Microlenses

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CPC
H01L27/14627

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14627Microlenses

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Image sensors
- Patent number 12,170,299
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Bomi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal mirror based multispectral filter array of optical sensor device
- Patent number 12,170,300
- Issue date Dec 17, 2024
- Viavi Solutions Inc.
- Georg J. Ockenfuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased optical path for long wavelength light by grating structure
- Patent number 12,170,302
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with pixel separation structure
- Patent number 12,170,296
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Seungjoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel circuit, control method and image sensor
- Patent number 12,170,297
- Issue date Dec 17, 2024
- SMARTSENS TECHNOLOGY (HK) CO., LIMITED
- Guang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a photodiode
- Patent number 12,170,298
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jameyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, manufacturing method thereof, and elect...
- Patent number 12,166,057
- Issue date Dec 10, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuka Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,166,059
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Min-Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, driving method therefor, and electronic...
- Patent number 12,166,062
- Issue date Dec 10, 2024
- Sony Group Corporation
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number 12,166,061
- Issue date Dec 10, 2024
- Sony Group Corporation
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS optical device comprising a lens and an actuator for controlli...
- Patent number 12,164,101
- Issue date Dec 10, 2024
- poLight ASA
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Image sensing device
- Patent number 12,166,055
- Issue date Dec 10, 2024
- SK hynix Inc.
- Sung Wook Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup element, method of manufacturing image pickup element,...
- Patent number 12,166,058
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shuji Manda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 12,166,060
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device, imaging module, electronic device, and imaging system
- Patent number 12,165,049
- Issue date Dec 10, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Takayuki Ikeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid-state imaging device, method of manufacturing the same, and e...
- Patent number 12,164,116
- Issue date Dec 10, 2024
- Sony Group Corporation
- Hirokazu Shibuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus, method of manufacturing the sam...
- Patent number 12,166,051
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Hiroshi Ikakura
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 12,166,048
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having a gate electrode on a semiconductor pattern sid...
- Patent number 12,166,049
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Younggu Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for receiving and collecting inclined light
- Patent number 12,166,053
- Issue date Dec 10, 2024
- VisEra Technologies Company Limited
- Wei-Ko Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion element and photoelectric conversion device
- Patent number 12,166,056
- Issue date Dec 10, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kouichi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including spider routing
- Patent number 12,160,674
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Moo Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with microlens layer and camera including the...
- Patent number 12,159,891
- Issue date Dec 3, 2024
- Canon Kabushiki Kaisha
- Kazuo Kokumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light detector
- Patent number 12,159,954
- Issue date Dec 3, 2024
- Kabushiki Kaisha Toshiba
- Koichi Kokubun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unequal CMOS image sensor pixel size to boost quantum efficiency
- Patent number 12,159,886
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including color separating lens array and electronic a...
- Patent number 12,159,893
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Sangyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-receiving element, solid-state imaging device, and ranging de...
- Patent number 12,159,888
- Issue date Dec 3, 2024
- SONY SEMICONDCUTOR SOLUTIONS CORPORATION
- Takeshi Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element
- Patent number 12,154,929
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Daisuke Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device
- Patent number 12,154,922
- Issue date Nov 26, 2024
- SK hynix Inc.
- Kyung Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device including shared pixels and operating method thereof
- Patent number 12,154,923
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Chanyoung Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR
- Publication number 20240421171
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Taesub JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240413179
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- YUKA OHKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240413182
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Youngrae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT DEFLECTING DEVICE AND DISTANCE MEASURING DEVICE
- Publication number 20240413181
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- TOSHIFUMI YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT
- Publication number 20240405034
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- Ryoji SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240405040
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seonghoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH VARYING GRID WIDTH
- Publication number 20240405045
- Publication date Dec 5, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- Jun Sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GERMANIUM-BASED PHOTODETECTOR WITH REDUCED DARK CURRENT AND METHODS...
- Publication number 20240405035
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yeh-Hsun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240395837
- Publication date Nov 28, 2024
- VisEra Technologies Company Ltd.
- Cheng-Hsuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...
- Publication number 20240395745
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jun Kyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240395838
- Publication date Nov 28, 2024
- Sony Semiconductor Solutions Corporation
- Koji SEKIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INCLUDING AN ANTI-REFLECTION ELEMENT AND ELECTRONIC AP...
- Publication number 20240395840
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Sangyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURE DEVICE
- Publication number 20240395841
- Publication date Nov 28, 2024
- GoPro, Inc.
- Nicholas Vitale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IM...
- Publication number 20240397227
- Publication date Nov 28, 2024
- Brillnics Singapore Pte. Ltd.
- Kazuya MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240395842
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jaesang YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS AND PHOTOELECTRIC CONVERSION SYSTEM
- Publication number 20240387573
- Publication date Nov 21, 2024
- Canon Kabushiki Kaisha
- YASUSHI KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...
- Publication number 20240387602
- Publication date Nov 21, 2024
- SONY GROUP CORPORATION
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT
- Publication number 20240388817
- Publication date Nov 21, 2024
- Sony Semiconductor Solutions Corporation
- SHINJI NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES
- Publication number 20240386743
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTODETECTOR AND ELECTRONIC APPARATUS
- Publication number 20240387583
- Publication date Nov 21, 2024
- Sony Semiconductor Solutions Corporation
- Kazuya FURUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE AND EQUIPMENT
- Publication number 20240387571
- Publication date Nov 21, 2024
- Canon Kabushiki Kaisha
- YUKI KITAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240387578
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240387589
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Ji Eun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240387579
- Publication date Nov 21, 2024
- SONY GROUP CORPORATION
- Atsushi MASAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20240379727
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240379696
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Sanghyuck Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH SCATTERING STRUCTURE
- Publication number 20240379703
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED-RESPONSIVE SENSOR ELEMENT
- Publication number 20240379725
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Minseok OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
- Publication number 20240377595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND ELECTRONIC EQUIPMENT
- Publication number 20240379691
- Publication date Nov 14, 2024
- Sony Semiconductor Solutions Corporation
- Yosuke SATAKE
- H01 - BASIC ELECTRIC ELEMENTS

Microlenses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Image sensors

Metal mirror based multispectral filter array of optical sensor device

Increased optical path for long wavelength light by grating structure

Image sensor with pixel separation structure

Pixel circuit, control method and image sensor

Image sensor including a photodiode

Solid-state imaging device, manufacturing method thereof, and elect...

Image sensor

Solid-state imaging device, driving method therefor, and electronic...

Semiconductor device and method of manufacturing the same, and elec...

MEMS optical device comprising a lens and an actuator for controlli...

Image sensing device

Image pickup element, method of manufacturing image pickup element,...

Image pickup device and electronic apparatus

Imaging device, imaging module, electronic device, and imaging system

Solid-state imaging device, method of manufacturing the same, and e...

Photoelectric conversion apparatus, method of manufacturing the sam...

Pixel array including octagon pixel sensors

Image sensor having a gate electrode on a semiconductor pattern sid...

Semiconductor device for receiving and collecting inclined light

Photoelectric conversion element and photoelectric conversion device

Image sensor including spider routing

Semiconductor device with microlens layer and camera including the...

Light detector

Unequal CMOS image sensor pixel size to boost quantum efficiency

Image sensor including color separating lens array and electronic a...

Light-receiving element, solid-state imaging device, and ranging de...

Semiconductor element

Image sensing device

Imaging device including shared pixels and operating method thereof

Patents Applicationslast 30 patents

IMAGE SENSOR

IMAGING DEVICE

IMAGE SENSOR

LIGHT DEFLECTING DEVICE AND DISTANCE MEASURING DEVICE

SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT

SEMICONDUCTOR DEVICE

IMAGE SENSOR WITH VARYING GRID WIDTH

GERMANIUM-BASED PHOTODETECTOR WITH REDUCED DARK CURRENT AND METHODS...

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...

IMAGING DEVICE

IMAGE SENSOR INCLUDING AN ANTI-REFLECTION ELEMENT AND ELECTRONIC AP...

IMAGE CAPTURE DEVICE

SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IM...

IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

PHOTOELECTRIC CONVERSION APPARATUS AND PHOTOELECTRIC CONVERSION SYSTEM

IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...

SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT

OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES

PHOTODETECTOR AND ELECTRONIC APPARATUS

PHOTOELECTRIC CONVERSION DEVICE AND EQUIPMENT

IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME

IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME

SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS

Method of Forming Semiconductor Device

IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME

IMAGE SENSOR WITH SCATTERING STRUCTURE

INFRARED-RESPONSIVE SENSOR ELEMENT

PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME

IMAGING DEVICE AND ELECTRONIC EQUIPMENT