Product Description Documents by Advanced Ceramics Corp. for the following products: TC1050 Encapsulated TPG; TC1050.ALY Aluminum Encapsulated TPG; TC1050.CFC Carbon FIber Composite encapsulated TPG; TC1050.KOV Kovar Encapsulated TPG; TC1050.CO Copper Encapsulated TPG; TC1050.MMC A1SiC Encapsulated TPG/ Jan. 1995. |
Product Overview Document for "TC1050 Thermal Management Material System" by Advanced Ceramics Corp. Dec., 1994. |
Preliminary Product Data for "High Thermal Conductivity Black-Ice .TM. Substrate Materials", Applied Sciences, Inc., Cedarville, Ohio Jan. 1995. |
ClimaxClad Copper-Molybdenum-Copper product brochure, Climax Specialty Materials, Cleveland, Ohio. Jan. 1990. |