Claims
- 1. A lamination ceramic chip inductor, formed by the process comprising the steps of:
interposing at least one conductive pattern between at least one pair of insulation layers so as to be in contact with at least one of the pair of insulation layers; and forming a conductive coil, wherein the interposing step includes electroforming at least one conductive pattern, and no specific gap is formed between the conductive pattern and the pair of insulation layers.
- 2. The lamination chip inductor according to claim 1, wherein the conductive pattern has a width in the range from about 30 μm to about 70 μm, and a thickness in the range from about 20 μm to about 50 μm.
- 3. A lamination ceramic chip inductor, formed by the process comprising the steps of:
forming a conductive coil by electroforming at least one conductive pattern; interposing said at least one conductive pattern between at least one pair of insulation layers so as to be in contact with at least one of the pair of insulation layers; laminating the conductive coil between said at least one pair of insulation layers to form an integral body; and sintering the integral body to form said lamination chip inductor; whereby in the lamination ceramic chip inductor no specific gap is formed at interfaces between the conductive pattern and said insulation layers when the integral body is sintered.
- 4. The lamination ceramic chip inductor of claim 3, wherein the width of said conductive pattern is in the range from about 30 micrometers to about 70 micrometers and the thickness of said conductive pattern is in the range from about 20 micrometers to about 50 micrometers.
- 5. The lamination ceramic chip inductor of claim 4, comprising a plurality of lamination layers connected together via through holes formed in at least one of the insulation layers.
Priority Claims (1)
Number |
Date |
Country |
Kind |
6-217150 |
Sep 1994 |
JP |
|
Parent Case Info
[0001] This is a divisional application of copending U.S. application Ser. No. 10/355,368 filed on Jan. 31, 2003, which is a divisional application of copending U.S. application Ser. No. 09/760,950 filed on Jan. 15, 2001, which is a divisional application of copending U.S. application Ser. No. 09/525,247 filed Mar. 15, 2001, which is a continuation-in-part application of copending U.S. application Ser. No. 08/526,713 filed on Sep. 11, 1995.
Divisions (3)
|
Number |
Date |
Country |
Parent |
10355368 |
Jan 2003 |
US |
Child |
10869182 |
Jun 2004 |
US |
Parent |
09760950 |
Jan 2001 |
US |
Child |
10355368 |
Jan 2003 |
US |
Parent |
09525247 |
Mar 2000 |
US |
Child |
09760950 |
Jan 2001 |
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
08526713 |
Sep 1995 |
US |
Child |
09525247 |
Mar 2000 |
US |