1. Technical Field
The present disclosure relates to housings of electronic devices and a method for making the same.
2. Description of the Related Art
Patterns on housings of electronic devices may be formed by printing or painting. However, these patterns cannot strongly bond to the surface of the housing, and can easily be worn or scraped off.
Therefore, there is room for improvement within the art.
Many aspects of the present housing of electronic device and method for making the same can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
A method to fabricate the housing 10 includes following steps,
Step 1, referring to
Step 2, referring to
Step 3 is to enamel the grooves 112. The enamel may be applied in two steps, glazing then baking. During glazing, the enamel glaze may comprise inorganic silicate and is electrically conductive. The glaze is evenly arranged on the bottom of the grooves 112, and then the base 11 is placed in an electrical field, causing the base 11 and the glaze to be oppositely charged and thereby form a bond. The thickness of the glaze can be adjusted by adjusting the intensity of the electrical field. During baking, the base 11 is placed into an oven and heated, and the glaze is melted evenly, and firmly combined in the grooves 112. When the glaze melts, it may overflow from the grooves 112 and form a protrusion layer 13 (shown in
Step 4 is to grind and remove the protrusion layer 13 cleanly exposing the pattern portion 12. A typical grinding wheel mechanism can be used to grind the protrusion layer 13. The grinding process includes a preliminary grinding and a detailed grinding. The preliminary grinding is to remove the protrusion layer 13 and expose the pattern portion 12. After the preliminary grinding, detailed grinding is done to ensure the surface of the pattern portion is on the same plane as the surrounding surfaces, and to smooth over any rough tracks left by the preliminary grinding.
Step 5 is to polish the area of the pattern portion 12. During polishing, a polishing material and a polishing solution are used, the polishing material can be a cerium oxide, and the polishing solution mainly be comprised of silicon dioxide and H2O, with the silicon dioxide having a weight percentage 25% and the H2O having a weight percentage 75%.
Step 6 can be implemented by sand blasting to roughen areas near the pattern portion 12, to contrast with the pattern portion 12 so that it stands out more for aesthetic reasons if needed. Thus, the housing 10 is fabricated.
It is to be understood that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of assemblies and functions of various embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
---|---|---|---|
201110058498.3 | Mar 2011 | CN | national |
This application is related to co-pending U.S. Patent Application (Attorney Docket No. US36895) entitled “HOUSING OF ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME”. Such application has the same assignee as the present application. The above-identified application is incorporated herein by reference.