The subject matter herein generally relates to heat dissipation, and more particularly, to an immersion cooling device.
Electronic devices, such as servers, may generate heat during working. In order to dissipate the heat generated by the server, the server is placed into a housing receiving a coolant with a low boiling point. The coolant absorbs the heat generated by the server and vaporizes to dissipate the heat. The vaporized coolant then liquefies and condenses when it encounters the condenser. During a maintenance process, a cover plate of the housing is first opened to expose the server, and the server is then removed from the coolant. However, some of the vaporized coolant that is not fully condensed may escape out of the housing, resulting in a loss of the coolant. Therefore, there is room for improvement in the art.
Implementations of the present technology will now be described, by way of embodiment, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and members have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and feat100ures of the present disclosure.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
Referring to
The immersion cooling device 100 includes a housing 10, a condenser 20, and a blocking member 30. The housing 10 has a receiving chamber 111 for receiving a working liquid 50. Multiple electronic devices 200 may be immersed in the working liquid 50. The condenser 20 is received in the housing 10 and located outside the working liquid 50. When the working liquid 50 absorbs the heat generated by the electronic device 200 and vaporizes, the vapor reaches the condenser 20. The vapor directly condenses into liquid droplets when being in contact with the condenser 20, and then returns to the working liquid 50 again.
The blocking member 30 is received in the housing 10 and floated on a top surface of the working liquid 50. The blocking member 30 includes multiple blocking bodies 31 dispersed on the top surface of the working liquid 50. A density of each blocking body 31 is less than that of the working liquid 50. The blocking bodies 31 form a physical protective interface. When the receiving chamber 111 communicates with the outside environment (for example, when the housing 10 is opened by a user), the blocking bodies 31 can reduce the area of the top surface of the working liquid 50 that is exposed to the outside environment. Thus, the blocking bodies 31 can block and prevent the working liquid 50 from escaping out of the housing 10, thereby reducing the loss of the working liquid 50. During maintenance, the electronic device 200 can be directly removed from the working liquid 50 by moving the blocking bodies 31 toward a single side. Thus, the blocking bodies 31 do not affect the removal of the electronic device 200. Furthermore, when the immersion cooling device 100 is in use, the blocking bodies 31 are floated on the top surface of the working liquid 50. When the working liquid 50 absorbs the heat and reaches the boiling point, the bubbles generated by the working liquid 50 will push the blocking bodies 31 away, and the vapor of the working liquid 50 can move toward the condenser 20 without affecting the normal operation of the immersion cooling device 100.
With above configuration, the blocking bodies 31 can reduce the area of the working liquid 50 exposed to the outside environment, thereby reducing the amount of the working liquid 50 that escapes to the outside environment. Such structure is simple and easy to operate. The user can move the blocking bodies 31 toward a single side when he or she wants to observe the working status of the electronic device 200.
In at least one embodiment, each of the blocking bodies 31 is made of foam, so that the blocking bodies 31 can be floated on the working liquid 50. Each of the blocking bodies 31 may also be hollow inside, so that the blocking bodies 31 can be floated on the working liquid 50. Each of the blocking bodies 31 may be spherical or polyhedral.
In the embodiment, each of the blocking bodies 31 is a sunshade ball. The size of the sunshade ball is set according to actual needs. When viewing from a vertical direction (that is, a depth direction of the working liquid 50), the area of the blocking bodies 31 accounts for more than 90% of the area of the top surface of the working liquid 50, thereby reducing the area of the working liquid 50 that is exposed to the outside environment. The blocking bodies 31 may also completely cover the top surface of the working liquid 50.
In at least one embodiment, the working liquid 50 may be an insulating liquid, such as an insulating oil or fluoride.
Referring to
Referring to
In at least one embodiment, a support portion 40 is also received in the receiving chamber 111 of the housing 10. The condenser 20 is disposed on the support portion 40. The support portion 40 may be a bracket or a support plate. The support portion 40 protrudes from the inner wall or the bottom surface of the body 11.
The top surface of the support 40 is flush with the top surface of the working liquid 50, so that when the vapor directly condenses into liquid droplets when being in contact with the condenser 20, the liquid droplets can directly return to the working liquid 50. Furthermore, compared to the support portion 40 being higher than the working liquid 50, the present disclosure enables the vapor to quickly reach the condenser 20 and shortens the path of the vapor.
Even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202321129396.0 | May 2023 | CN | national |