| Number | Name | Date | Kind |
|---|---|---|---|
| 3629787 | Wilson | Dec 1971 | |
| 3805213 | Austin | Apr 1974 | |
| 4092057 | Walton | May 1978 | |
| 4154977 | Verma | May 1979 | |
| 4213028 | Wolf | Jul 1980 | |
| 4251712 | Parr | Feb 1981 | |
| 4509098 | Das Gupta et al. | Apr 1985 | |
| 4517559 | Deitch et al. | May 1985 | |
| 4591710 | Komadina et al. | May 1986 | |
| 4626830 | Noens et al. | Dec 1986 | |
| 4677252 | Takahashi et al. | Jun 1987 | |
| 4689446 | Hasegawa et al. | Aug 1987 |
| Number | Date | Country |
|---|---|---|
| 0097414 | Apr 1984 | EPX |
| 1601000 | Oct 1981 | GBX |
| Entry |
|---|
| IBM Technical Disclosure Bulletin, vol. 4, No. 3, Aug. 1961, "Preparing Molded Circuits", by D. A. Radovsky. |