Claims
- 1. A composite target material suitable for ablative deposition of a Cu-containing MgO layer upon a target substrate, said composite target material comprising: an intimate blend of MgO and CuO, said ratio of CuO:MgO being from about 0.01:100 to about 15:100 by weight.
- 2. The composite target material of claim 1 wherein said ratio is from about 0.05:100 to about 10:100 by weight.
- 3. The composite target material of claim 1 wherein said ratio is from about 0.1:100 to about 5:100 by weight.
- 4. The composite target material of claim 1 wherein said ratio is about 5:100 by weight.
- 5. A composite target material suitable for ablative deposition of a Cu-containing (Sr1−x−yBaxCay)TiO3 layer upon a target substrate comprising: an intimate blend of CuO, TiO2, and one or more oxides selected from the group consisting of SrO, BaO and CaO, said ratio of CuO:SrO, BaO and CaO and TiO2 being from about 0.01:100 to about 15:100 by mole percent.
- 6. The composite target material of claim 4 wherein said ratio is from about 0.05:100 to about 10:100 by weight.
- 7. The composite target material of claim 4 wherein said ratio is from about 0.1:100 to about 5:100 by weight.
- 8. The composite target material of claim 4 wherein said ratio is about 5:100 by weight.
- 9-16 (cancelled).
- 17. A superconducting structure comprising:
a substrate; at least one intermediate layer upon said substrate; and, a copper-containing superconducting layer upon at least one intermediate layer, wherein at least one intermediate layer is a copper-containing MgO layer whereby said copper within said MgO layer does not adversely affect intermediate layer structure while reducing migration of copper from said copper-containing superconducting layer into said MgO layer.
- 18. A superconducting structure comprising:
a substrate; at least one intermediate layer upon said substrate; and, a copper-containing superconducting layer upon at least one intermediate layer, wherein at least one intermediate layer is a copper-containing SrTiO3 layer whereby said copper within said SrTiO3 layer does not adversely affect intermediate layer structure while reducing migration of copper from said copper-containing superconducting layer into said SrTiO3 layer.
Parent Case Info
[0001] This application claims the benefit of provisional application S. No. 60/333,917 filed Nov. 21, 2001.
Government Interests
[0002] This invention is the result of a contract with the United States Department of Energy (Contract No. W-7405-ENG-36).
Provisional Applications (1)
|
Number |
Date |
Country |
|
60333917 |
Nov 2001 |
US |
Divisions (1)
|
Number |
Date |
Country |
Parent |
10113475 |
Mar 2002 |
US |
Child |
10819530 |
Apr 2004 |
US |