Claims
- 1. A phenylethynyl terminated amic acid oligomer having the formula ##STR47## and being selected from the group consisting of: wherein Ar' in the formula is ##STR48## Ar in the formula is ##STR49## and W in the formula is a bond;
- wherein Ar' in the formula is ##STR50## Ar in the formula is ##STR51## and W in the formula is ##STR52## wherein Ar' in the formula is ##STR53## Ar in the formula is ##STR54## and W in the formula is a bond;
- wherein Ar' in the formula is ##STR55## Ar in the formula is ##STR56## and W is a bond; and
- wherein Ar' in the formula is ##STR57## Ar in the formula is ##STR58## and W is a bond.
- 2. A cured polymer prepared from the phenylethynyl terminated amic acid oligomer of claim 1.
- 3. A cured film prepared from the phenylethynyl terminated amic acid oligomer of claim 1.
- 4. A cured neat resin molding prepared from the phenylethynyl terminated amic acid oligomer of claim 1.
- 5. A cured adhesive prepared from the phenylethynyl terminated amic acid oligomer of claim 1.
- 6. A composite prepared from the phenylethynyl terminated amic acid oligomer of claim 1.
Parent Case Info
This is a continuation of application Ser. No. 08/330,773 filed on Oct. 28, 1994, now U.S. Pat. No. 5,567,800.
ORIGIN OF INVENTION
The invention described herein was made jointly in the performance of work under NASA Grant NAG 1-1251 with Virginia Commonwealth University and an employee of the United States Government. In accordance with 35 USC 202, the grantee elected not to retain title.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5066771 |
Hino et al. |
Nov 1991 |
|
5567800 |
Hergenrother et al. |
Oct 1996 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
63-196564 |
Feb 1987 |
JPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
330773 |
Oct 1994 |
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