IMAGE SENSOR WITHOUT OPTO-MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

Abstract

An image sensor without an opto-mechanical system. The image sensor comprises a substrate, a light source, an optical sensing device and a protective layer. The light source is disposed on the substrate and provides light for image capturing. The optical sensing device is disposed on the substrate and converts a light signal from the light source to an image signal. The protective layer is molded over the light source and the optical sensing device such that an optical path is created therein. No optical-mechanical component exists in the image sensor.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:

FIG. 1 is a flow chart of a manufacturing method for a conventional optical image sensor;

FIG. 2 is a cross sectional view of a conventional optical image sensor manufactured using the above-mentioned manufacturing method;

FIGS. 3 and 4 are respectively a cross sectional view and a perspective view of an optical image sensor without an optical-mechanical system according to an embodiment of the invention; and

FIG. 5 is a schematic diagram of an optical image sensor with an additional light source according to an embodiment of the invention; and

FIG. 6 is a flow chart of a manufacturing method of the disclosed optical image sensor according to an embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.

FIGS. 3 and 4 are respectively a cross sectional view and a perspective view of an optical image sensor without an optical-mechanical system according to an embodiment of the invention. The optical image sensor 3 comprises a substrate 31, an LED 32, an optical sensing device 34, and a protective block 33. The substrate 31 is used to carry the LED 32, the optical sensing device 34 and the protective block 33.

The LED 32 is disposed on the substrate 31 to provide high quality light required for capturing image. Alternatively, a directional light source of multi-mode or single-mode may be used as the light source. The protective block 33 protects the optical sensing device 34 from direct light projection from the LED 32 and also optimizes incident angle of light such that performance of the optical image sensor is improved. The optical sensing device 34 is also disposed on the substrate 31 and receives signals from the specific light source, wherein the signals are converted to digital signals such that an image of the detected object is captured. More specifically, the optical sensing device 34 is a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) sensing device. Alternatively, a plated film or a thin film that blocks permeable specific light source may be printed into the optical sensing device to capture image. The LED 32 and the optical sensing device 34 are packaged on the substrate 31 using welding wires 37 (die up or flip chip). An optical path for a specific light source is formed with a protective layer 36 (made up of high density chemical material) and a conductor 35 which allows transmission of a light source with a specific spectrum and blocks light beams whose frequencies are not in the specific spectrum. The conductor 35 is essentially made up of an optical material such as a high density polymer to provide an optical path specifically designed for the light source such that the optical sensing device 34 can capture the image produced by the specific light source. The protective layer 36 is made up of a high density polymer and blocks the specific light source and any light which is not specifically designed for image capturing such that misjudgment or failure in image capturing of the optical sensing device 34 is avoided. Preferably, the protective layer 36 comprises epoxy. In addition, the protection layer 36 may have a step 38 between the LED 32 and the optical sensing device 34 as shown in FIG. 3. The step 38 may be helpful for optimizing the optical path and improving performance of the optical image sensor 3.

Embodiments of the invention utilize a high-density chemical material to cover an LED 32 such that an optical path for a specific light source is formed. The light source can be a variable light source or an external light source to provide light required for image capturing. The light source is usually connected directly to the substrate 31 through welding wires 37. Light signals are transmitted via the conductor 35 to the optical sensing device (CCD or CMOS sensor) 34 where the signals are converted to digital signals for image capturing of the detected object.

FIG. 5 is a schematic diagram of an optical image sensor with an additional light source according to an embodiment of the invention. The LED in the optical image sensor of the disclosed embodiment of the invention in FIG. 3 is replaced by an external light source 5. As a result, a user is allowed put a finger 6 on a surface of the protective layer 36 for image display without relying upon a lens. Accordingly, size of the packaging structure can be significantly reduced and flattened with the ratio between the captured image and the object approximately at 1:1.

FIG. 6 is a flow chart of a manufacturing method for the disclosed optical image sensor according to an embodiment of the invention. The manufacturing method comprises disposing a light source, an optical sensing device on a substrate (step 601), and performing insert molding to package a protective layer over the light source, and the optical sensing device (step 602). As disclosed previously, an LED, an optical sensing device, and a protective block for blocking specific light source are placed on the substrate. Subsequently, a protective layer which allows transmission of a light source with specific spectrum is integrated with the substrate by insert molding technology to form an independent optical image sensor.

The protective layer is made up of a high-density chemical material and a conductor that allows transmission by a light source with a specific spectrum to define a specific optical path. To obtain the optimal optical path, the protective layer comprised of a high density chemical material has a refraction index not less than 1.5 and a transmission rate greater than 40%. The thickness of the protective layer above the optical sensing device ranges from 5 to 70 μm and that above the LED device ranges from 0.15 to 0.8 mm. The spacing between the optical sensing device and the LED ranges from 0.7 to 2.8 mm.

While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements as would be apparent to those skilled in the Art. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims

1. An image sensor without an opto-mechanical system, comprising: a substrate;a light source disposed on the substrate and providing light for image capturing;an optical sensing device disposed on the substrate and converting a light signal from the light source to an image signal; anda protective layer molded over the light source and the optical sensing device such that an optical path is created therein;wherein no optical-mechanical component exists in the image sensor.

2. The image sensor as claimed in claim 1, further comprising a protective block disposed between the light source and the optical sensing device such that the optical sensing device is protected from direct light projecting from the light source.

3. The image sensor as claimed in claim 1, wherein the protective layer is made up of a high density chemical material.

4. The image sensor as claimed in claim 1, wherein the protective layer is formed by insert molding.

5. The image sensor as claimed in claim 1, wherein the protective layer comprises a conductor allowing light transmission with a specific spectrum and blocking light with frequencies that are not in the specific spectrum.

6. The image sensor as claimed in claim 1, wherein the light source is an LED.

7. The image sensor as claimed in claim 1, wherein the light source is a modulated light source or an external light source.

8. The image sensor as claimed in claim 1, wherein a ratio between a captured image and a detected object is approximately 1:1.

9. The image sensor as claimed in claim 1, wherein the optical sensing device and the light source are electrically connected to the substrate by die-up or flip chip technology.

10. An image sensor without an opto-mechanical system, comprising: a substrate;a light source disposed on the substrate and providing light for image capturing;an optical sensing device disposed on the substrate and converting a light signal from the light source to an image signal; anda protective layer molded over the light source and the optical sensing device such that an optimal optical path is created;wherein the protective layer comprises epoxy.

11. The image sensor as claimed in claim 10, further comprising a protective block disposed between the light source and the optical sensing device such that the optical sensing device is protected from direct light projecting from the light source.

12. The image sensor as claimed in claim 10, wherein the protective layer is formed by insert molding.

13. The image sensor as claimed in claim 10, wherein the protective layer comprises a conductor allowing light transmission with a specific spectrum and blocking light with frequencies that are not in the specific spectrum.

14. The image sensor as claimed in claim 10, wherein the light source is an LED.

15. The image sensor as claimed in claim 10, wherein the light source is a modulated light source or an external light source.

16. The image sensor as claimed in claim 10, wherein a ratio between a captured image and a detected object is approximately 1:1.

17. The image sensor as claimed in claim 10, wherein the optical sensing device and the light source are electrically connected to the substrate by die-up or flip chip technology.

18. A manufacturing method of an image sensor without an opto-mechanical system, comprising: disposing a light source and an optical sensing device on a substrate; andperforming insert molding to package a protective layer over the light source, and the optical sensing device.

19. The manufacturing method as claimed in claim 18, wherein the protective layer is made up of a high density chemical material.

20. The manufacturing method as claimed in claim 18, wherein the protective layer comprises a conductor allowing light transmission with a specific spectrum and blocking light with frequencies that are not in the specific spectrum.

21. The manufacturing method as claimed in claim 18, wherein a refraction index of the protective layer is not less than 1.5 with transmission rate greater than 40%.

22. The manufacturing method as claimed in claim 18, wherein a thickness of the protective layer above the optical sensing device ranges from 5 to 70 μm.

23. The manufacturing method as claimed in claim 18, wherein thickness of the protective layer above the light source ranges from 0.15 to 0.8 mm.

24. The manufacturing method as claimed in claim 18, wherein a spacing between the optical sensing device and the light source ranges from 0.7 to 2.8 mm.