T. Yoshitomi, et al.; “On Chip Spiral Inductors with Diffused Shields Using Channel-Stop Implant,” Tech Dig. Int. Electron Devices Meeting (IEDM), 1998, pp 540-543. |
R.D. Lutz, et al., “Modeling and Analysis of Multilevel Spiral Inductors For RFICS,” Microwave Symposium Digest, 1999 IEEE MTT-S Internation, pp. 43-46, May 1999. |
M.S. Sunderarajan, et al., “Simple Accurate Expressions for Planar Spiral Inductances,” IEEE Journal of Solid-State Circuits, vol. 34, No. 10, pp. 1419-1424, Oct. 1999 |
J.N. Burghartz, et al., “Microwave Inductors and capacitors in Standard Multilevel Interconnect Silicon Technology,” IEEE Transactions on Microwave Theory and Techniques, vol. 44, No. 1, pp. 100-104, Jan. 1996. |
J.N. Burghartz, et al., “Multilevel-Spiral Inductors Using VLSI Interconnect Technology,” IEEE ElectronDevice Letters, vol. 17, No. 9, pp. 428-430, Sep. 1996. |
M. Hirano, et al., “Three-Dimensional Passive Elements for Compact GaAs MMICs,” IEICE Trans. Electron. (Japan), vol. E76C, No. 6, pp. 961-967, Jun. 1993. |
J.N. Burghartz, et al., “Monolithic Spiral Inductors Fabricated Using a VLSI Cu-Damascene Interconnect Technology and Low-Loss Substrates,” Tech. Dig. Int. Electron Devices Meeting (IEDM), 1996, pp. 99-102. |
C.W. Davidson, Transmission Lines for Communications, Wiley, New York, 1978, Section 1.3.3, pp. 13-18. |