This disclosure relates to illumination devices having light guides to distribute light, including illumination devices for displays, and to electromechanical systems.
Electromechanical systems (EMS) include devices having electrical and mechanical elements, actuators, transducers, sensors, optical components (for example, minors) and electronics. Electromechanical systems can be manufactured at a variety of scales including, but not limited to, microscales and nanoscales. For example, microelectromechanical systems (MEMS) devices can include structures having sizes ranging from about a micron to hundreds of microns or more. Nanoelectromechanical systems (NEMS) devices can include structures having sizes smaller than a micron including, for example, sizes smaller than several hundred nanometers. Electromechanical elements may be created using deposition, etching, lithography, and/or other micromachining processes that etch away parts of substrates and/or deposited material layers, or that add layers to form electrical and electromechanical devices.
One type of electromechanical systems device is called an interferometric modulator (IMOD). As used herein, the term interferometric modulator or interferometric light modulator refers to a device that selectively absorbs and/or reflects light using the principles of optical interference. In some implementations, an interferometric modulator may include a pair of conductive plates, one or both of which may be transparent and/or reflective, wholly or in part, and capable of relative motion upon application of an appropriate electrical signal. In an implementation, one plate may include a stationary layer deposited on a substrate and the other plate may include a reflective membrane separated from the stationary layer by an air gap. The position of one plate in relation to another can change the optical interference of light incident on the interferometric modulator. Interferometric modulator devices have a wide range of applications, and are anticipated to be used in improving existing products and creating new products, especially those with display capabilities.
Reflected ambient light is used to form images in some display devices, such as those using pixels formed by interferometric modulators. The perceived brightness of these displays depends upon the amount of light that is reflected towards a viewer. In low ambient light conditions, light from an artificial light source is used to illuminate the reflective pixels, which then reflect the light towards a viewer to generate an image. To meet market demands and design criteria, new illumination devices are continually being developed to meet the needs of display devices, including reflective and transmissive displays.
The systems, methods and devices of the disclosure each have several innovative aspects, no single one of which is solely responsible for the desirable attributes disclosed herein.
One innovative aspect of the subject matter described in this disclosure can be implemented in an illumination system. The illumination system includes a light guide having an optically transmissive supporting layer; and a light turning film on the supporting layer. The light turning film is depositable in the liquid phase on the supporting layer. A plurality of light turning features are formed in indentations on a major surface of the light turning film. The light turning film may be formed of a glass material. The glass may be a spin-on glass. The spin-on glass may be photodefinable in some implementations. In some implementations, the material forming the light turning film may be a photodefinable polymer.
Another innovative aspect of the subject matter described in this disclosure can be implemented in an illumination system. The illumination system includes a light guide, which includes an optically transmissive supporting layer; and a means for accommodating indentations for light turning features. The means for accommodating indentations is depositable in a liquid state. The means for accommodating indentations may be a light turning film formed of spin-on glass or a photo-definable polymer.
Yet another innovative aspect of the subject matter described in this disclosure can be implemented in a method for forming an illumination system. The method includes providing an optically transmissive supporting layer; depositing a liquid material on the support layer to form a light turning film; and defining indentations in the light turning film to form a plurality of light turnings features in the light turning film. Depositing the liquid material can include performing a spin-on deposition. Defining the indentations can include exposing the light turning film to light through a reticle and subsequently exposing the light turning film to a development etch to form the indentations.
Details of one or more implementations of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages will become apparent from the description, the drawings, and the claims. Note that the relative dimensions of the following figures may not be drawn to scale.
Like reference numbers and designations in the various drawings indicate like elements.
The following detailed description is directed to certain implementations for the purposes of describing the innovative aspects. However, the teachings herein can be applied in a multitude of different ways. The described implementations may be implemented in any device that is configured to display an image, whether in motion (for example, video) or stationary (for example, still image), and whether textual, graphical or pictorial. More particularly, it is contemplated that the implementations may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, multimedia Internet enabled cellular telephones, mobile television receivers, wireless devices, smartphones, bluetooth devices, personal data assistants (PDAs), wireless electronic mail receivers, hand-held or portable computers, netbooks, notebooks, smartbooks, tablets, printers, copiers, scanners, facsimile devices, GPS receivers/navigators, cameras, MP3 players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, electronic reading devices (for example, e-readers), computer monitors, auto displays (for example, odometer display, etc.), cockpit controls and/or displays, camera view displays (for example, display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, microwaves, refrigerators, stereo systems, cassette recorders or players, DVD players, CD players, VCRs, radios, portable memory chips, parking meters, washers, dryers, washer/dryers, parking meters, packaging (for example, electromechanical systems (EMS), MEMS and non-MEMS), aesthetic structures (for example, display of images on a piece of jewelry) and a variety of electromechanical systems devices. The teachings herein also can be used in non-display applications such as, but not limited to, electronic switching devices, radio frequency filters, sensors, accelerometers, gyroscopes, motion-sensing devices, magnetometers, inertial components for consumer electronics, parts of consumer electronics products, varactors, liquid crystal devices, electrophoretic devices, drive schemes, manufacturing processes, electronic test equipment. Thus, the teachings are not intended to be limited to the implementations depicted solely in the Figures, but instead have wide applicability as will be readily apparent to one having ordinary skill in the art.
In some implementations, an illumination system is provided with a light guide to distribute light. The light guide can include a light turning film over a supporting layer. In some implementations, the light turning film may be formed of a material that can be deposited on the support layer as a liquid. The material forming the light turning film can be a photodefinable material, which may be glass, such a spin-on glass, or may be a polymer. In some other implementations, the light turning film may be formed of a glass, such as a spin-on glass, that is not photodefinable.
The light turning film may include indentations that define light turning features that can be configured to redirect light, propagating within the light guide, out of the light guide. For example, the sides of the indentations forming the light turning features may form facets that reflect light out of the light guide. In some implementations, the sides of the indentations may be coated with a reflective coating. An overlying protective layer, such as a passivation layer, may be provided over the reflective coating to protect it from chemically reactive agents in the ambient. In some implementations, the protective layer also may be formed of a glass material, such as spin-on glass. In some implementations, the light redirected by the light turning features may be applied to illuminate a display, such as a reflective display, which may be an interferometric modulator display.
Particular implementations of the subject matter described in this disclosure can be implemented to realize one or more of the following potential advantages. Typical light turning films may be formed of chemical vapor deposited materials. Such films can be costly to manufacture due to the relative slowness of the deposition process and the resulting low throughput for manufacturing light guides. In addition, the etch processes used to define light turning features in such light turning films typically have low etch rates, thereby further decreasing throughput. The use of photodefinable materials (including photodefinable glass materials) or non-photodefinable glass materials allows the light turning film to be formed by a relatively fast bulk deposition, for example, the deposition of material in the liquid phase, such as a spin-on coating process, in some implementations. In some implementations, the light turning film may be relatively quickly etched. For example, the photodefinable materials may be etched using a development etched. Such a wet etch may remove material more quickly than a dry etch. Also, because the light turning film may be photodefinable, a separate mask formation and pattern transfer step is not required to define indentations in the light turning film. As a result, manufacturing throughput can be increased, thereby reducing manufacturing costs. In addition, the cost of the materials may be lower than that of chemical vapor deposited materials, thereby further reducing manufacturing coats.
One example of a suitable MEMS or electromechanical systems (EMS) device, to which the described methods and implementations may apply, is a reflective display device. Reflective display devices can incorporate interferometric modulators (IMODs) to selectively absorb and/or reflect light incident thereon using principles of optical interference. IMODs can include an absorber, a reflector that is movable with respect to the absorber, and an optical resonant cavity defined between the absorber and the reflector. The reflector can be moved to two or more different positions, which can change the size of the optical resonant cavity and thereby affect the reflectance of the interferometric modulator. The reflectance spectrums of IMODs can create fairly broad spectral bands which can be shifted across the visible wavelengths to generate different colors. The position of the spectral band can be adjusted by changing the thickness of the optical resonant cavity, i.e., by changing the position of the reflector.
The IMOD display device can include a row/column array of IMODs. Each IMOD can include a pair of reflective layers, i.e., a movable reflective layer and a fixed partially reflective layer, positioned at a variable and controllable distance from each other to form an air gap (also referred to as an optical gap or cavity). The movable reflective layer may be moved between at least two positions. In a first position, i.e., a relaxed position, the movable reflective layer can be positioned at a relatively large distance from the fixed partially reflective layer. In a second position, i.e., an actuated position, the movable reflective layer can be positioned more closely to the partially reflective layer. Incident light that reflects from the two layers can interfere constructively or destructively depending on the position of the movable reflective layer, producing either an overall reflective or non-reflective state for each pixel. In some implementations, the IMOD may be in a reflective state when unactuated, reflecting light within the visible spectrum, and may be in a dark state when actuated, reflecting light outside of the visible range (for example, infrared light). In some other implementations, however, an IMOD may be in a dark state when unactuated, and in a reflective state when actuated. In some implementations, the introduction of an applied voltage can drive the pixels to change states. In some other implementations, an applied charge can drive the pixels to change states.
The depicted portion of the pixel array in
In
The optical stack 16 can include a single layer or several layers. The layer(s) can include one or more of an electrode layer, a partially reflective and partially transmissive layer and a transparent dielectric layer. In some implementations, the optical stack 16 is electrically conductive, partially transparent and partially reflective, and may be fabricated, for example, by depositing one or more of the above layers onto a transparent substrate 20. The electrode layer can be formed from a variety of materials, such as various metals, for example indium tin oxide (ITO). The partially reflective layer can be formed from a variety of materials that are partially reflective, such as various metals, for example, chromium (Cr), semiconductors, and dielectrics. The partially reflective layer can be formed of one or more layers of materials, and each of the layers can be formed of a single material or a combination of materials. In some implementations, the optical stack 16 can include a single semi-transparent thickness of metal or semiconductor which serves as both an optical absorber and conductor, while different, more conductive layers or portions (for example, of the optical stack 16 or of other structures of the IMOD) can serve to bus signals between IMOD pixels. The optical stack 16 also can include one or more insulating or dielectric layers covering one or more conductive layers or a conductive/absorptive layer.
In some implementations, the layer(s) of the optical stack 16 can be patterned into parallel strips, and may form row electrodes in a display device as described further below. As will be understood by one having skill in the art, the term “patterned” is used herein to refer to masking as well as etching processes. In some implementations, a highly conductive and reflective material, such as aluminum (Al), may be used for the movable reflective layer 14, and these strips may form column electrodes in a display device. The movable reflective layer 14 may be formed as a series of parallel strips of a deposited metal layer or layers (orthogonal to the row electrodes of the optical stack 16) to form columns deposited on top of posts 18 and an intervening sacrificial material deposited between the posts 18. When the sacrificial material is etched away, a defined gap 19, or optical cavity, can be formed between the movable reflective layer 14 and the optical stack 16. In some implementations, the spacing between posts 18 can be approximately 1-1000 um, while the gap 19 can be less than <10,000 Angstroms (Å).
In some implementations, each pixel of the IMOD, whether in the actuated or relaxed state, is essentially a capacitor formed by the fixed and moving reflective layers. When no voltage is applied, the movable reflective layer 14 remains in a mechanically relaxed state, as illustrated by the pixel 12 on the left in
The processor 21 can be configured to communicate with an array driver 22. The array driver 22 can include a row driver circuit 24 and a column driver circuit 26 that provide signals to, for example, a display array or panel 30. The cross section of the IMOD display device illustrated in
In some implementations, a frame of an image may be created by applying data signals in the form of “segment” voltages along the set of column electrodes, in accordance with the desired change (if any) to the state of the pixels in a given row. Each row of the array can be addressed in turn, such that the frame is written one row at a time. To write the desired data to the pixels in a first row, segment voltages corresponding to the desired state of the pixels in the first row can be applied on the column electrodes, and a first row pulse in the form of a specific “common” voltage or signal can be applied to the first row electrode. The set of segment voltages can then be changed to correspond to the desired change (if any) to the state of the pixels in the second row, and a second common voltage can be applied to the second row electrode. In some implementations, the pixels in the first row are unaffected by the change in the segment voltages applied along the column electrodes, and remain in the state they were set to during the first common voltage row pulse. This process may be repeated for the entire series of rows, or alternatively, columns, in a sequential fashion to produce the image frame. The frames can be refreshed and/or updated with new image data by continually repeating this process at some desired number of frames per second.
The combination of segment and common signals applied across each pixel (that is, the potential difference across each pixel) determines the resulting state of each pixel.
As illustrated in
When a hold voltage is applied on a common line, such as a high hold voltage VCHOLD
When an addressing, or actuation, voltage is applied on a common line, such as a high addressing voltage VCADD
In some implementations, hold voltages, address voltages, and segment voltages may be used which produce the same polarity potential difference across the modulators. In some other implementations, signals can be used which alternate the polarity of the potential difference of the modulators. Alternation of the polarity across the modulators (that is, alternation of the polarity of write procedures) may reduce or inhibit charge accumulation which could occur after repeated write operations of a single polarity.
During the first line time 60a: a release voltage 70 is applied on common line 1; the voltage applied on common line 2 begins at a high hold voltage 72 and moves to a release voltage 70; and a low hold voltage 76 is applied along common line 3. Thus, the modulators (common 1, segment 1), (1,2) and (1,3) along common line 1 remain in a relaxed, or unactuated, state for the duration of the first line time 60a, the modulators (2,1), (2,2) and (2,3) along common line 2 will move to a relaxed state, and the modulators (3,1), (3,2) and (3,3) along common line 3 will remain in their previous state. With reference to
During the second line time 60b, the voltage on common line 1 moves to a high hold voltage 72, and all modulators along common line 1 remain in a relaxed state regardless of the segment voltage applied because no addressing, or actuation, voltage was applied on the common line 1. The modulators along common line 2 remain in a relaxed state due to the application of the release voltage 70, and the modulators (3,1), (3,2) and (3,3) along common line 3 will relax when the voltage along common line 3 moves to a release voltage 70.
During the third line time 60c, common line 1 is addressed by applying a high address voltage 74 on common line 1. Because a low segment voltage 64 is applied along segment lines 1 and 2 during the application of this address voltage, the pixel voltage across modulators (1,1) and (1,2) is greater than the high end of the positive stability window (i.e., the voltage differential exceeded a predefined threshold) of the modulators, and the modulators (1,1) and (1,2) are actuated. Conversely, because a high segment voltage 62 is applied along segment line 3, the pixel voltage across modulator (1,3) is less than that of modulators (1,1) and (1,2), and remains within the positive stability window of the modulator; modulator (1,3) thus remains relaxed. Also during line time 60c, the voltage along common line 2 decreases to a low hold voltage 76, and the voltage along common line 3 remains at a release voltage 70, leaving the modulators along common lines 2 and 3 in a relaxed position.
During the fourth line time 60d, the voltage on common line 1 returns to a high hold voltage 72, leaving the modulators along common line 1 in their respective addressed states. The voltage on common line 2 is decreased to a low address voltage 78. Because a high segment voltage 62 is applied along segment line 2, the pixel voltage across modulator (2,2) is below the lower end of the negative stability window of the modulator, causing the modulator (2,2) to actuate. Conversely, because a low segment voltage 64 is applied along segment lines 1 and 3, the modulators (2,1) and (2,3) remain in a relaxed position. The voltage on common line 3 increases to a high hold voltage 72, leaving the modulators along common line 3 in a relaxed state.
Finally, during the fifth line time 60e, the voltage on common line 1 remains at high hold voltage 72, and the voltage on common line 2 remains at a low hold voltage 76, leaving the modulators along common lines 1 and 2 in their respective addressed states. The voltage on common line 3 increases to a high address voltage 74 to address the modulators along common line 3. As a low segment voltage 64 is applied on segment lines 2 and 3, the modulators (3,2) and (3,3) actuate, while the high segment voltage 62 applied along segment line 1 causes modulator (3,1) to remain in a relaxed position. Thus, at the end of the fifth line time 60e, the 3×3 pixel array is in the state shown in
In the timing diagram of
The details of the structure of interferometric modulators that operate in accordance with the principles set forth above may vary widely. For example,
As illustrated in
In implementations such as those shown in
The process 80 continues at block 84 with the formation of a sacrificial layer 25 over the optical stack 16. The sacrificial layer 25 is later removed (for example, at block 90) to form the cavity 19 and thus the sacrificial layer 25 is not shown in the resulting interferometric modulators 12 illustrated in
The process 80 continues at block 86 with the formation of a support structure for example, a post 18 as illustrated in
The process 80 continues at block 88 with the formation of a movable reflective layer or membrane such as the movable reflective layer 14 illustrated in
The process 80 continues at block 90 with the formation of a cavity, for example, cavity 19 as illustrated in
Because reflective displays, such as those with interferometric modulator pixels, use reflected light to form images, it may be desirable to augment the ambient light to increase the brightness of the display in some environments. This augmentation may be provided by an illumination system in which light from a light source is directed to the reflective display, which then reflects the light back towards a viewer.
With continued reference to
The light source 130 may include any suitable light source, for example, an incandescent bulb, a edge bar, a light emitting diode (“LED”), a fluorescent lamp, an LED light bar, an array of LEDs, and/or another light source. In certain implementations, light from the light source 130 is injected into the light guide 120 such that a portion of the light propagates in a direction across at least a portion of the light guide 120 at a low-graze angle relative to the surface of the light guide 120 aligned with the display 160 such that the light is reflected within the light guide 120 by total internal reflection (“TIR”). In some implementations, the light source 130 includes a light bar. Light entering the light bar from a light generating device (for example, a LED) may propagate along some or all of the length of the bar and exit out of a surface or edge of the light bar over a portion or all of the length of the light bar. Light exiting the light bar may enter an edge of the light guide 120, and then propagate within the light guide 120.
The light turning features 121 in the light guide 120 direct the light towards display elements in the display 160 at an angle sufficient so that at least some of the light passes out of the light guide 120 to the reflective display 160. The light turning features 121 may include one or more layers configured to increase reflectivity of the turning feature 121 facing away from the viewer 170 and/or function as a black mask from the viewer side. These layers may be referred in the aggregate as coating 140.
The interferometric stack can be configured to give the coating 140 a dark appearance, as seem by the viewer 170. For example, light can be reflected off of each of the reflective layer 122 and partially reflective layer 124, with the thickness of the spacer 123 selected such that the reflected light interferes destructively so that the coating 140 appears black or dark as seem from above by the viewer 170 (
The reflective layer 122 may, for example, include a metal layer, for example, aluminum (Al), nickel (Ni), silver (Ag), molybdenum (Mo), gold (Au), and chromium (Cr). The reflective layer 122 can be between about 100 Å and about 700 Å thick. In one implementation, the reflective layer 122 is about 300 Å thick. The spacer layer 123 can include various optically transmissive materials, for example, air, silicon oxy-nitride (SiOxN), silicon dioxide (SiO2), aluminum oxide (Al2O3), titanium dioxide (TiO2), magnesium fluoride (MgF2), chromium (III) oxide (Cr3O2), silicon nitride (Si3N4), transparent conductive oxides (TCOs), indium tin oxide (ITO), and zinc oxide (ZnO). In some implementations, the spacer layer 123 is between about 500 Å and about 1500 Å thick. In one implementation, the spacer layer 123 is about 800 Å thick. The partially reflective layer 124 can include various materials, for example, molybdenum (Mo), titanium (Ti), tungsten (W), chromium (Cr), etc., as well as alloys, for example, MoCr. The partially reflective 124 can be between about 20 and about 300 Å thick in some implementations. In one implementation, the partially reflective layer 124 is about 80 Å thick.
With continued reference to
It has been found that metal layers, such as the reflective coating 140 and the partially reflecting layer 124, in some implementations, can corrode or otherwise undergo undesired reactions. Without being limited by theory, it is believe that these undesired reactions occur due to moisture or gases (for example, oxidants) from the ambient diffusing to and reacting with the reflective coating 140 and/or layer 124. These reactions can change the materials properties of the reflective coating 140 (for example, degrade the reflectivity of the coating and layers) and thereby degrade the desired functionality of the coating 140 and/or layer 124.
With continued reference to
In some implementations, when exposed to an environment of 85° C. with 85% relative humidity, the passivation layer 110 prevents corrosion in reflective coating 140 for a duration of at least about 200 hours, or at least about 500 hours, or at least about 1000 hours. In some implementations, the corrosion prevention is at such a level that operation of the device is not impaired, such that the device meets its operating specifications. For example, as the partially reflective layer 124 in the coating 140 corrodes, the black-mask properties of the coating 140 decrease and an increase in ambient reflection off of the coating 140 (due, for example, to reflection from the layer 122) can occur. In some implementations, corrosion of the layer 124 is prevented to such an extent that the increase in perceived reflection off of the coating 140 is about 20% or less, about 10% or less, or about 5% or less after 500 hours in an environment at 85° C. with 85% relative humidity. In some implementations, these benefits are achieved for reflective coating 140 that includes a 50 nm reflective layer 122 of Al, a 72 nm spacer layer 123 of silicon oxide, and a 5 nm partially reflective layer 124 of MoCr (
The passivation layer 110 may be formed of an optically transmissive material, including optically transmissive dielectric materials which may be advantageous for electrically isolating electrical structures underlying the passivation layer 110. Examples of suitable materials for the passivation layer 110 include silicon oxide (SiO2), silicon oxynitride (SiON), MgF2, CaF2, Al2O3, or mixtures thereof. In some implementations, the passivation layer 110 is formed of a spin-on glass.
With reference to
With continued reference to
With continued reference to
RI
PS=√{square root over (RILG×RIODL)}
where
In one example, an optical decoupling layer 180a of silicone having a refractive index of 1.42 may be disposed directly over a passivation layer 110 formed of silicon oxide having a refractive index of 1.47, which is disposed on a light guide 120, which includes a layer of SiON directly underlying the passivation layer 110, the SiON layer having a refractive index of 1.52. In some implementations, the silicone may be a silicone adhesive coating. The optical decoupling layer 180a may directly contact the passivation layer 110, which may directly contact the light guide 120. In some implementations, the refractive index of the passivation layer 110 is within 0.1 of the optical decoupling layer 180a, the light guide 120, or both the optical decoupling layer 180a and the light guide 120. In some implementations, the refractive index of the optical decoupling layer 180a is about 0.05 or more, or about 0.1 or more, less than the refractive index of the passivation layer 110 and/or light guide 120.
In some implementations, the thickness of the passivation layer 110 may be about 50 nm or more, about 75 nm or more, or about 75-125 nm. In some other implementations, the thickness of the passivation layer 110 may be about 250-330 nm. Such thicknesses have been found to provide benefits for providing anti-reflective properties in the optical spectrum to the passivation layer 110, as discussed herein. By forming the passivation layer 110 conformally over the light guide 120, the passivation layer 110 may be formed to a substantially uniform thickness, thereby consistently providing anti-reflective properties within the desired optical spectrum across the light guide 120. In some implementations where the thickness of the passivation layer 110 varies between the bottom and the sidewalls of a light turning feature 121, the above-noted thicknesses may be the thickness at the bottom of the light turning feature 121. In some implementations, the thickness of the passivation layer 110 at the bottom of the light turning feature 121 may about 100 nm, or about 290 nm, and the thickness of the passivation layer 110 at the sidewalls of the light turning feature 121 is within about 40 nm, or about 25 nm of the thickness at the bottom.
The illumination system may include an underlying display 160 for which the anti-reflection properties of the light guide 120 may provide benefits. As discussed herein, light from the light source 130 may be injected into the light guide 120, redirected by the light turning features 121 towards the display 160, and reflected by the display 160 forwards towards the viewer 170, thereby forming an image perceived by the viewer 170. The anti-reflective properties provided by the optical decoupling layer 180a, passivation layer 110, and light guide 120 can reduce the reflections seen by the viewer 170, thereby improving the perceived contrast of the display 160.
With reference to
With continued reference to
Whether as part of an anti-reflective structure or implemented without anti-reflective functionality, it will be appreciated that the passivation layer 110 may be arranged in various configurations.
With reference to
In some other implementations, the passivation layer 110 may be patterned after being deposited.
In some implementations, each of the layers forming the coating 140 and the passivation layer 110 may be blanket deposited over the light guide 120. These layers may then be simultaneously patterned using a single mask, which allows the coating 140 and passivation layer 110 to be simultaneously defined by etching. The patterned passivation layer 110 caps the light turning feature 121 and coating 140. As illustrated in
A person having ordinary skill in the art will recognize that the exposed sides of the coatings 140 may leave those sides susceptible to interactions with moisture and gases from the ambient environment. However, these layers may have thicknesses on the order of tens of nanometers, while the widths of the light turning features 121 are on the order of microns. Thus, corrosion or reactions at the side of the coating 140 are not believed to progress at a rate sufficient to undermine the functionality of the light turning features 121 over the expected life of the illumination system containing the coating 140.
Patterning the passivation layer 110 can facilitate the formation of ancillary structures in the openings left by removed parts of the passivation layer 110. In some implementations, the passivation layer 110 is patterned to facilitate electrical contacts to underlying electrical features.
While referred to herein as a single entity for ease of discussion and illustration, it will be appreciated that the light guide 120 may be formed of one or more layers of material.
In some implementations, the turning film 128 and the supporting layer 129 are formed of the same material and in other implementations, the turning film and the supporting layer 129 are formed of different materials. In some implementations, the turning film 128 may be formed of spin-on glass, or a photodefinable polymer, and the supporting layer 129 may be formed of glass. In some implementations, the indices of refraction of the turning film 128 and the supporting layer 129 may be matched to be close or equal to one another such that light may propagate successively through the layers substantially without being reflected or refracted at the interface between the layers. In some implementations, the refractive indices of the turning film 128 and the support layer 129 are within about 0.05, about 0.03, or about 0.02 of each other. In one implementation, the supporting layer 129 and the turning film 128 each have an index of refraction of about 1.52. According to some other implementations, the indices of refraction of the supporting layer 129 and/or the turning film 128 can range from about 1.45 to about 2.05. In some implementations, the supporting layer 129 and turning film 128 may be held together by an adhesive (for example, a pressure-sensitive adhesive), which may have an index of refraction similar or equal to the index of refraction of one or both of the supporting layer 129 and turning film 128. In addition, in some implementations, the display 160 may be laminated to the light guide 120 using a refractive-index matched adhesive, such as a pressure-sensitive adhesive (“PSA”).
One or both of the supporting layer 129 and the turning film 128 can include one or more light turning features 121. In some implementations, the light turning features 121 are disposed on a top surface of the light turning film 128. The indentations forming these features 121 may be formed by various processes, including etching and embossing. The thickness of the light turning film 128 can be sufficient to form the entire volume of the light turning features 121 within that film. In some implementations, the light turning film 128 has a thickness of about 1.0-5 μm, about 1.0-4 μm, or about 1.5-3 μm.
In addition, the coating 140 on the walls of the light turning features 121 may be formed by depositing (for example, blanket depositing) one or more films of the desired materials and then etching the deposited film to remove the materials from locations outside of the light turning features 121. The formation of the indentations and/or the formation of the coating 140 can be performed before attaching the turning film 129 to the support layer 129. In some implementations, this can facilitate fabrication of the illumination system, since defects in the indentations or the coating 140 can be discovered before attaching the turning film 128 to the supporting layer 129 and the remainder of the illumination system. Thus, rather than discarding the entire light guide 120 and/or other parts attached to the turning film 129 when a defect in the light turning features 121 is found, only a defective turning film 129 may need to be replaced.
In some other implementations, the light guide may be etched to define light turning features after the turning film 129 is combined with a supporting layer 128. With reference now to
As shown in
It will be appreciated that the use of glass or photodefinable materials in come implementations can provide benefits over the use of chemical vapor deposited materials. The use of photodefinable materials (including photodefinable glass materials) or non-photodefinable glass materials allows the light turning film to be formed by a relatively fast bulk deposition, for example, by a spin-on coating process, rather than a slower chemical vapor deposition. In addition, in some implementations, the light turning film may be more quickly etched than some chemical vapor deposited materials. For example, the photodefinable materials may be etched using a development etched, which may be a wet etch. Also, because the light turning film is itself photodefinable, a separate mask formation and pattern transfer step is not required to define indentations in the light turning film. As a result, the manufacturing throughput can be increased, thereby reducing manufacturing costs. In addition, the cost of the materials may be lower than that of chemical vapor deposited materials, thereby further reducing manufacturing coats.
It will be appreciated that the illumination systems described herein may be manufactured in various ways.
Providing the light guide 200 can encompass providing a light guide as a panel. The light guide may be provided with a plurality of light turning features, such as the features 121 (
In some other implementations, the light turning features 121 may be formed in a light turning film 128 that is later attached to an underlying supporting layer. Thus, formation of the indentations for the light turning features may be performed before attachment to the supporting layer. In some implementations, the coating 140 and/or passivation layer 110 may be applied before attachment to the supporting layer. In other implementations, the coating 140 and/or passivation layer 110 may be applied after attachment to the supporting layer.
Providing the passivation layer 110 may include depositing the passivation layer 110 on the light guide. The deposition may be accomplished by various methods known in the art, including chemical vapor deposition. In some implementations, the top surface of the light guide 120 is coated with the passivation layer 110. In some other implementations, both the top and bottom surfaces of the light guide 120 are coated with a passivation layer. Coating both the top and bottom surfaces of the light guide 120 may include separately depositing the passivation layer 110 on each surface, or may include simultaneously coating other surfaces with the passivation layer 110. For example, the light guide 120 may be subjected to a wet coating process in which both surfaces of the light guide 120 are simultaneously exposed to the coating agent to form a passivation layer 110 on each side of the light guide 120. In some implementations, the extent of the coating or deposition process is gauged such that the final passivation layer 110 has a thickness of about 50 nm or greater for use as both a moisture barrier and an anti-reflective coating.
The display device 40 includes a housing 41, a display 30, an antenna 43, a speaker 45, an input device 48, and a microphone 46. The housing 41 can be formed from any of a variety of manufacturing processes, including injection molding, and vacuum forming. In addition, the housing 41 may be made from any of a variety of materials, including, but not limited to: plastic, metal, glass, rubber, and ceramic, or a combination thereof. The housing 41 can include removable portions (not shown) that may be interchanged with other removable portions of different color, or containing different logos, pictures, or symbols.
The display 30 may be any of a variety of displays, including a bi-stable or analog display, as described herein. The display 30 also can be configured to include a flat-panel display, such as plasma, EL, OLED, STN LCD, or TFT LCD, or a non-flat-panel display, such as a CRT or other tube device. In addition, the display 30 can include an interferometric modulator display, as described herein.
The components of the display device 40 are schematically illustrated in
The network interface 27 includes the antenna 43 and the transceiver 47 so that the display device 40 can communicate with one or more devices over a network. The network interface 27 also may have some processing capabilities to relieve, for example, data processing requirements of the processor 21. The antenna 43 can transmit and receive signals. In some implementations, the antenna 43 transmits and receives RF signals according to the IEEE 16.11 standard, including IEEE 16.11(a), (b), or (g), or the IEEE 802.11 standard, including IEEE 802.11a, b, g or n. In some other implementations, the antenna 43 transmits and receives RF signals according to the BLUETOOTH standard. In the case of a cellular telephone, the antenna 43 is designed to receive code division multiple access (CDMA), frequency division multiple access (FDMA), time division multiple access (TDMA), Global System for Mobile communications (GSM), GSM/General Packet Radio Service (GPRS), Enhanced Data GSM Environment (EDGE), Terrestrial Trunked Radio (TETRA), Wideband-CDMA (W-CDMA), Evolution Data Optimized (EV-DO), 1xEV-DO, EV-DO Rev A, EV-DO Rev B, High Speed Packet Access (HSPA), High Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), Evolved High Speed Packet Access (HSPA+), Long Term Evolution (LTE), AMPS, or other known signals that are used to communicate within a wireless network, such as a system utilizing 3G or 4G technology. The transceiver 47 can pre-process the signals received from the antenna 43 so that they may be received by and further manipulated by the processor 21. The transceiver 47 also can process signals received from the processor 21 so that they may be transmitted from the display device 40 via the antenna 43.
In some implementations, the transceiver 47 can be replaced by a receiver. In addition, the network interface 27 can be replaced by an image source, which can store or generate image data to be sent to the processor 21. The processor 21 can control the overall operation of the display device 40. The processor 21 receives data, such as compressed image data from the network interface 27 or an image source, and processes the data into raw image data or into a format that is readily processed into raw image data. The processor 21 can send the processed data to the driver controller 29 or to the frame buffer 28 for storage. Raw data typically refers to the information that identifies the image characteristics at each location within an image. For example, such image characteristics can include color, saturation, and gray-scale level.
The processor 21 can include a microcontroller, CPU, or logic unit to control operation of the display device 40. The conditioning hardware 52 may include amplifiers and filters for transmitting signals to the speaker 45, and for receiving signals from the microphone 46. The conditioning hardware 52 may be discrete components within the display device 40, or may be incorporated within the processor 21 or other components.
The driver controller 29 can take the raw image data generated by the processor 21 either directly from the processor 21 or from the frame buffer 28 and can re-format the raw image data appropriately for high speed transmission to the array driver 22. In some implementations, the driver controller 29 can re-format the raw image data into a data flow having a raster-like format, such that it has a time order suitable for scanning across the display array 30. Then the driver controller 29 sends the formatted information to the array driver 22. Although a driver controller 29, such as an LCD controller, is often associated with the system processor 21 as a stand-alone Integrated Circuit (IC), such controllers may be implemented in many ways. For example, controllers may be embedded in the processor 21 as hardware, embedded in the processor 21 as software, or fully integrated in hardware with the array driver 22.
The array driver 22 can receive the formatted information from the driver controller 29 and can re-format the video data into a parallel set of waveforms that are applied many times per second to the hundreds, and sometimes thousands (or more), of leads coming from the display's x-y matrix of pixels.
In some implementations, the driver controller 29, the array driver 22, and the display array 30 are appropriate for any of the types of displays described herein. For example, the driver controller 29 can be a conventional display controller or a bi-stable display controller (for example, an IMOD controller). Additionally, the array driver 22 can be a conventional driver or a bi-stable display driver (for example, an IMOD display driver). Moreover, the display array 30 can be a conventional display array or a bi-stable display array (for example, a display including an array of IMODs). In some implementations, the driver controller 29 can be integrated with the array driver 22. Such an implementation is common in highly integrated systems such as cellular phones, watches and other small-area displays.
In some implementations, the input device 48 can be configured to allow, for example, a user to control the operation of the display device 40. The input device 48 can include a keypad, such as a QWERTY keyboard or a telephone keypad, a button, a switch, a rocker, a touch-sensitive screen, or a pressure- or heat-sensitive membrane. The microphone 46 can be configured as an input device for the display device 40. In some implementations, voice commands through the microphone 46 can be used for controlling operations of the display device 40.
The power supply 50 can include a variety of energy storage devices as are well known in the art. For example, the power supply 50 can be a rechargeable battery, such as a nickel-cadmium battery or a lithium-ion battery. The power supply 50 also can be a renewable energy source, a capacitor, or a solar cell, including a plastic solar cell or solar-cell paint. The power supply 50 also can be configured to receive power from a wall outlet.
In some implementations, control programmability resides in the driver controller 29 which can be located in several places in the electronic display system. In some other implementations, control programmability resides in the array driver 22. The above-described optimization may be implemented in any number of hardware and/or software components and in various configurations.
The various illustrative logics, logical blocks, modules, circuits and algorithm steps described in connection with the implementations disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. The interchangeability of hardware and software has been described generally, in terms of functionality, and illustrated in the various illustrative components, blocks, modules, circuits and steps described above. Whether such functionality is implemented in hardware or software depends upon the particular application and design constraints imposed on the overall system.
The hardware and data processing apparatus used to implement the various illustrative logics, logical blocks, modules and circuits described in connection with the aspects disclosed herein may be implemented or performed with a general purpose single- or multi-chip processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, or, any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, for example, a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration. In some implementations, particular steps and methods may be performed by circuitry that is specific to a given function.
In one or more aspects, the functions described may be implemented in hardware, digital electronic circuitry, computer software, firmware, including the structures disclosed in this specification and their structural equivalents thereof, or in any combination thereof. Implementations of the subject matter described in this specification also can be implemented as one or more computer programs, i.e., one or more modules of computer program instructions, encoded on a computer storage media for execution by, or to control the operation of, data processing apparatus.
Various modifications to the implementations described in this disclosure may be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other implementations without departing from the spirit or scope of this disclosure. Thus, the claims are not intended to be limited to the implementations shown herein, but are to be accorded the widest scope consistent with this disclosure, the principles and the novel features disclosed herein. The word “exemplary” is used exclusively herein to mean “serving as an example, instance, or illustration.” Any implementation described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other implementations. Additionally, a person having ordinary skill in the art will readily appreciate, the terms “upper” and “lower” are sometimes used for ease of describing the figures, and indicate relative positions corresponding to the orientation of the figure on a properly oriented page, and may not reflect the proper orientation of the IMOD as implemented.
Certain features that are described in this specification in the context of separate implementations also can be implemented in combination in a single implementation. Conversely, various features that are described in the context of a single implementation also can be implemented in multiple implementations separately or in any suitable subcombination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a subcombination or variation of a subcombination.
Similarly, while operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. Further, the drawings may schematically depict one more example processes in the form of a flow diagram. However, other operations that are not depicted can be incorporated in the example processes that are schematically illustrated. For example, one or more additional operations can be performed before, after, simultaneously, or between any of the illustrated operations. In certain circumstances, multitasking and parallel processing may be advantageous. Moreover, the separation of various system components in the implementations described above should not be understood as requiring such separation in all implementations, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products. Additionally, other implementations are within the scope of the following claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve desirable results.
This application claims the priority benefit under 35 U.S.C. §119(e) of U.S. provisional Application No. 61/414,328, filed Nov. 16, 2010, entitled “ILLUMINATION DEVICE WITH PASSIVATION LAYER,” and U.S. provisional Application No. 61/489,178, filed May 23, 2011, entitled “ILLUMINATION DEVICE WITH LIGHT GUIDE COATINGS,” both of which are assigned to the assignee hereof. The disclosures of the prior applications are considered part of this disclosure and are incorporated by reference in their entireties.
Number | Date | Country | |
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61414328 | Nov 2010 | US | |
61489178 | May 2011 | US |