Claims
- 1. A caulking or sealant composition comprising:
- a) a polymeric dispersion which is at least 75 wt. % polymer particles in a medium comprising water, wherein the polymer particles have a particle size distribution having particles of diameter of 4.0 microns or more, and wherein the particles of diameter of 4.0 microns or more have nonspherical shape such that they have an average aspect ratio between largest and smallest diameter of each particle of at least 1.5, and
- wherein said particles of said dispersion are comprised of at least 50 wt. % repeat units from one or more acrylate and/or vinyl acetate monomers.
- 2. The caulking or sealant composition according to claim 1, wherein the polymer particles are at least 80 wt. % of said polymeric dispersions, wherein the particles of diameters of 4.0 microns or more are at least 30 wt. % of said polymeric dispersion and wherein said dispersion includes at least 10 wt. % particles of diameters of less than 4 microns.
- 3. The caulking or sealant composition according to claim 2, wherein the extrudability of said composition by ASTM D2452 at 20 psi with a 0.104" orifice is less than 400 seconds at 25.degree. C.
- 4. The caulking or sealant composition according to claim 3, wherein said polymer particles are at least 70 wt. % acrylate repeat units from acrylate monomers of the structure ##STR1## where R.sub.1 is H or CH.sub.3 and R.sub.2 is an alkyl of 1 to 13 carbon atoms.
- 5. A caulking or sealant composition comprising:
- an aqueous dispersion being at least 75 wt. % discrete polymer particles polymerized from monomers being at least 50 wt. % of one or more acrylate monomers having from 4 to 16 carbon atoms and/or vinyl acetate, said dispersion having a particle size distribution, said particle size distribution having at least one mode in the particle size distribution between 0.05 .mu.m and 0.7 .mu.m and at least another mode between 0.7 .mu.m and 100 .mu.m, and wherein the particle size distribution has at least 20 wt. % of particles greater than 1 .mu.m in diameter.
- 6. The caulking or sealant composition according to claim 5, wherein said composition includes a mildewcide or fungicide and is packaged in cartridges.
- 7. The caulking or sealant composition according to claim 6, wherein said composition further comprises mineral oil.
- 8. The caulking or sealant composition according to claim 1, wherein said composition further comprises ethylene glycol or propylene glycol or mixtures thereof.
- 9. The caulking or sealant composition according to claim 7, wherein said composition further comprises ethylene glycol or propylene glycol or mixtures thereof.
- 10. A caulking or sealant composition according to claim 5, wherein said particle size distribution has at least one mode between 0.7 and 4 .mu.m diameter, and at least one mode between 4 and 100 .mu.m diameter, and wherein said particle size distribution has at least 20 wt. % of particles above 1 .mu.m in diameter and at least 15 weight % of particles above 4 .mu.m in diameter.
- 11. An adhesive composition comprising:
- a. one part of a high solids dispersion of polymer particles, said polymer dispersion comprising an aqueous dispersion being at least 77 wt. % discrete polymer particles polymerized from monomers comprising at least 50 wt. % acrylate monomers having 4 to 16 carbon atoms and/or vinyl acetate, said dispersion having a particle size distribution comprising a first mode and a second mode, wherein said first and second modes are selected from the group consisting of: a first mode having particles of diameter between 0.05 .mu.m to 4 .mu.m and a second mode having particles of diameter between above 4 .mu.m to 100 .mu.m; a first mode having particles of diameter between 0.05 .mu.m and 0.7 .mu.m and a second mode having particles of diameter between above 0.7 .mu.m and 100 .mu.m; and a first mode having particles of diameter less than 1 .mu.m and said second mode having particles of diameter greater than 1 .mu.m; and
- b. from about 0.1 to about 9.5 parts of water.
- 12. The adhesive composition according to claim 11, wherein the first mode has particles of diameters from about 0.05 .mu.m to 4 .mu.m and the second mode has particles of diameters from above about 4 .mu.m to 100 .mu.m.
- 13. The adhesive composition according to claim 11, wherein the first mode has particles of diameters between about 0.05 .mu.m and 0.7 .mu.m and the second mode has particles of diameters from about 0.7 .mu.m to 100 .mu.m, and wherein said particle size distribution has at least 20 weight percent of particles greater than about 1 .mu.m in diameter.
- 14. The adhesive composition according to claim 11, wherein the first mode has particles of diameters less than 1 .mu.m and the second mode has particles of diameters greater than 1 .mu.m, and wherein said high solids polymer dispersion comprises at least 80 wt. % discrete polymer particles polymerized from unsaturated monomers comprising at least 50 wt. % acrylate monomers having 4 to 16 carbon atoms and/or vinyl acetate.
- 15. The adhesive composition according to claim 11, wherein the peak of the first mode is centered at particles of diameters from about 0.4 .mu.m to 0.7 .mu.m and the peak of the second mode is centered at particles of diameters from about 2 .mu.m to 4 .mu.m, and wherein said high solids polymer dispersion comprises at least 79 wt. % discrete polymer particles polymerized from unsaturated monomers comprising at least 50 wt. % acrylate monomers having 4 to 16 carbon atoms and/or vinyl acetate.
- 16. A method for adhering one substrate to another comprising the steps of:
- a. providing an adhesive, said adhesive comprising one part of a high solids dispersion of polymer particles, said polymer dispersion comprising an aqueous dispersion being at least 77 wt. % discrete polymer particles polymerized from monomers comprising at least 50 wt. % acrylate monomers having 4 to 16 carbon atoms and/or vinyl acetate, said dispersion having a particle size distribution comprising a first mode and a second mode, wherein said first and second modes are selected from the group consisting of: a first mode having particles of diameter between 0.05 .mu.m to 4 .mu.m and a second mode having particles of diameter between above 4 .mu.m to 100 .mu.m; a first mode having particles of diameter between 0.05 .mu.m and 0.7 .mu.m and a second mode having particles of diameter between above 0.7 .mu.m and 100 .mu.m; and a first mode having particles of diameter less than 1 .mu.m and a second mode having particles of diameter greater than 1 .mu.m; and from about 0.1 to about 9.5 parts of water;
- b. providing a first substrate, said first substrate having an application surface;
- c. providing a second substrate, said second substrate having an attachment surface;
- d. applying said adhesive to said application surface of said first substrate;
- e. then drying said adhesive; and
- f. then positioning said attachment surface of said second substrate on the dried adhesive.
- 17. The method according to claim 16, wherein the first mode has particles of diameters from about 0.05 .mu.m to 4 .mu.m and the second mode has particles of diameters from above about 4 .mu.m to 100 .mu.m.
- 18. The method according to claim 16, wherein the first mode has particles of diameters between about 0.05 .mu.m to 0.7 .mu.m and the second mode has particles of diameters from about 0.7 .mu.m to 100 .mu.m, and wherein said particle size distribution has at least 20 weight percent of particles greater than about 1 .mu.m in diameter.
- 19. The method according to claim 16, wherein the first mode has particles of diameters less than 1 .mu.m and the second mode has particles of diameters greater than 1 .mu.m, and wherein, said high solids polymer dispersion comprises at least 80 weight percent discrete polymer particles polymerized from unsaturated monomers comprising at least 50 weight percent acrylate monomers having 4 to 16 carbon atoms and/or vinyl acetate.
- 20. The method of claims 16 further comprising the step of applying pressure to said second substrate or said first substrate after step f.
- 21. The method of claim 16 wherein said first substrate and said second substrate comprise paper.
- 22. A self-adhering repositionable material comprising:
- a. a substrate;
- b. a dried adhesive film disposed on said substrate, said dried adhesive film comprising discrete polymer particles polymerized from monomers comprising at least 50 wt. % acrylate monomers having 4 to 16 carbon atoms and/or vinyl acetate, said polymer particles having a particle size distribution comprising a first mode and a second mode, wherein said first and second modes are selected from the group consisting of: a first mode having particles of diameter between 0.05 .mu.m to 4 .mu.m and a second mode having particles of diameter between above 4 .mu.m to 100 .mu.m; a first mode having particles of diameter between 0.05 .mu.m and 0.7 .mu.m and a second mode having particles of diameter between above 0.7 .mu.m and 100 .mu.m; and a first mode having particles of diameter less than 1 .mu.m and a second mode having particles of diameter greater than 1 .mu.m.
- 23. The self adhering repositionable material according to claim 22, wherein the first mode has particles of diameters from about 0.05 .mu.m to 4 .mu.m and the second mode has particles of diameters from above about 4 .mu.m to 100 .mu.m.
- 24. The self adhering repositionable material according to claim 22, wherein the first mode has particles of diameters between about 0.05 .mu.m to 0.7 .mu.m and the second mode has particles of diameters from about 0.7 .mu.m to 100 .mu.m, and wherein said particle size distribution has at least 20 weight percent of particles greater than about 1 .mu.m in diameter.
- 25. The self adhering repositionable material according to claim 22, wherein the first mode has particles of diameters less than 1 .mu.m and the second mode has particles of diameters greater than 1 .mu.m, and wherein said high solids polymer dispersion comprises at least 80 weight percent discrete polymer particles polymerized from unsaturated monomers comprising at least 50 weight percent acrylate monomers having 4 to 16 carbon atoms and/or vinyl acetate.
- 26. The self adhering repositionable material according to claim 22, wherein said substrate comprises paper.
- 27. The self adhering repositionable material according to claim 22, wherein said dried adhesive film contains less than about 5 wt. % water.
Parent Case Info
This application is a continuation-in-part of U.S. application Ser. No. 08/690,288, filed Jul. 26, 1996, for "High Solids Copolymer Dispersion From a Latex and its Use in Sealants," and now U.S. Pat. No. 5,744,544 and which is a continuation-in-part of U.S. application Ser. No. 08/321,288, filed Oct. 11, 1994, for "High Solids Copolymer Dispersion From a Latex and its Use in Sealants," which issued as U.S. Pat. No. 5,541,253 on Jul. 30, 1996.
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Continuation in Parts (2)
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690288 |
Jul 1996 |
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321288 |
Oct 1994 |
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