The present disclosure relates to a basic electronic circuit. More particularly, the present disclosure relates to an inductor structure.
In an advanced manufacturing process, designs of spiral-shaped inductors or 8-shaped inductors are limited by the area of the chip, and moreover, the cost of spiral-shaped inductors and 8-shaped inductors is high. In addition, such inductors are close to a substrate such that coupling easily occurs between the inductors and the substrate, thereby significantly affecting the quality factor of the inductors.
In view of the foregoing, problems and disadvantages are associated with existing products that require further improvement. However, those skilled in the art have yet to find a solution.
In order to solve the problems mentioned above, one aspect of the present disclosure is directed to an inductor structure. The inductor structure includes a first curve metal component, a second curve metal component, a connection component, and a capacitor. The first curve metal component is disposed on a layer. The layer is located at a first plane, the first curve metal component is located at a second plane, and the first plane is perpendicular to the second plane. The second curve metal component is disposed on the layer. The second curve metal component is located at the second plane. The connection component is coupled to the first curve metal component and the second curve metal component. A first terminal of the connection component is coupled to a first terminal of the first curve metal component, and a second terminal of the connection component is coupled to a first terminal of the second curve metal component. A first terminal of the capacitor is coupled to a second terminal of the first curve metal component, and a second terminal of the capacitor is coupled to a second terminal of the second curve metal component.
In order to solve the problems mentioned above, one aspect of the present disclosure is directed to an inductor structure. The inductor structure includes a first curve metal component, a second curve metal component, and a connection component. The first curve metal component is disposed on a layer. The layer is located at a first plane, the first curve metal component is located at a second plane, and the first plane is perpendicular to the second plane. The second curve metal component is disposed on the layer. The second curve metal component is located at the second plane. The connection component is coupled to the first curve metal component and the second curve metal component. The connection component includes a first spiral-shaped inductor. A first terminal of the first curve metal component is coupled to a first terminal of the first spiral-shaped inductor, and a first terminal of the second curve metal component is coupled to a second terminal of the first spiral-shaped inductor.
In order to solve the problems mentioned above, one aspect of the present disclosure is directed to an inductor structure. The inductor structure includes a first curve metal component, a second curve metal component, a connection component, a first switch, and a second switch. The first curve metal component is disposed on a layer. The layer is located at a first plane, the first curve metal component is located at a second plane, and the first plane is perpendicular to the second plane. The second curve metal component is disposed on the layer. The second curve metal component is located at the second plane. The connection component is coupled to the first curve metal component and the second curve metal component. A first terminal of the first switch is coupled to a first terminal of the first curve metal component, and a second terminal of the first switch is coupled to a first terminal of a spiral-shaped inductor. A first terminal of the second switch is coupled to a first terminal of the second curve metal component, and a second terminal of the second switch is coupled to a second terminal of the spiral-shaped inductor. The connection component is coupled to a center-tapped terminal of the spiral-shaped inductor.
The disclosure can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:
Unless otherwise defined herein, scientific and technical terminologies employed in the present disclosure shall have the meanings that are commonly understood and used by one of ordinary skill in the art. Unless otherwise required by context, it should be understood that singular terms shall include plural forms of the same and plural terms shall include singular forms of the same.
In the following description, the terms “coupled” may be used to indicate that two or more elements are in direct physical or electrical contact with each other, or may also mean that two or more elements may be in indirect physical or electrical contact with each other. “Coupled” may still be used to indicate that two or more elements cooperate or interact with each other.
In one embodiment, the first curve metal component 110 and the second curve metal component 120 comprise first strip portions 113, 123 and second strip portions 114, 124 which are coupled to each other. The first strip portions 113, 123 and the second strip portions 114, 124 are disposed in a first direction and a second direction respectively. For example, the first strip portions 113, 123 are disposed in the first direction D1, and the second strip portions 114, 124 are disposed in the second direction D2. As shown in the figure, the first direction D1 is different from the second direction D2. For example, the angle between the first direction D1 and the XY plane is about 45 degrees, and the second direction D2 is roughly perpendicular to the XY plane. In addition, the first strip portions 113, 123 are located at one side of the inductor structure 100, and the second strip portions 114, 124 are located at another side of the inductor structure 100. In one embodiment, the connection component 130 is coupled to the first strip portion 113 of the first curve metal component 110 and the first strip portion 123 of the second curve metal component 120.
In one embodiment, the connection component 130 comprises a first connection unit 131 and a second connection unit 133. A first terminal of the first connection unit 131 is coupled to one terminal 112 of the first curve metal component 110, and a second terminal of the first connection unit 131 is coupled to one terminal 122 of the second curve metal component 120. A first terminal of the second connection unit 133 is coupled to one terminal 182 of the third curved metal component 180, and a second terminal of the second connection unit 133 is coupled to one terminal 192 of the fourth curved metal component 190. In another embodiment, the first curve metal component 110 is adjacent to the third curved metal component 180, and the second curve metal component 120 is adjacent to the fourth curved metal component 190. In still another embodiment, the first curve metal component 110, the third curved metal component 180, the second curve metal component 120 and the fourth curved metal component 190 are disposed sequentially. In yet another embodiment, another terminal 126 of the second curve metal component 120 is coupled to another terminal 186 of the third curved metal component 180 through a connection component 139, and the connection component 139 is configured to receive a power supply voltage VDD.
In one embodiment, the first curve metal component 110 is adjacent to the third curved metal component 180, and the second curve metal component 120 is adjacent to the fourth curved metal component 190. In another embodiment, the third curved metal component 180, the first curve metal component 110, the second curve metal component 120 and the fourth curved metal component 190 are disposed sequentially. In yet another embodiment, one terminal 116 of the first curve metal component 110 is coupled to one terminal 126 of the second curve metal component 120 through the connection component 139, and the connection component 139 is configured to receive the power supply voltage VDD.
In one embodiment, the first curve metal component 110 comprises a first pad 112, a second pad 116 and a first strip portion (comprising structures marked 113 and 114). A first terminal of the first strip portion is coupled to the first pad 112, and a second terminal of the first strip portion is coupled to the second pad 116. The second curve metal component 120 comprises a third pad 122, a fourth pad 126 and a second strip portion (comprising structures marked 123 and 124). A first terminal of the second strip portion is coupled to the third pad 122, and a second terminal of the second strip portion is coupled to the fourth pad 126. In another embodiment, the connection component 130 is configured to receive the power supply voltage VDD.
In another embodiment, a distance D3 from the first pad 112 to the second pad 116 is about 200 um to 300 um, and a distance D4 from the third pad 122 to the fourth pad 126 is about 200 um to 300 um. Each of the first strip portion (comprising structures marked 113 and 114) and the second strip portion (comprising structures marked 123 and 124) has a height H. The height H is from the pad 116, 126 to the top of the first strip portion or the second strip portion. The height H is about 150 um to 250 um. Moreover, the diameter of each of the first strip portion and the second strip portion is about 15 um to 35 um.
In view of the above embodiments of the present disclosure, it is apparent that the application of the present disclosure has the advantages as follows. Embodiments of the present disclosure provide an inductor structure to improve the problems related to designs of spiral-shaped inductors or 8-shaped inductors being limited by the area of the chip, and relate also to the cost of spiral-shaped inductors and 8-shaped inductors being high. Furthermore, embodiments of the present disclosure provide an inductor structure to improve the problems related to the inductors being close to a substrate such that coupling easily occurs between the inductors and the substrate to thereby significantly affect the quality factor of the inductors.
Although the present disclosure has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the present disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims.
Number | Date | Country | Kind |
---|---|---|---|
104142119 | Dec 2015 | TW | national |
This application is a Divisional Application of U.S. application Ser. No. 15/199,956, filed Jun. 30, 2016, which claims priority to Taiwan Application Serial Number 104142119, filed Dec. 15, 2015, which is herein incorporated by reference.
Number | Name | Date | Kind |
---|---|---|---|
6661325 | Suh et al. | Dec 2003 | B2 |
6775901 | Lee | Aug 2004 | B1 |
7023315 | Yeo et al. | Apr 2006 | B2 |
7501709 | Hool | Mar 2009 | B1 |
8110932 | Sjoestroem | Feb 2012 | B2 |
8183971 | Guillou et al. | May 2012 | B2 |
10305196 | Redd | May 2019 | B2 |
20050017352 | Lee | Jan 2005 | A1 |
20050167828 | Yeo | Aug 2005 | A1 |
20050285262 | Knapp | Dec 2005 | A1 |
20070128821 | Lee | Jun 2007 | A1 |
20090188104 | Ching et al. | Jul 2009 | A1 |
20090195325 | Menon | Aug 2009 | A1 |
20090236701 | Sun | Sep 2009 | A1 |
20100117737 | Kondo | May 2010 | A1 |
20110316657 | Park | Dec 2011 | A1 |
20120082194 | Tam | Apr 2012 | A1 |
20120105304 | Ma | May 2012 | A1 |
20120223796 | Huang | Sep 2012 | A1 |
20120249282 | Sin et al. | Oct 2012 | A1 |
20130099974 | Wang et al. | Apr 2013 | A1 |
20130299941 | Lee | Nov 2013 | A1 |
20140197918 | Kang | Jul 2014 | A1 |
20140253391 | Yen | Sep 2014 | A1 |
20160064140 | Cuoco | Mar 2016 | A1 |
20190181072 | Shojaie | Jun 2019 | A1 |
Number | Date | Country |
---|---|---|
101494112 | Jul 2009 | CN |
101752066 | Jun 2010 | CN |
102738128 | Oct 2012 | CN |
200701272 | Jan 2007 | TW |
201230086 | Jul 2012 | TW |
201237895 | Sep 2012 | TW |
Entry |
---|
China Patent Office, “Office Action”, dated Jan. 10, 2018. |
Number | Date | Country | |
---|---|---|---|
20210050147 A1 | Feb 2021 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 15199956 | Jun 2016 | US |
Child | 17086637 | US |