Number | Date | Country | Kind |
---|---|---|---|
6-020538 | Feb 1994 | JPX | |
6-293944 | Nov 1994 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
4221033 | Tobayashi | Sep 1980 | |
4771363 | Kellerman | Sep 1988 | |
4931899 | Pruett | Jun 1990 |
Number | Date | Country |
---|---|---|
655166 | Dec 1966 | DEX |
3546425 | Jul 1987 | DEX |
Entry |
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Ziarno, G.: Silikone fur das Einbetten und Umhullen electronischer Bauelemente [Silicone for Embedding and Encasing Electronic Components]: Electronik, 1968, No. 2, pp. 33-36. |
Heitz, E.: Einbettmassen mit geringer Dichte fur elektronische Bauteile [Embedding Materials with Low Density for Electronic Components]. In: Electronik Industrie 1972, No. 5/6, pp. EP 41-EP 45. |