This application claims the benefit of priority to Korean Patent Application No. 10-2018-0042759 filed on Apr. 12, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to an inductor and a manufacturing method thereof.
Recently, smartphones have been implemented with the ability to use many frequency bands due to the application of multiband long term evolution (LTE). As a result, high frequency inductors are largely used as impedance matching circuits in signal transmission and reception RF systems. The high frequency inductors are required to have a smaller size and higher capacity. Also, in the progress toward 5G, the necessity of passive elements operating in high frequency bands of tens of GHz is on the increase.
In order to obtain an impedance/signal matching inductor capable of realizing high inductance and low direct current (DC) resistance, a structure capable of improving inductance and Q characteristics is required.
The related art chip inductors are multilayer type inductors manufactured by stacking insulating layers on which an electrode pattern is formed and connecting lines of the layers by via holes.
The related art impedance matching inductors are manufactured in two ways.
In a first scheme, a multilayer body continued in a coil layer-via layer-coil layer manner is formed using a photosensitive paste and sintered, and in this method, shapes of coils and vias are not smooth. In this case, resistance is increased due to a skin effect and high Q characteristics cannot be obtained in a high frequency region.
The second is a thin film multilayer inductor, which includes a metal coil and an organic body and has roughness on a surface of a coil pattern to improve bonding force between the organic body and the coil.
The roughness formed on the surface of the coil pattern may increase resistance in a high frequency region and cannot obtain high Q characteristics in a high frequency region.
In particular, since external electrodes are disposed on an external surface of a body, a volume of the body is reduced by an amount equal to a volume of the external electrodes, causing a problem in realizing high inductance.
An aspect of the present disclosure may provide an inductor having high inductance and high Q characteristics.
According to an aspect of the present disclosure, an inductor may include: a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked; and first and second external electrodes disposed inside the body, wherein the plurality of coil patterns are connected by coil connecting portions and form a coil in which opposing ends thereof are connected to the first and second external electrodes, and the first and second external electrodes are directly connected to the opposing ends of the plurality of coil patterns inside the body.
According to another aspect of the present disclosure, a method of manufacturing an inductor may include: forming a first coil pattern and a coil connecting portion on a first insulator sheet; stacking a second insulator sheet on the first insulator sheet; forming a second coil pattern and a coil connecting portion on the second insulator sheet; stacking a third insulator sheet on the second insulator sheet; and repeatedly performing the stacking to form a body including a plurality of coil patterns, wherein first and second external electrodes connected to opposing ends of the plurality of coil patterns are disposed inside the body, and the first and second external electrodes are directly connected to opposing ends of the plurality of coil patterns inside the body.
The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
Hereinafter, exemplary embodiments in the present disclosure will be described in detail with reference to the accompanying drawings. In the accompanying drawings, shapes, sizes, and the like, of components may be exaggerated or stylized for clarity.
The present disclosure may, however, be exemplified in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Rather these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The term “an exemplary embodiment” used herein does not refer to the same exemplary embodiment, and is provided to emphasize a particular feature or characteristic different from that of another exemplary embodiment. However, exemplary embodiments provided herein are considered to be able to be implemented by being combined in whole or in part one with another. For example, one element described in a particular exemplary embodiment, even if it is not described in another exemplary embodiment, may be understood as a description related to another exemplary embodiment, unless an opposite or contradictory description is provided therein.
The meaning of a “connection” of a component to another component in the description includes an indirect connection through a third component as well as a direct connection between two components. In addition, “electrically connected” means the concept including a physical connection and a physical disconnection. It can be understood that when an element is referred to with “first” and “second”, the element is not limited thereby. They may be used only for a purpose of distinguishing the element from the other elements, and may not limit the sequence or importance of the elements. In some cases, a first element may be referred to as a second element without departing from the scope of the claims set forth herein. Similarly, a second element may also be referred to as a first element.
Herein, an upper portion, a lower portion, an upper side, a lower side, an upper surface, a lower surface, and the like, are decided in the accompanying drawings. In addition, a vertical direction refers to the abovementioned upward and downward directions, and a horizontal direction refers to a direction perpendicular to the abovementioned upward and downward directions. In this case, a vertical cross section refers to a case taken along a plane in the vertical direction, and an example thereof may be a cross-sectional view illustrated in the drawings. In addition, a horizontal cross section refers to a case taken along a plane in the horizontal direction, and an example thereof may be a plan view illustrated in the drawings.
Terms used herein are used only in order to describe an exemplary embodiment rather than limiting the present disclosure. In this case, singular forms include plural forms unless interpreted otherwise in context.
A structure of an inductor 100 according to an exemplary embodiment in the present disclosure will be described with reference to
A body 101 of the inductor 100 according to an exemplary embodiment in the present disclosure may be formed by stacking a plurality of insulating layers 111 in a first direction horizontal to a mounting surface.
The insulating layer 111 may include SiO2 powder. In another exemplary embodiment, the insulating layer 111 may include Al2O3 powder. In another exemplary embodiment, the insulating layer 111 may include aluminosilicate (Al2O5Si) powder. However, the present disclosure is not limited to these materials.
The insulating layer 111 may be formed to include the above-mentioned powder in a resin, or the like.
According to an exemplary embodiment in the present disclosure, first and second external electrodes 181 and 182 may be disposed inside the body 101.
For example, the first and second external electrodes 181 and 182 may be disposed on the mounting surface of the body 101. The mounting surface refers to a surface facing a printed circuit board (PCB) when the inductor is mounted on the PCB.
The external electrodes 181 and 182 serve to electrically connect the inductor 100 and the PCB when the inductor 100 is mounted on the PCB. The external electrodes 181 and 182 are disposed on the body 101 in the first direction and on the edges in a second direction horizontal to the mounting surface. The external electrodes 181 and 182 may include first electrode layers 181a and 182a and plating layers 181b and 181c and 182b and 182c formed on the first electrode layers 181a and 182a, respectively, but is not limited thereto.
The first electrode layers 181a and 182a may be directly connected to the plurality of coil patterns 121 and may be formed of the same material as that of the plurality of coil patterns 121. Specifically, first electrode layers 181a and 182a may include a conductive metal of at least one selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag).
The first and second external electrodes 181 and 182 may further include a plurality of plating layers 181b, 181c, 182b, and 182c disposed on the first electrode layers 181a and 182a.
The outermost plating layers 181c and 182c, among the plurality of plating layers 181b, 181c, 182b, and 182c, may be exposed to the outside of the body 101.
The plurality of plating layers 181b, 181c, 182b, and 182c may be sequentially formed in order of nickel (Ni) layers 181b and 182b and tin (Sn) layers 181c and 182c.
In the related art inductor, since the external electrodes are disposed on the external surface of the body, there is a problem in implementing a high inductance due to a reduction in volume of the body by the volume of the external electrode.
That is, in the related art, since the external electrodes are disposed on the external surface of the body, in the case of the “L”-shaped external electrodes, the body is not filled from the end of the external electrode on the side surface in the length direction to an upper surface of the body, which is disadvantageous to formation of inductance.
However, according to an exemplary embodiment in the present disclosure, since the first and second external electrodes 181 and 182 are disposed inside the body 101, there is no reduction in the volume of the body due to the external electrodes, realizing high inductance.
Referring to
It also means that interfaces of the ends of the first and second external electrodes 181 and 182 and the interface of an end surface of the body 101 in the length direction are substantially matched (or aligned).
Here the substantial matching of the interfaces of the ends of the first and second external electrodes 181 and 182 and the interface of the end surface of the body in the length direction includes accurate matching and a difference made in a predetermined portion due to a difference in terms of process.
In this case, as described later, the outermost plating layers 181c and 182c constituting the first and second external electrodes 181 and 182 may be exposed to the outside of the body.
Also, the outermost plating layers 181c and 182c constituting the first and second external electrodes 181 and 182 may protrude to the outside of the body or may be disposed on an inner side of the interface of the end surface of the body 101 in the length direction.
Referring to
The coil pattern 121 may be electrically connected to an adjacent coil pattern 121 by a coil connecting portion 132. That is, helical coil patterns 121 are connected by the coil connecting portion 132 to form a coil 120.
Opposing ends of the coil 120 are directly connected to the first and second external electrodes 181 and 182, respectively.
In the related art inductor, since the external electrodes are disposed on the external surface of the body, coil lead portions must be separately formed at the opposing ends of the coil to connect the opposing ends of the coil and the external electrodes.
In contrast, according to an exemplary embodiment in the present disclosure, since the first and second external electrodes 181 and 182 are disposed inside the body 101, separate coil lead portions are not required for the opposing ends of the coil 120, and the opposing ends of the coil 120 are directly connected to the first and second external electrodes 181 and 182, respectively.
When the opposing ends of the coil 120 are directly connected to the first and second external electrodes 181 and 182 without using the separate coil lead portions as described above, an internal area of the coil may be increased by the area to be occupied by the coil lead portions.
Inductance of the inductor is proportional to the internal area of the coil when permeability, the number of turns of the coil, and a length of a magnetic path are equal.
That is, according to an exemplary embodiment in the present disclosure, since the opposing ends of the coil 120 are directly connected to the first and second external electrodes 181 and 182 without separate coil lead portions, the internal area of the coil may be increased by the area to be occupied by the coil lead portions, enhancing inductance of the inductor.
As illustrated in
As described above, inductance of the inductor according to an exemplary embodiment in the present disclosure may be improved owing to the increase in the internal area of the coil.
According to another exemplary embodiment in the present disclosure, a height of the upper coil 120 may be increased by 8.2% with respect to the coil connecting portion 132, and in this case, an internal area of the coil may be increased by up to 32.3%. As a result, higher inductance may be obtained.
The coil connecting portion 132 may connect the coil patterns 121 and include a conductive via penetrating through the insulating layer 111.
As a material of the coil pattern 121 and the coil connecting portion 132, a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), or alloys thereof, which are metals having excellent conductivity, may be used. The coil patterns 121 and the coil connecting portion 132 may be formed by a plating method, a printing method, or the like.
As illustrated in
Referring to
Specifically, the first external electrode 181 and a first coil pattern 121 are directly connected, and thereafter, the coil patterns 121 are sequentially connected by the coil connecting portions 132.
A last coil pattern 121 is directly connected to the second external electrode 182 to form the coil 120.
Referring to
Hereinafter, a method of manufacturing an inductor according to another exemplary embodiment in the present disclosure will be described, but the present disclosure is not limited thereto.
1. Preparing First Insulator Sheet
As illustrated in
The first insulator sheet 111 may be formed by including the powder in a resin, or the like
2. Forming First Coil Pattern 121 and Coil Connecting Portion 132 on First Insulator Sheet 111
As illustrated in
The method of forming the first coil pattern and the coil connecting portion is performed by a printing method using a mask, and the first coil pattern and the coil connecting portion are formed of a metal.
3. Stacking Second Insulator Sheet on First Insulator Sheet
As illustrated in
The method of stacking the second insulator sheet on the first insulator sheet is not limited and may be carried out by the related art method.
4. Forming Second Coil Pattern and Coil Connecting Portion on Second Insulator Sheet.
As illustrated in
The method of forming the second coil pattern and the coil connecting portion is performed by a printing method using a mask, and the second coil pattern and the coil connecting portion are formed of a metal.
5. Stacking Third Insulator Sheet on Second Insulator Sheet
As illustrated in
The method of stacking the third insulator sheet on the second insulator sheet may be performed in the same manner as the method of stacking the second insulator sheet on the first insulator sheet.
6. Performing Stacking by Repeating the Above Process to Form Body Including a Plurality of Coil Patterns
As illustrated in
7. Etching First Electrode Layers 181a and 182a Exposed to Interfaces of Body
As illustrated in
8. Forming Nickel (Ni) and Tin (Sn) Plating Layers on First Electrode Layers 181a and 182a
As illustrated in
Through formation as described above, an inductor in which the first and second external electrodes 181 and 182 connected to the opposing ends of the plurality of coil patterns 121 are further disposed inside the body 101, and the external electrodes 181 and 182 are directly connected to the opposing ends of the plurality of coil patterns 121 inside the body 101 may be manufactured.
The interfaces at the ends of the first and second external electrodes 181 and 182 in the length direction of the body 101 and an interface at an end surface of the body 101 in the length direction may be substantially matched.
The substantial matching between the interfaces at the ends of the first and second external electrodes 181 and 182 and the interface at the end surface of the body 101 in the length direction includes accurate matching and may also include a difference in a predetermined portion due to a difference in terms of process.
In this case, the outermost plating layers 181c and 182c constituting the first and second external electrodes 181 and 182 may be exposed to the outside of the body.
The outermost plating layers 181c and 182c constituting the first and second external electrodes 181 and 182 may protrude to the outside of the body or may be disposed on an inner side of the interfaces at the end surfaces of the body 101 in the length direction.
In the inductor according to another exemplary embodiment in the present disclosure, a detailed description of the same characteristics as those of the inductor according to the above-described exemplary embodiment in the present disclosure will be omitted.
As set forth above, in the inductor according to exemplary embodiments of the present disclosure, since the first and second external electrodes are disposed inside the body, there is no reduction in the volume of the body due to the external electrodes, and thus, high inductance may be realized.
In addition, since the opposing ends of the coil are directly connected to the first and second external electrodes without separate coil lead portions, the internal area of the coil may be increased by the area to be occupied by the coil lead portions, and thus, inductance of the inductor may be improved.
While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present disclosure as defined by the appended claims.
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Entry |
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“Lee, Inductor with Improved Inductance for Miniaturization and Method of Manufacturing the Same, Feb. 1, 2017” (Year: 2017). |
Office Action issued in corresponding Japanese Application No. 2018-228747, dated May 28, 2019. |
Office Action issued in Japanese Patent Application No. 2018-228747 dated Nov. 12, 2019, with English translation. |
Office Action issued in corresponding Korean Application No. 10-2018-0042759, dated Apr. 30, 2019. |
Number | Date | Country | |
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20190318867 A1 | Oct 2019 | US |