein.
All patents and publications are herein incorporated by reference to the same extent as if each individual publication was specifically and individually indicated to be incorporated by reference.
(00021 This application claims priority to U.S. Provisional Patent Application No. 62/126,991, filed Mar. 2, 2015; the entire disclosure thereof is incorporated herein by reference.
Number | Date | Country | |
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62126991 | Mar 2015 | US |
Number | Date | Country | |
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Parent | 15554824 | Aug 2017 | US |
Child | 17315327 | US |