Patent Application
20240063242
This application is based on and claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2022-0104270, filed on Aug. 19, 2022, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety.
One or more embodiments relate to an image sensor including a nano-photonic lens array and an electronic apparatus including the same.
Image sensors generally sense the color of incident light by using a color filter. However, a color filter may have low light utilization efficiency because the color filter absorbs light of colors other than an intended color. For example, when a red-green-blue (RGB) color filter is used, only ⅓ of the incident light is transmitted therethrough. The remaining portion of the incident light, that is, ⅔ of the incident light, is absorbed. Thus, light utilization efficiency is only about 33%. In a color display apparatus or a color image sensor, most light loss occurs in the color filter.
Apparatus consistent with this disclosure include an image sensor including a nano-photonic lens array.
Additional aspects will be set forth in part in the description which follows. Additional aspects will be apparent to one skilled in the art based on the description, or may be learned by practice of disclosed example embodiments.
An example embodiment of an image sensor may include: a sensor substrate including a plurality of first pixels for sensing light of a first wavelength band and a plurality of second pixels for sensing light of a second wavelength band that is different from the first wavelength band; a color filter layer on the sensor substrate, the color filter layer including a plurality of color filters; a planarization layer arranged on the color filter layer; an encapsulation layer arranged on the planarization layer; and a nano-photonic lens array arranged on the encapsulation layer, the nano-photonic lens array including a plurality of nano-structures that are arranged to condense incident light onto the plurality of first pixels and the plurality of second pixels.
An example embodiment may have the plurality of color filters in the color filter layer including organic color filters including an organic dye or an organic pigment.
An example embodiment may include the planarization layer having an organic polymer material.
An example embodiment may include the organic polymer material including at least one from an epoxy resin, polyimide, polycarbonate, polyacrylate, and polymethyl methacrylate.
An example embodiment may include the encapsulation layer including an inorganic material.
An example embodiment may include the inorganic material including at least one from SiO2, SiN, and SiON.
An example embodiment may include a difference between a refractive index of the planarization layer and a refractive index of the encapsulation layer is within ±20% of the refractive index of the planarization layer.
An example embodiment may have a thickness of the encapsulation layer less than a thickness of the planarization layer.
An example embodiment may include a thickness of the encapsulation layer is about 100 nm to about 500 nm.
An example embodiment may include the planarization layer has a thickness of about 300 nm to about 5 μm.
An example embodiment may include a difference between a sum of a thickness of the color filter layer, a thickness of the planarization layer, and a thickness of the encapsulation layer and a focal length of the nano-photonic lens array is within ±20% of the focal length of the nano-photonic lens array.
An example embodiment may include a sum of a thickness of the planarization layer and a thickness of the encapsulation layer is equal to or greater than a thickness of the nano-photonic lens array.
An example embodiment may include each of the plurality of first pixels and second pixels including: a plurality of photosensitive cells that are two-dimensionally arranged and grouped in a first direction and a second direction and independently sense light, the second direction being perpendicular to the first direction; and an isolation electrically isolating the plurality of photosensitive cells.
An example embodiment may include an etch stop layer arranged between the encapsulation layer and the nano-photonic lens array.
An example embodiment may include the nano-photonic lens array having a first pattern of nano structures corresponding to a respective first pixel of the plurality of first pixels, and a second pattern of nano structures corresponding to a respective second pixel of the plurality of second pixels, wherein the first pattern of nano structures and the second pattern of nano structures are disposed next to each other, and wherein the first pattern of nano structures and the second pattern of nano structures condense the incident light onto the respective first pixel of the plurality of first pixels and the respective second pixel of the plurality of second pixels, respectively.
An example embodiment of an image sensor may include a sensor substrate including a plurality of first pixels for sensing light of a first wavelength band and a plurality of second pixels for sensing light of a second wavelength band that is different from the first wavelength band; a color filter layer on the sensor substrate, the color filter layer including a plurality of color filters; a transparent encapsulation layer arranged on the color filter layer; and a nano-photonic lens array arranged on the encapsulation layer, the nano-photonic lens array including a plurality of nano-structures that are arranged to condense incident light onto the plurality of first pixels and the plurality of second pixels.
An example embodiment may include the encapsulation layer including an inorganic material.
An example embodiment may include the encapsulation layer only including the inorganic material.
An example embodiment may include the encapsulation layer is in contact with the color filter layer.
An example embodiment may include an etch stop layer arranged between the nano-photonic lens array and the encapsulation layer.
An example embodiment of an electronic apparatus may include: a lens assembly for forming an optical image of a subject; an image sensor for converting the optical image formed by the lens assembly into an electrical signal; and a processor configured to process a signal generated by the image sensor, wherein the image sensor comprises: a sensor substrate including a plurality of pixels sensing light; a color filter layer on the sensor substrate, the color filter layer including a plurality of color filters a transparent planarization layer arranged on the color filter layer; a transparent encapsulation layer arranged on the planarization layer; and a nano-photonic lens array arranged on the encapsulation layer and including a plurality of nano-structures arranged to condense incident light onto the plurality of pixels.
The above and other aspects, features, and advantages of example embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:
Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the example embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the figures, to explain aspects. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.
Hereinafter, an image sensor including a nano-photonic lens array and an electronic apparatus including the image sensor will be described in detail with reference to accompanying drawings. Example embodiments of the disclosure are capable of various modifications and may be embodied in many different forms. In the drawings, sizes of components in the drawings may be exaggerated to facilitate explanation.
When a layer, a film, a region, or a panel is referred to as being “on” another element, it may be directly on/under/at left/right sides of the other layer or substrate, or intervening layers may also be present.
It will be understood that although the terms “first,” “second,” etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another. These terms do not necessarily indicated that materials or structures of components are different from one another.
An expression used in the singular encompasses the expression of the plural, unless it has a clearly different meaning in the context. It will be further understood that when a portion is referred to as “comprises” another component, the portion may not exclude another component but may further comprise another component unless the context indicates otherwise.
In addition, the terms such as “ . . . unit”, “module”, etc. provided herein indicates a unit performing a function or operation, and may be realized by hardware (such as one or more processors), software, or a combination of hardware and software.
The use of the terms of “the above-described” and similar indicative terms may correspond to both the singular form and the plural form.
Also, the steps of all methods described herein may be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. Also, the use of all exemplary terms (for example, etc.) is only to describe a technical spirit in detail, and the scope of rights is not limited by these terms.
The pixel array 1100 includes pixels that are two-dimensionally arranged in a plurality of rows and columns. The row decoder 1020 selects one of the rows in the pixel array 1100 in response to a row address signal output from the timing controller 1010. The output circuit 1030 outputs a signal representative of detected light, for example, in a column unit, from a plurality of pixels arranged in the selected row. To this end, the output circuit 1030 may include a column decoder and an analog-to-digital converter (ADC). For example, the output circuit 1030 may include a plurality of ADCs that are arranged respectively for a plural columns. The ADCs may be arranged between the column decoder and the pixel array 1100, or one ADC may be arranged at an output end of the column decoder. The timing controller 1010, the row decoder 1020, and the output circuit 1030 may be implemented as one chip or separate chips. A processor for processing an image signal output from the output circuit 1030 may be implemented as one chip along with the timing controller 1010, the row decoder 1020, and the output circuit 1030.
The pixel array 1100 may include a plurality of pixels that sense light of different wavelength bands. The pixel arrangement may be implemented in various ways. For example,
The pixel array 1100 may be arranged in various arrangement patterns, other than the Bayer pattern. For example, referring to
Referring to
Each of the first to fourth pixels 111, 112, 113, and 114 may include a plurality of photosensitive cells that independently sense incident light. For example, each of the first to fourth pixels 111, 112, 113, and 114 may include first to fourth photosensitive cells C1, C2, C3, and C4. The first to fourth photosensitive cells C1, C2, C3, and C4 may be two-dimensionally arranged in the first direction (X-direction) and the second direction (Y-direction). For example, in each of the first to fourth pixels 111, 112, 113, and 114, the first to fourth photosensitive cells C1, C2, C3, and C4 may be arranged in a 2×2 array.
According to the embodiment, an auto-focusing signal may be obtained from a difference between output signals of adjacent photosensitive cells. For example, an auto-focusing signal in the first direction (X-direction) may be generated from a difference between output signals from the first photosensitive cell C1 and the second photosensitive cell C2, a difference between output signals from the third photosensitive cell C3 and the fourth photosensitive cell C4, or a difference between a sum of the output signals from the first photosensitive cell C1 and the third photosensitive cell C3 and a sum of the output signals from the second photosensitive cell C2 and the fourth photosensitive cell C4. Also, an auto-focusing signal in the second direction (Y-direction) may be generated from a difference between output signals from the first photosensitive cell C1 and the third photosensitive cell C3, a difference between output signals from the second photosensitive cell C2 and the fourth photosensitive cell C4, or a difference between a sum of the output signals from the first photosensitive cell C1 and the second photosensitive cell C2 and a sum of the output signals from the third photosensitive cell C3 and the fourth photosensitive cell C4.
In addition, a general image signal may be obtained by summing output signals from the first to fourth photosensitive cells C1, C2, C3, and C4. For example, a first green image signal may be generated by summing the output signals from the first to fourth photosensitive cells C1, C2, C3, and C4 of the first pixel 111, a blue image signal may be generated by summing the output signals from the first to fourth photosensitive cells C1, C2, C3, and C4 of the second pixel 112, a red image signal may be generated by summing the output signals from the first to fourth photosensitive cells C1, C2, C3, and C4 of the third pixel 113, and a second green image signal may be generated by summing the output signals from the first to fourth photosensitive cells C1, C2, C3, and C4 of the fourth pixel 114.
Also, each of the first to fourth pixels 111, 112, 113, and 114 may include deep trench isolation (DTI) structure that electrically isolates the plurality of photosensitive cells from one another. The DTI structure may be filled with air or an electrically insulating material. The DTI may extend in the first direction (X-direction) and the second direction (Y-direction) so as to divide each of the first to fourth pixels 111, 112, 113, and 114 into four. The first to fourth photosensitive cells C1, C2, C3, and C4 in each of the first to fourth pixels 111, 112, 113, and 114 may be isolated from one another by the isolation DTI. The isolation DTI extending in the first direction (X-direction) and the isolation DTI extending in the second direction (Y-direction) may cross each other at the center of each of the first to fourth pixels 111, 112, 113, and 114.
Also, the isolation DTI may be arranged in the first direction (X-direction) and the second direction (Y-direction) between adjacent pixels from among the first to fourth pixels 111, 112, 113, and 114. Therefore, the first to fourth pixels 111, 112, 113, and 114 may be isolated from one another due to the isolation DTI. The isolation DTI extending in the first direction (X-direction) and the isolation DTI extending in the second direction (Y-direction) may cross each other at the center of the unit Bayer pattern including the first to fourth pixels 111, 112, 113, and 114.
The first color filter 121 may be arranged to face the first pixel 111 in a third direction (Z-direction), the second color filter 122 may be arranged to face the second pixel 112 in the third direction (Z-direction), the third color filter 123 may be arranged to face the third pixel 113 in the third direction (Z-direction), and the fourth color filter 124 may be arranged to face the fourth pixel 114 in the third direction (Z-direction). Accordingly, the first pixel 111 and the fourth pixel 114 may sense the light of the first wavelength band that has passed through the first color filter 121 and the fourth color filter 124 respectively corresponding thereto. Also, the second pixel 112 may sense the light of the second wavelength band that has passed through the second color filter 122 corresponding thereto. The third pixel 113 may sense the light of the third wavelength band that has passed through the third color filter 123 corresponding thereto. For example, the first color filter 121 and the fourth color filter 124 may be green color filters transmitting the green light, the second color filter 122 may be a blue color filter transmitting the blue light, and the third color filter 123 may be a red color filter transmitting the red light.
Dashed lines shown in
The first to fourth color filters 121, 122, 123, and 124 in the color filter layer 120 may be formed of, for example, an organic polymer material. For example, the first to fourth color filters 121, 122, 123, and 124 may include a coloring agent, binder resin, polymer photoresist, etc. The first and fourth color filters 121 and 124 may be organic color filters including green organic dye or a green organic pigment as a coloring agent, the second color filter 122 may be an organic color filter including a blue organic dye or a blue organic pigment as a coloring agent, and the third color filter 123 may be an organic color filter including a red organic dye or a red organic pigment as a coloring agent. The color filter layer 120 may further include a black matrix arranged at boundaries between the first to fourth color filters 121, 122, 123, and 124. The black matrix may include, for example, carbon black.
In
An encapsulation layer 131 may be further arranged on the planarization layer 130. The encapsulation layer 131 may function as a protective layer for preventing the planarization layer 130 formed of an organic polymer material from being damaged during a process of forming the nano-photonic lens array 150 on the planarization layer 130. Also, the encapsulation layer 131 may function as a diffusion barrier layer that prevents a metal component in the color filter layer 120 from passing through the planarization layer 130 and being exposed to outside due to the high temperature during the process of forming the nano-photonic lens array 150. To this end, the encapsulation layer 131 may include an inorganic material. The inorganic material of the encapsulation layer 131 may be formed at a temperature lower than a processing temperature for forming the nano-photonic lens array 150 and may include a material transparent with respect to visible light. Also, a refractive index of the encapsulation layer 131 may be similar to that of the planarization layer 130 in order to reduce reflection loss at an interface between the planarization layer 130 and the encapsulation layer 131. For example, a difference between the refractive index of the planarization layer 130 and the refractive index of the encapsulation layer 131 may be within ±20% of the refractive index of the planarization layer 130. For example, the encapsulation layer 131 may include at least one inorganic material selected from SiO2, SiN, and SiON.
The nano-photonic lens array 150 may include a plurality of nano-structures NP that are arranged to condense incident light respectively to the first to fourth pixels 111, 112, 113, and 114. The plurality of nano-structures NP may be arranged so that a phase of light transmitting through the nano-photonic lens array 150 is changed according to a position on the nano-photonic lens array 150. A phase profile of the transmitted light, which is implemented by the nano-photonic lens array 150, may be determined according to a width (or diameter) and a height of each of the nano-structures NP, and the arrangement period (or pitch) and arrangement type of the plurality of nano-structures NP. Also, the behavior of the light passing through the nano-photonic lens array 150 may be determined according to the phase profile of the transmitted light. For example, the plurality of nano-structures NP may be arranged so as to form a phase profile allowing the light transmitted through the nano-photonic lens array 150 to condense.
The nano-structures NP may have a size that is less than a wavelength of visible light. The nano-structures NP may have, for example, a size that is less than the blue wavelength. For example, the cross-sectional width (or diameter) of the nano-structures NP may be less than 400 nm, 300 nm, or 200 nm. A height of the nano-structures NP may be about 500 nm to about 1500 nm, and may be greater than the cross-sectional width of the nano-structures NP.
The nano-structures NP may include a material having a relatively higher refractive index as compared with a peripheral material and having a relatively lower absorbent ratio in the visible ray band. For example, the nano-structures NP may include c-Si (crystalline Si), p-Si (polycrystalline Si), a-Si (amorphous Si) and a Group III-V compound semiconductor (GaP, GaN, GaAs etc.), SiC, TiO2, SiN3, ZnS, ZnSe, Si3N4, and/or a combination thereof. The periphery of the nano-structures NP may be filled with a dielectric material having a relatively lower refractive index as compared with the nano-structures NP and a relatively low absorbent ratio in the visible ray band. For example, the periphery of the nano-structures NP may be filled with siloxane-based spin on glass (SOG), SiO2, Si3N4, Al2O3, air, etc.
The refractive index of the nano-structures NP may be about 2.0 or greater with respect to light of about a 630 nm wavelength, and the refractive index of a peripheral material may be about 1.0 to about 2.0 or less with respect to light of about a 630 nm wavelength. Also, a difference between the refractive index of the nano-structures NP and the refractive index of the peripheral material may be about 0.5 or greater. The nano-structures NP having a difference in a refractive index from the refractive index of the peripheral material may change the phase of light that passes through the nano-structures NP. This is caused by phase delay that occurs due to the shape dimension of the sub wavelength of the nanostructures NP, and a degree at which the phase is delayed may be determined by a detailed shape dimension and arrangement shape of the nanostructures NP.
In an example, the nano-photonic lens array 150 may condense light of the first wavelength band, in the incident light, to the first pixel 111 and the fourth pixel 114, condense light of the second wavelength band to the second pixel 112, and condense light of the third wavelength band to the third pixel 113. Then, the incident light is separated by the nano-photonic lens array 150 according to wavelengths and then condensed to the first to fourth pixels 111, 112, 113, and 114. To do this, the plurality of nano-structures NP may be arranged in different sizes and/or configurations in the first to fourth lenses 151, 152, 153, and 154 of the nano-photonic lens array 150.
In addition, the first green light phase profile PPG1 does not denote that the phase delay amount of the light that has passed through the center of the first lens 151 is largest, but when the phase of light that has passed through the first lens 151 is set as 2π and a phase delay amount of the light that has passed through another point is greater and has a phase value of 2π or greater, the first green light phase profile PPG1 may denote a value remaining after subtracting 2nπ, that is, a wrapped phase profile. For example, when the phase of light that has passed through the first lens 151 is 2π and the phase of light that has passed through the center of the second lens 152 is 3π, the phase in the second lens 152 may be a remaining π after subtracting 2π(n=1) from 3π.
Also, the blue light that has passed through the nano-photonic lens array 150 may have a blue light phase profile PPB that is largest at the center of the second lens 152 and decreases away from the center of the second lens 152. In detail, at a position immediately after passing through the nano-photonic lens array 150, the phase of the blue light may be largest at the center of the second lens 152 and may decrease in a concentric circle away from the center of the second lens 152. For example, when the phase of blue light at the center of the second lens 152 is 2π, the phase at the centers of the first lens 151 and the fourth lens 154 may be about 0.9π to about 1.1π, and the phase at the center of the third lens 153 may be less than the phase at the centers of the first and fourth lenses 151 and 154, for example, about 0.5π to about 0.9π.
Referring to
Referring to
Also, the green light that has passed through the nano-photonic lens array 150 may have a second green light phase profile PPG2 that is largest at the center of the fourth lens 154 and decreases away from the center of the fourth lens 154. Except that the second green light phase profile PPG2 has the largest phase at the center of the fourth lens 154, the descriptions about the first green light phase profile PPG1 may be also applied to the second green light phase profile PPG2.
Referring to
Referring to
Because the nano-photonic lens array 150 described above may separate the incident light by wavelengths and condense the separated light without absorbing or blocking the incident light, the light utilization efficiency of an image sensor 1000 may be improved.
Referring to
Therefore, the light immediately after passing through the first lens 151 may have a phase profile that is formed as a convex curve that is symmetrical both in the first direction (X-direction) and the second direction (Y-direction). In
Referring back to
The color filter layer 120 is required to have an optimal thickness range for appropriately absorbing the light according to a target transmission spectrum, and thus, the thickness Ta of the color filter layer 120 may be constant without regard to the focal length of the nano-photonic lens array 150. The encapsulation layer 131 may have a thickness by which the planarization layer 130 is protected and diffusion of the material in the color filter layer 120 is prevented. Therefore, the planarization layer 130 may mainly function as the spacer, and the thickness Tb of the planarization layer 130 may be determined according to the focal length of the nano-photonic lens array 150.
For example, the thickness Ta of the color filter layer 120 may be about 100 nm to about 800 nm. The thickness Tb of the planarization layer 130 may be determined within a range of about 300 nm to about 5 μm according to the focal length of the nano-photonic lens array 150. The thickness Tc of the encapsulation layer 131 may be less than the thickness Tb of the planarization layer 130. For example, the thickness Tc of the encapsulation layer 131 may be about 100 nm to about 500 nm. Also, a thickness Td of the nano-photonic lens array 150 may be about 500 nm to about 1500 nm. When the nano-photonic lens array 150 performs the function of a color separating lens described above with reference to
In addition, referring to
Also, the anti-reflection layer 160 arranged on the light-incident surface of the nano-photonic lens array 150 may reduce the light, in the incident light, reflected by the upper surface of the nano-photonic lens array 150 and may improve the light utilization efficiency of the image sensor 1000. The anti-reflection layer 160 may include a material having a refractive index different from that of the material of the nano-structures NP in the nano-photonic lens array 150. In particular, an average refractive index of the anti-reflection layer 160 may be greater than a refractive index of air and may be less than an average refractive index of the nano-photonic lens array 150. For example, the anti-reflection layer 160 may include one layer formed of one material of SiO2, Si3N4, and Al2O3. The anti-reflection layer 160 may be formed of a thickness of about 80 nm to about 120 nm. Alternatively, the anti-reflection layer 160 may have a multi-layered structure in which different dielectric materials are alternately stacked. For example, the anti-reflection layer 160 may be formed by alternately stacking two or three of SiO2, Si3N4, and Al2O3. Alternatively, the anti-reflection layer 160 may include various patterns for anti-reflection.
Also, the pixel array 1100a may further include an etch stop layer 141 additionally arranged between the first nano-photonic lens array 150a and the second nano-photonic lens array 150b. In this case, the etch stop layer 140 arranged between the encapsulation layer 131 and the first nano-photonic lens array 150a may be a first etch stop layer, and the etch stop layer 141 arranged between the first nano-photonic lens array 150a and the second nano-photonic lens array 150b may be a second etch stop layer.
The image sensor 1000 may have an improved light utilization efficiency. As the light utilization efficiency is improved, a size of one pixel or size of independent photosensitive cells in the pixel of the image sensor 1000 may be reduced. Therefore, the image sensor 1000 having high resolution may be provided. The image sensor 1000 according to the embodiment may form a camera module along with a module lens of various functions and may be utilized in various electronic devices.
The processor ED20 may control one or more elements (hardware, software elements, etc.) of the electronic apparatus ED01 connected to the processor ED20 by executing software (program ED40, etc.), and may perform various data processes or operations. As a part of the data processing or operations, the processor ED20 may load a command and/or data received from another element (sensor module ED76, communication module ED90, etc.) to a volatile memory ED32, may process the command and/or data stored in the volatile memory ED32, and may store result data in a non-volatile memory ED34. The processor ED20 may include a main processor ED21 (central processing unit, application processor, etc.) and an auxiliary processor ED23 (graphic processing unit, image signal processor, sensor hub processor, communication processor, etc.) that may be operated independently from or along with the main processor ED21. The auxiliary processor ED23 may use less power than that of the main processor ED21, and may perform specified functions.
The auxiliary processor ED23, on behalf of the main processor ED21 while the main processor ED21 is in an inactive state (sleep state) or along with the main processor ED21 while the main processor ED21 is in an active state (application executed state), may control functions and/or states related to some (display device ED60, sensor module ED76, communication module ED90, etc.) of the elements in the electronic apparatus ED01. The auxiliary processor ED23 (image signal processor, communication processor, etc.) may be implemented as a part of another element (camera module ED80, communication module ED90, etc.) that is functionally related thereto.
The memory ED30 may store various data required by the elements (processor ED20, sensor module ED76, etc.) of the electronic apparatus ED01. The data may include, for example, input data and/or output data about software (program ED40, etc.) and commands related thereto. The memory ED30 may include the volatile memory ED32 and/or the non-volatile memory ED34.
The program ED40 may be stored as software in the memory ED30, and may include an operation system ED42, middleware ED44, and/or an application ED46.
The input device ED50 may receive commands and/or data to be used in the elements (processor ED20, etc.) of the electronic apparatus ED01, from outside (user, etc.) of the electronic apparatus ED01. The input device ED50 may include a microphone, a mouse, a keyboard, and/or a digital pen (stylus pen).
The sound output device ED55 may output a sound signal to outside of the electronic apparatus ED01. The sound output device ED55 may include a speaker and/or a receiver. The speaker may be used for a general purpose such as multimedia reproduction or record play, and the receiver may be used to receive a call. The receiver may be coupled as a part of the speaker or may be implemented as an independent device.
The display device ED60 may provide visual information to outside of the electronic apparatus ED01. The display device ED60 may include a display, a hologram device, or a projector, and a control circuit for controlling the corresponding device. The display device ED60 may include a touch circuitry set to sense a touch, and/or a sensor circuit (pressure sensor, etc.) that is set to measure a strength of a force generated by the touch.
The audio module ED70 may convert sound into an electrical signal or vice versa. The audio module ED 70 may acquire sound through the input device ED50, or may output sound via the sound output device ED55 and/or a speaker and/or a headphone of another electronic apparatus (electronic apparatus ED02, etc.) connected directly or wirelessly to the electronic apparatus ED01.
The sensor module ED76 may sense an operating state (power, temperature, etc.) of the electronic apparatus ED01, or an outer environmental state (user state, etc.), and may generate an electrical signal and/or data value corresponding to the sensed state. The sensor module ED76 may include a gesture sensor, a gyro-sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) ray sensor, a vivo sensor, a temperature sensor, a humidity sensor, and/or an illuminance sensor.
The interface ED77 may support one or more designated protocols that may be used in order for the electronic apparatus ED01 to be directly or wirelessly connected to another electronic apparatus (electronic apparatus ED02, etc.) The interface ED77 may include a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
The connection terminal ED78 may include a connector by which the electronic apparatus ED01 may be physically connected to another electronic apparatus (electronic apparatus ED02, etc.). The connection terminal ED78 may include an HDMI connector, a USB connector, an SD card connector, and/or an audio connector (headphone connector, etc.).
The haptic module ED79 may convert the electrical signal into a mechanical stimulation (vibration, motion, etc.) or an electric stimulation that the user may sense through a tactile or motion sensation. The haptic module ED79 may include a motor, a piezoelectric device, and/or an electric stimulus device.
The camera module ED80 may capture a still image and a video. The camera module ED80 may include a lens assembly including one or more lenses, the image sensor 1000 of
The power management module ED88 may manage the power supplied to the electronic apparatus ED01. The power management module ED88 may be implemented as a part of a power management integrated circuit (PMIC).
The battery ED89 may supply electric power to components of the electronic apparatus ED01. The battery ED89 may include a primary battery that is not rechargeable, a secondary battery that is rechargeable, and/or a fuel cell.
The communication module ED90 may support the establishment of a direct (wired) communication channel and/or a wireless communication channel between the electronic apparatus ED01 and another electronic apparatus (electronic apparatus ED02, electronic apparatus ED04, server ED08, etc.), and execution of communication through the established communication channel. The communication module ED90 may be operated independently from the processor ED20 (application processor, etc.), and may include one or more communication processors that support the direct communication and/or the wireless communication. The communication module ED90 may include a wireless communication module ED92 (cellular communication module, a short-range wireless communication module, a global navigation satellite system (GNSS) communication module) and/or a wired communication module ED94 (local area network (LAN) communication module, a power line communication module, etc.). From among the communication modules, a corresponding communication module may communicate with another electronic apparatus via a first network ED09 (short-range communication network such as Bluetooth, WiFi direct, or infrared data association (IrDA)) or a second network ED99 (long-range communication network such as a cellular network, Internet, or computer network (LAN, WAN, etc.)). Such above various kinds of communication modules may be integrated as one element (single chip, etc.) or may be implemented as a plurality of elements (a plurality of chips) separately from one another. The wireless communication module ED92 may identify and authenticate the electronic apparatus ED01 in a communication network such as the first network ED98 and/or the second network ED99 by using subscriber information (international mobile subscriber identifier (IMSI), etc.) stored in the subscriber identification module ED96.
The antenna module ED97 may transmit or receive the signal and/or power to/from outside (another electronic apparatus, etc.). An antenna may include a radiator formed as a conductive pattern formed on a substrate (PCB, etc.). The antenna module ED97 may include one or more antennas. When the antenna module ED97 includes a plurality of antennas, from among the plurality of antennas, an antenna that is suitable for the communication type used in the communication network such as the first network ED98 and/or the second network ED99 may be selected by the communication module ED90. The signal and/or the power may be transmitted between the communication module ED90 and another electronic apparatus via the selected antenna. Another component (RFIC, etc.) other than the antenna may be included as a part of the antenna module ED97.
Some of the elements may be connected to one another via the communication method among the peripheral devices (bus, general purpose input and output (GPIO), serial peripheral interface (SPI), mobile industry processor interface (MIPI), etc.) and may exchange signals (commands, data, etc.).
The command or data may be transmitted or received between the electronic apparatus ED01 and the external electronic apparatus ED04 via the server ED08 connected to the second network ED99. Other electronic apparatuses ED02 and ED04 may be the devices that are the same as or different kinds from the electronic apparatus ED01. All or some of the operations executed in the electronic apparatus ED01 may be executed in one or more devices among the other electronic apparatuses ED02, ED04, and ED08. For example, when the electronic apparatus ED01 has to perform a certain function or service, the electronic apparatus ED01 may request one or more other electronic apparatuses to perform some or entire function or service, instead of executing the function or service by itself. One or more electronic apparatuses receiving the request execute an additional function or service related to the request and may transfer a result of the execution to the electronic apparatus ED01. To do this, for example, a cloud computing, a distributed computing, or a client-server computing technique may be used.
The flash 1120 may emit light that is used to strengthen the light emitted or reflected from the object. The flash 1120 may emit visible light or infrared-ray light. The flash 1120 may include one or more light-emitting diodes (red-green-blue (RGB) LED, white LED, infrared LED, ultraviolet LED, etc.), and/or a Xenon lamp. The image sensor 1000 may be the image sensor described above with reference to
The image stabilizer 1140, in response to a motion of the camera module ED80 or the electronic apparatus ED01 including the camera module ED80, moves one or more lenses included in the lens assembly 1110 or the image sensor 1000 in a certain direction or controls the operating characteristics of the image sensor 1000 (adjusting of a read-out timing, etc.) in order to compensate for a negative influence of the motion. The image stabilizer 1140 may sense the movement of the camera module ED80 or the electronic apparatus ED01 by using a gyro sensor (not shown) or an acceleration sensor arranged in or out of the camera module ED80. The image stabilizer 1140 may be implemented as an optical type.
The memory 1150 may store some or entire data of the image obtained through the image sensor 1000 for next image processing operation. For example, when a plurality of images are obtained at a high speed, obtained original data (Bayer-patterned data, high resolution data, etc.) is stored in the memory 1150, and a low resolution image is only displayed. Then, original data of a selected image (user selection, etc.) may be transferred to the image signal processor 1160. The memory 1150 may be integrated with the memory ED30 of the electronic apparatus ED01, or may include an additional memory that is operated independently.
The image signal processor 1160 may perform image treatment on the image obtained through the image sensor 1000 or the image data stored in the memory 1150. The image treatments may include a depth map generation, a three-dimensional modeling, a panorama generation, extraction of features, an image combination, and/or an image compensation (noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, softening, etc.). The image signal processor 1160 may perform controlling (exposure time control, read-out timing control, etc.) of the elements (image sensor 1000, etc.) included in the camera module ED80. The image processed by the image signal processor 1160 may be stored again in the memory 1150 for additional process, or may be provided to an external element of the camera module ED80 (e.g., the memory ED30, the display device ED60, the electronic apparatus ED02, the electronic apparatus ED04, the server ED08, etc.). The image signal processor 1160 may be integrated with the processor ED20, or may be configured as an additional processor that is independently operated from the processor ED20. When the image signal processor 1160 is configured as an additional processor separately from the processor ED20, the image processed by the image signal processor 1160 undergoes through an additional image treatment by the processor ED20 and then may be displayed on the display device ED60.
Also, the image signal processor 1160 may receive two output signals independently from the adjacent photosensitive cells in each pixel or sub-pixel of the image sensor 1000, and may generate an auto-focusing signal from a difference between the two output signals. The image signal processor 1160 may control the lens assembly 1110 so that the focus of the lens assembly 1110 may be accurately formed on the surface of the image sensor 1000 based on the auto-focusing signal.
The electronic apparatus ED01 may further include one or a plurality of camera modules having different properties or functions. The camera module may include elements similar to those of the camera module ED80 of
While the image sensor including the nano-photonic lens array and the electronic apparats including the image sensor have been particularly shown and described with reference to example embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the following claims. The preferred embodiments should be considered in descriptive sense only and not for purposes of limitation. Therefore, the scope of the disclosure is defined not by the detailed description of the disclosure but by the appended claims, and all differences within the scope will be construed as being included in the present disclosure.
It should be understood that embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2022-0104270 | Aug 2022 | KR | national |
