Inductive arrangements or effects of, or between, wiring layers

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H01L23/5227

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5227Inductive arrangements or effects of, or between, wiring layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Transformer guard trace
- Patent number 12,176,285
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage electronic device with high relative permit...
- Patent number 12,170,164
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having different metal densities in different regions and m...
- Patent number 12,165,971
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor devices and stacked power supply topologies
- Patent number 12,154,937
- Issue date Nov 26, 2024
- Infineon Technologies Austria AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with patterned ground shielding
- Patent number 12,148,694
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly
- Patent number 12,148,556
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon transformer integrated chip
- Patent number 12,148,693
- Issue date Nov 19, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Tange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device and integrated passive device comprising magnetic...
- Patent number 12,142,561
- Issue date Nov 12, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for tuning via profile in dielectric material
- Patent number 12,136,644
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ferromagnetic-dielectric composite material
- Patent number 12,125,713
- Issue date Oct 22, 2024
- Ferric Inc.
- Michael Lekas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-aware metal fills for integrated circuit passive components
- Patent number 12,117,556
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Zeshan Ahmad
- G01 - MEASURING TESTING
Information Patent Grant
Asymmetric spiral inductor
- Patent number 12,112,878
- Issue date Oct 8, 2024
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer-type on-chip inductor structure
- Patent number 12,107,043
- Issue date Oct 1, 2024
- VIA LABS, INC.
- Sheng-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributing on chip inductors for monolithic voltage regulation
- Patent number 12,094,841
- Issue date Sep 17, 2024
- Oracle International Corporation
- Michael Henry Soltau Dayringer
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method for forming a device with an extended via semiconductor stru...
- Patent number 12,087,627
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage isolation barrier with electric overstress integrity
- Patent number 12,087,710
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Jeffrey A West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microcoil element, array-type microcoil element and device
- Patent number 12,073,967
- Issue date Aug 27, 2024
- SOUNDS GREAT CO., LTD.
- Hong-Da Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,062,608
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
- Patent number 12,062,641
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant inductive-capacitive isolated data channel
- Patent number 12,033,936
- Issue date Jul 9, 2024
- Texas Instruments Incorporated
- Klaas De Haan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor device and system
- Patent number 12,018,963
- Issue date Jun 25, 2024
- Melexis Bulgaria Ltd
- Hristo Angelov Hristov
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active under shielding for coils and transformers
- Patent number 12,014,981
- Issue date Jun 18, 2024
- Infineon Technologies AG
- Marcus Nuebling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system of forming integrated circuit
- Patent number 12,009,260
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ka Fai Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-insulator-metal (MIM) capacitor structure for layer count red...
- Patent number 12,009,292
- Issue date Jun 11, 2024
- QUALCOMM Incorporated
- Nosun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked spiral inductor
- Patent number 12,009,129
- Issue date Jun 11, 2024
- CSMC TECHNOLOGIES FAB2 CO., LTD.
- Congying Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having current-sensing coil
- Patent number 12,009,148
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alan Roth
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 12,002,785
- Issue date Jun 4, 2024
- Rohm Co., Ltd.
- Tomohira Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429159
- Publication date Dec 26, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DISTANCE MEASURING DEVICE
- Publication number 20240413077
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- TAKANORI OKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTING ON CHIP INDUCTORS FOR MONOLITHIC VOLTAGE REGULATION
- Publication number 20240404966
- Publication date Dec 5, 2024
- Oracle International Corporation
- Michael Henry Soltau Dayringer
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240387362
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING
- Publication number 20240387363
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFSOI SEMICONDUCTOR STRUCTURES INCLUDING AN ELECTROMAGNETIC SHIELD...
- Publication number 20240387399
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER AND MANUFACTURING METHOD THEREFOR
- Publication number 20240379650
- Publication date Nov 14, 2024
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qichang AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR TUNING VIA PROFILE IN DIELECTRIC MATERIAL
- Publication number 20240371915
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20240363604
- Publication date Oct 31, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240355728
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL COILS USED FOR ENERGY TRANSFER OVER ISOLATION REGION IN MUL...
- Publication number 20240347446
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Hermann GRUBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGE
- Publication number 20240347447
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR EMBEDDED IN A SUBSTRATE OF A SEMICONDUCTOR DEVICE
- Publication number 20240332170
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332171
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED REDISTRIBUTION LAYER INDUCTORS
- Publication number 20240321729
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Abhijeet PAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...
- Publication number 20240321730
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING AN INDUCTOR AND A PATTERNED SHIELD STR...
- Publication number 20240321936
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING CURRENT-SENSING COIL
- Publication number 20240321513
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY...
- Publication number 20240321724
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Doosoub SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Providing Supply Current To Dies In A System Using A...
- Publication number 20240312905
- Publication date Sep 19, 2024
- Altera Corporation
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS
- Publication number 20240312957
- Publication date Sep 19, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304510
- Publication date Sep 12, 2024
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-L...
- Publication number 20240304545
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT TRANSFORMER WITH CONCENTRIC WINDINGS AND MAGNETI...
- Publication number 20240296990
- Publication date Sep 5, 2024
- Infineon Technologies Austria AG
- Wolfgang FRANK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR DEVICE AND SYSTEM
- Publication number 20240295416
- Publication date Sep 5, 2024
- Melexis Bulgaria Ltd.
- Hristo Angelov HRISTOV
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH STACKED TRANSISTORS HAVING INDUCTORS AT BOT...
- Publication number 20240290779
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Xiang YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282748
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Tomohira KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL
- Publication number 20240274529
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Klaas De Haan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE
- Publication number 20240266283
- Publication date Aug 8, 2024
- VIA Labs, INC.
- Sheng-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Inductive arrangements or effects of, or between, wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transformer guard trace

Integrated high voltage electronic device with high relative permit...

Package having different metal densities in different regions and m...

Inductor devices and stacked power supply topologies

Semiconductor device with patterned ground shielding

Integrated magnetic assembly

Silicon transformer integrated chip

Integrated device and integrated passive device comprising magnetic...

Process for tuning via profile in dielectric material

Method for manufacturing ferromagnetic-dielectric composite material

Field-aware metal fills for integrated circuit passive components

Asymmetric spiral inductor

Multilayer-type on-chip inductor structure

Semiconductor device having an antenna arranged over an active main...

Distributing on chip inductors for monolithic voltage regulation

Method for forming a device with an extended via semiconductor stru...

High voltage isolation barrier with electric overstress integrity

Microcoil element, array-type microcoil element and device

Semiconductor packages

Integrated circuit including a first semiconductor wafer and a seco...

Resonant inductive-capacitive isolated data channel

Proximity sensor device and system

Semiconductor packages having a die, an encapsulant, and a redistri...

Active under shielding for coils and transformers

Method and system of forming integrated circuit

Metal-insulator-metal (MIM) capacitor structure for layer count red...

Stacked spiral inductor

Integrated circuit having current-sensing coil

Semiconductor device

Vertical inductor for WLCSP

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND DISTANCE MEASURING DEVICE

DISTRIBUTING ON CHIP INDUCTORS FOR MONOLITHIC VOLTAGE REGULATION

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING

RFSOI SEMICONDUCTOR STRUCTURES INCLUDING AN ELECTROMAGNETIC SHIELD...

FILTER AND MANUFACTURING METHOD THEREFOR

PROCESS FOR TUNING VIA PROFILE IN DIELECTRIC MATERIAL

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

SEMICONDUCTOR STRUCTURE

LATERAL COILS USED FOR ENERGY TRANSFER OVER ISOLATION REGION IN MUL...

METHOD OF FORMING SEMICONDUCTOR PACKAGE

INDUCTOR EMBEDDED IN A SUBSTRATE OF A SEMICONDUCTOR DEVICE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

INTEGRATED REDISTRIBUTION LAYER INDUCTORS

INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...

INTEGRATED DEVICE COMPRISING AN INDUCTOR AND A PATTERNED SHIELD STR...

INTEGRATED CIRCUIT HAVING CURRENT-SENSING COIL

METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY...

Techniques For Providing Supply Current To Dies In A System Using A...

INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS

SEMICONDUCTOR DEVICE

COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-L...

INTEGRATED CIRCUIT TRANSFORMER WITH CONCENTRIC WINDINGS AND MAGNETI...

PROXIMITY SENSOR DEVICE AND SYSTEM

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

INTEGRATED CIRCUIT WITH STACKED TRANSISTORS HAVING INDUCTORS AT BOT...

SEMICONDUCTOR DEVICE

RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL

MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE