The disclosure relates generally to material dispensing systems, and more particularly to the application and detection of dispensed materials, for example, hot melt adhesives deposited on substrates, methods and systems therefor.
The non-contact detection of beads of hot adhesives on moving conveyors using infrared sensors that detect temperature differences between the adhesive and the substrate is known generally.
U.S. Pat. No. 4,831,258 entitled “Dual Sensor Radiation Detector” discloses, for example, a glue bead detection system comprising a dual sensor housing two thermopiles that detect an adhesive target and the moving conveyor temperatures, respectively, through a common lens. The thermopile outputs are coupled to an LED bar graph display that changes with changes between the temperatures of the adhesive target and the moving conveyor. A dynamic bar graph is indicative of intermittent adhesive beads, and a relatively constant bar graph is indicative of a relatively continuous adhesive bead.
In order to precisely detect the beginnings and ends of adhesive beads and other thermal materials, the sensor must be equipped with an optical focusing device, like the common lens in U.S. Pat. No. 4,831,258, but this limits the area that may be monitored by the sensor.
An object of the disclosure is to provide novel thermal detection methods and systems.
Another object of the disclosure is to provide thermal detection methods and systems that improve upon the art.
In one embodiment, the disclosure is drawn to a method in hot melt adhesive detection systems comprising generally detecting at least two separate areas of a target, for example, a hot melt adhesive, by sensing changes in temperature with a corresponding number of thermal sensors of the detector arranged non-parallel to a direction of relative motion between the detector and the target, and summing an output of the at least two thermal sensors. In some embodiments, the summed output of the sensors maybe evaluated, for example, by comparing the summed output of the at least two thermal sensors with a reference.
In another embodiment, the disclosure is drawn to thermal sensing systems, for example, hot melt glue sensing systems, comprising at least two thermal sensors mounted in spaced apart relation, a signal summer having inputs coupled to outputs of the at least two thermal sensors, and a controller having an input coupled to an output of the signal summer, wherein the controller is programmed to sample and store the output of the summer in memory.
In yet another embodiment, the disclosure is drawn to thermal sensing systems, for example, hot melt glue sensing systems, comprising detecting a product, detecting hot melt glue disposed on the product while detecting the product, and comparing a period during which the product is detected with a period during which the hot melt glue is detected.
These and other objects, aspects, features and advantages of the disclosure will become more fully apparent upon careful consideration of the following Detailed Description of the Disclosure and the accompanying Drawings, which may be disproportionate for ease of understanding, wherein like structure and steps are referenced generally by corresponding numerals and indicators.
In one embodiment of the disclosure, the thermal sensing system comprises generally a plurality of at least two thermal sensors mounted in or on a mounting member, for example, one positionable relative to the target to be detected thereby. The plurality of sensors are preferably oriented non-parallel to a direction of relative motion between the sensors and the target. These and other aspects of the disclosure are discussed more fully below. The number of sensors depends generally upon the width of the detected target.
In one embodiment suitable for detecting hot melt adhesives and other applications, the thermal sensors are infrared-heat detecting sensors. The TH Series of infrared thermal sensors, for example, Part Number TH-11, by SUNX Sensors USA, West Des Moines, Iowa 50265 are especially well suited for hot melt glue sensing applications. The TH-11 series hot melt glue sensor includes a controller that stores pre-set programmed settings for different applications and produces a red alignment spot on the target to facilitate alignment and focused detection. Other specialty sensors, a variety of which are available from SUNX Sensors USA and other manufacturers, may be better suited for applications other than hot melt adhesive detection.
Although the exemplary plurality of thermal sensors comprise discrete sensors, other embodiments may employ a single sensor capable of detecting more than one location and producing corresponding outputs, which may be summed together as discussed further below. Such a unitary sensor with multiple sensors inputs and corresponding outputs is considered, at least for the present disclosure, to be equivalent to multiple discrete sensors of the exemplary type.
In
In the exemplary embodiment of
In
In
The micro-controller is coupled to memory 150, including read-only memory (ROM) and possibly programmable ROM (PROM) and RAM for storing data. In some embodiments the controller is coupled to a display device 160, for example, a liquid crystal (LCD) display or a cathode ray tube (CRT). In this exemplary embodiment, the controller is programmed, for example, by an application program stored in ROM or in a PROM, to sample the digitized output of the summer 120 and store the sampled summer output data in memory. Those having ordinary skill in the art will appreciate that the exemplary digital implementation herein has analog equivalents.
In some embodiments, it is desirable initially to detect the presence of the product or target to be detected by the thermal sensors. In
The exemplary system of
In some embodiments, detection of the product leading edge may be used to initiate the thermal sensing operation, which is discussed further below. Detection of the trailing edge of the product may be used to terminate the thermal sensing operation. In
In some embodiments, the product leading edge detection event may be stored in memory for use as a reference, for example, relative to the product trailing detection event. Use of encoder outputs that track the movement of the product may be used with the leading and trailing edge detection events to compute the length of the product. The measured product length may then be compared with a known product length. The computed product length may also be compared with outputs of the thermal sensors to determine whether the product has been covered adequately by the target material.
In one mode of operation, at least two adjacent areas of the target are detected by the plurality of thermal sensors. As noted above, broader areas may be detected by using additional sensors, or pairs of sensors. In the exemplary embodiment, at least two separate areas of the adhesive material are detected by sensing changes in temperature with a corresponding number of thermal sensors arranged non-parallel to a direction of relative motion between the detector and the adhesive material. The thermal sensors generally detect the target material, for example, the hot melt adhesive of
In
In some embodiments, it is desirable to sample the summed output at a rate dependent on the relative motion between the detector and the adhesive material, thus sampling the summation of the sensor outputs at regular distance intervals along the target. In one embodiment, illustrated in
In
Upon establishing the reference, the sampled summer output data are compared relative to the reference by counting how many readings are above or below the reference, for example, on a per unit length basis, and then assessing the compared results relative to a tolerance, which may also be determined empirically. In the exemplary embodiment, the comparison is controlled by a comparison program segment, stored in memory, that compares stored samples of the summation of at least two thermal sensor signals with a stored reference.
In one embodiment, the reference is determined by operating in a teach mode. In teach mode, upon establishing stable thermal sensor readings, the controller successively adjusts the gain of the summer signal output to optimize the span of temperature readings. The gain of the summer output may also be adjusted in teach mode to adapt to different target conditions, for example, different temperature output ranges or adhesive glue thickness. For this adjustment, the controller increases or decreases the amplifier gain based on the maximum temperature readings, thus shifting the range of readings to a more optimal range, for example, to better differentiate the temperature readings from noise.
In
In the exemplary embodiments, all amplitude data points of the summed thermal signal outputs are not stored. Instead the summed signal is sampled and stored for comparison with the corresponding references. In one embodiment, a tolerance establishes the acceptable number of signal samplings that may not exceed the reference on a per unit length basis. In hot melt glue applications, the results of the sensor signal evaluation may be used to determine whether an adequate amount of glue has been deposited. In the exemplary digital implementation, a tolerance program segment stored in memory compares the results of the comparison program segment with a user specified tolerance.
In one embodiment, a product on which the target is disposed is detected, for example, with a photo-detector that detects the leading and trailing edges thereof, and detecting a hot melt glue, or other target, disposed on the product is also detected while detecting the product. It may be determined with the hot melt glue completely coats the product by comparing a period during which the product is detected with a period during which the hot melt glue is detected. Additional information may be obtained about the application of the adhesive on the product by also using the encoder, for example, which portions of the product are coated with adhesive and which one are not.
While the foregoing written description of the disclosure enables one of ordinary skill to make and use what are considered presently to be the best modes thereof, those of ordinary skill will understand and appreciate the existence of variations, combinations, and equivalents of the specific exemplary embodiments herein. The disclosure is therefore to be limited not by the exemplary embodiments herein, but by all embodiments within the scope and spirit of the appended claims.
The present application is a division of co-pending U.S. application Ser. No. 10/254,316 filed on 25 Sep. 2002, which is assigned commonly with the instant application and incorporated by reference herein, and from which benefits are hereby claimed under 35 U.S.C. § 120.
Number | Name | Date | Kind |
---|---|---|---|
3100097 | Woltersdorf | Aug 1963 | A |
3462602 | Apple | Aug 1969 | A |
3539807 | Bickel | Nov 1970 | A |
3667846 | Nater et al. | Jun 1972 | A |
3861458 | Ostrander et al. | Jan 1975 | A |
4044250 | Fetzer | Aug 1977 | A |
4109508 | Fukuyama | Aug 1978 | A |
4122720 | Podl | Oct 1978 | A |
4215939 | Miller | Aug 1980 | A |
4458152 | Bonora | Jul 1984 | A |
4626389 | Lempfer et al. | Dec 1986 | A |
4704603 | Edwards et al. | Nov 1987 | A |
4831258 | Paulk et al. | May 1989 | A |
4967083 | Kornbrekke et al. | Oct 1990 | A |
5020473 | Bergman | Jun 1991 | A |
5186541 | Paulk | Feb 1993 | A |
5220169 | Ninomiya et al. | Jun 1993 | A |
5319202 | Pompei | Jun 1994 | A |
5323005 | Merkel | Jun 1994 | A |
5438233 | Boland et al. | Aug 1995 | A |
5444248 | Ichien | Aug 1995 | A |
5582663 | Matsunaga | Dec 1996 | A |
5663565 | Taylor | Sep 1997 | A |
5717485 | Ito et al. | Feb 1998 | A |
5839829 | Litvin et al. | Nov 1998 | A |
5894126 | Pompei et al. | Apr 1999 | A |
5915295 | Lauderbaugh | Jun 1999 | A |
6122420 | Satoh | Sep 2000 | A |
6196714 | Bellifemine | Mar 2001 | B1 |
6452180 | Nistler et al. | Sep 2002 | B1 |
6854496 | Ishibuchi et al. | Feb 2005 | B1 |
20020148567 | Bett et al. | Oct 2002 | A1 |
20020166970 | Komulainen et al. | Nov 2002 | A1 |
20030036047 | Okubo | Feb 2003 | A1 |
20040052297 | McDonald et al. | Mar 2004 | A1 |
20040083958 | Saidman et al. | May 2004 | A1 |
20040089811 | Lewis et al. | May 2004 | A1 |
20040252747 | Garvelink et al. | Dec 2004 | A1 |
Number | Date | Country |
---|---|---|
4304343 | Aug 1994 | DE |
19750862 | Jun 1998 | DE |
0373332 | Oct 1988 | EP |
0852333 | Jul 1998 | EP |
906729 | Apr 1999 | EP |
10101028 | Apr 1998 | JP |
10119933 | May 1998 | JP |
9401796 | Jun 1996 | NL |
9634273 | Oct 1996 | WO |
Number | Date | Country | |
---|---|---|---|
20050074050 A1 | Apr 2005 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10254316 | Sep 2002 | US |
Child | 10994895 | US |