The present disclosure relates to inductors.
Inductors, which are passive elements that store electrical energy as magnetic energy, are used in, for example, DC-DC converter devices for the purpose of stepping up/down power supply voltage and smoothing direct current. An inductor is mounted, for example, on the surface of a circuit board or the like. For example, Patent Literature (PTL) 1 discloses an inductor including a body portion containing a magnetic material, a coil located inside the body portion, a terminal fitting connected to the coil, and the like. In the inductor described in PTL 1, the bottom surface of the body portion and the terminal fitting are fixed using an adhesive.
The conventional inductor may have low reliability due to low reliability of connection between the electrode member such as the terminal fitting and the body portion, the circuit board, or the like. In view of this, the present disclosure has an object of providing a highly reliable inductor.
An inductor according to an aspect of the present disclosure includes: a magnetic core containing a magnetic material and including a bottom surface, a top surface, and a side surface connected to the bottom surface and the top surface; a coil element including a coil portion buried in the magnetic core, and formed by a conductive wire; an electrode member containing a conductive material, located outside of the magnetic core, and electrically connected to the coil element; a first adhesive containing an adhesive resin material and adhering the magnetic core and the electrode member to each other; and a second adhesive containing an adhesive resin material and adhering the magnetic core and the electrode member to each other at a position different from the first adhesive, wherein the electrode member includes: a first bottom plate portion located on a same side as the bottom surface of the magnetic core to extend along the bottom surface, and overlapping the bottom surface in a plan view of the bottom surface; and a second bottom plate portion connected to the first bottom plate portion, and projecting from the side surface in the plan view of the bottom surface, the first adhesive is located between the first bottom plate portion and the bottom surface, and the second adhesive is located at a corner between an edge of the side surface closer to the bottom surface and the second bottom plate portion.
According to the present disclosure, a highly reliable inductor can be provided.
As mentioned above, in the inductor described in PTL 1, the bottom surface of the body portion which is the magnetic core and the terminal fitting which is the electrode member are fixed using an adhesive. The inductor is used, for example, in a state of being surface-mounted on a circuit board or the like.
In recent years, for example in the case of increasing the load capacity of a power supply device such as a DC-DC converter device, the diameter of the conductive wire forming the coil portion of the inductor may be increased. In such a case, the size of the magnetic core is increased, too. In the case where the size of the inductor is increased, simply fixing the electrode member to the bottom surface of the magnetic core using an adhesive as in PTL 1 does not provide sufficient connection strength, and a decrease in the reliability of connection between the electrode member and the magnetic core, such as a decrease in vibration resistance, is likely to ensue. In the case where the size of the inductor is increased, the heat capacity of the inductor (especially the magnetic core) increases. Accordingly, when connecting the electrode member of the inductor to the circuit board or the like by reflow soldering or the like, the solder does not melt easily by the heat of the reflow furnace, and the reliability of connection between the inductor and the circuit board or the like is likely to decrease. Thus, particularly in the case where the size of the inductor is increased due to, for example, the use of a thick conductive wire in the coil portion, the connection reliability of the inductor tends to decrease. Consequently, for example, the electrode member and the magnetic core or the circuit board are likely to separate from each other due to vibration, and the reliability of the inductor, such as the vibration resistance of the inductor, decreases.
The present disclosure has the following structure in order to implement a highly reliable inductor. Embodiments will be described in detail below with reference to the drawings.
The embodiments described below each show a specific example according to the present disclosure. The numerical values, shapes, materials, structural elements, the arrangement and connection of the structural elements, steps, the order of steps, etc. shown in the following embodiments are mere examples, and do not limit the scope of the present disclosure. Of the structural elements in the embodiments described below, the structural elements not recited in any one of the independent claims are described as optional structural elements.
In this specification, the terms indicating the relationships between elements, such as “parallel”, the terms indicating the shapes of elements, such as “rectangular parallelepiped”, and the numerical ranges are not expressions of strict meanings only, but are expressions of meanings including substantially equivalent ranges, for example, allowing for a difference of about several percent.
Each drawing is a schematic involving emphasis, omission, or proportion adjustment as appropriate to show the present disclosure and does not necessarily provide precise depiction, and accordingly may differ from the actual shapes, positional relationships, and proportions. The substantially same elements are given the same reference signs throughout the drawings, and repeated description may be omitted or simplified.
The X-axis, the Y-axis, and the Z-axis representing three directions orthogonal to one another are given in each drawing, and these axes and the axial directions along the axes are used for explanation as necessary. The axes are given for explanation, and do not limit the direction and position in which the inductor is used.
In this specification, the terms “top surface” and “bottom surface” in the structure of the inductor do not refer to the top surface (vertically upper surface) and the bottom surface (vertically lower surface) in absolute spatial recognition, but are used as terms defined by the relative positional relationship of the structural elements of the inductor.
The structure of an inductor according to an embodiment will be described below. The inductor is a passive element that stores electrical energy flowing through a coil element as magnetic energy.
In
As illustrated in
The following description mainly focuses on half of inductor 100 on the positive side of the X-axis. Half of inductor 100 on the negative side of the X-axis has the same structure as half of inductor 100 on the positive side of the X-axis, and the same description applies.
As illustrated in
Magnetic core 10 is the outer shell of inductor 100, and covers part of coil element 20. Magnetic core 10 contains a magnetic material, and is, for example, a dust core made of a metal magnetic powder and a resin material or the like. Magnetic core 10 is not limited as long as it is formed using a magnetic material. As the magnetic material, ferrite or any other magnetic material may be used. As the metal magnetic powder, a particulate material having a predetermined elemental composition, such as Fe—Si—Al-based, Fe—Si-based, Fe—Si—Cr-based, or Fe—Si—Cr—B-based, is used. As the resin material, a material that can maintain a certain shape by binding the particles of the metal magnetic powder while insulating the particles of the metal magnetic powder from each other, such as a silicone-based resin, is selected.
As illustrated in
As illustrated in
Each hole 15 is a bottomed hole having a bottom. Hole 15 is a bottomed hole recessed in a direction intersecting side surface 13a. In this embodiment, hole 15 is a bottomed hole recessed in a direction (X-axis direction) perpendicular to side surface 13a. The number of holes 15 is not limited, and is designed according to the purpose. For example, the plurality of holes 15 are arranged in a line in a direction (Y-axis direction) along the edge line between side surface 13a and bottom surface 11. In this embodiment, the plurality of holes 15 have the same shape. The opening shape of hole 15 is, for example, circular. The opening shape may be any other shape such as elliptical or polygonal with rounded corners. The size of the opening shape of hole 15 is not limited. In the case where the opening shape is circular, the diameter of the circle is, for example, 0.05 mm or more and 1 mm or less.
As illustrated in
Coil portion 21 is a part covered with magnetic core 10. Coil portion 21 is composed of a wound conductive wire, and functions as a coil. The number of turns of coil portion 21 is not limited, and is selected as appropriate according to the performance required of inductor 100 and the constraints such as the size of magnetic core 10, for example, from 0.5 turns to 10 turns. For example, the cross section of the conductive wire forming coil portion 21 is a circle with a diameter of 2 mm or more, and the aspect ratio of the cross section is 1:1. Coil portion 21 is buried in magnetic core 10 so that the winding axis of coil portion 21 will extend in the direction (Z-axis direction) connecting bottom surface 11 and top surface 12.
Each drawn portion 22 is connected to the corresponding end of wound coil portion 21 and extends from the end of coil portion 21 to the outside of magnetic core 10. Drawn portion 22 includes buried portion 22a buried in magnetic core 10 and exposed portion 22b that is not covered with magnetic core 10 but is drawn out from side surface 13c of magnetic core 10 and exposed. In
Buried portion 22a of one drawn portion 22 out of two drawn portions 22 is bent inside magnetic core 10. Two drawn portions 22 have the same height from bottom surface 11, and are drawn to the outside of magnetic core 10 from part of side surface 13c closer to top surface 12 to form exposed portion 22b. Exposed portion 22b is bent on the outside of magnetic core 10, and extends along side surface 13c in the direction (Z-axis direction) connecting bottom surface 11 and top surface 12. Exposed portion 22b extends to a point before reaching the end of side surface 13c on the bottom surface 11 side. Drawn portion 22 is electrically connected to electrode member 30 on the outside of magnetic core 10. That is, exposed portion 22b and electrode member 30 are electrically connected to each other. The position at which drawn portion 22 is drawn out from magnetic core 10 and the direction in which exposed portion 22b extends are not limited as long as drawn portion 22 is electrically connected to electrode member 30. At least part of exposed portion 22b may be flattened to facilitate connection with electrode member 30.
As illustrated in
Electrode member 30 contains a conductive material, and is composed of, for example, a metal material plate. The metal material plate is made of a metal material selected from metals such as aluminum, copper, silver, and gold, alloys containing one or more of these metals, materials consisting of metals or alloys and other substances, etc. For example, bottom plate portion 31 and connection plate portion 34 are names given to respective parts formed by working one member made of the same material. Electrode member 30 may be formed by connecting bottom plate portion 31 and connection plate portion 34 that are separate members.
Bottom plate portion 31 is a flat plate portion. For example, bottom plate portion 31 is soldered to a circuit board or the like, and current from the circuit board flows through bottom plate portion 31 to coil element 20. Bottom plate portion 31 is located on the bottom surface 11 side of magnetic core 10 so as to extend along bottom surface 11. The direction in which bottom plate portion 31 extends and the direction in which each of side surfaces 13a, 13b, 13c, and 13d extends intersect each other, specifically, are orthogonal to each other. Bottom plate portion 31 includes first bottom plate portion 32 and second bottom plate portion 33. For example, first bottom plate portion 32 and second bottom plate portion 33 are names given to respective different regions of bottom plate portion 31 which is one flat plate.
First bottom plate portion 32 is located on the bottom surface 11 side of magnetic core 10 so as to extend along bottom surface 11. First bottom plate portion 32 overlaps bottom surface 11 in a plan view of bottom surface 11. First bottom plate portion 32 is a region of bottom plate portion 31 that overlaps bottom surface 11 in a plan view of bottom surface 11.
First bottom plate portion 32 is connected to connection plate portion 34 at first end 32a which is the end of first bottom plate portion 32 on the side surface 13c side of magnetic core 10 (i.e. on the negative side of the Y-axis). Width W2 of second end 32b which is the end of first bottom plate portion 32 opposite to first end 32a, i.e. the end of first bottom plate portion 32 on the side surface 13d side of magnetic core 10 (i.e. on the positive side of the Y-axis), is less than width W1 of first end 32a. Herein, the term “width” denotes, for example, the length in the direction (X-axis direction) orthogonal to the direction connecting side surfaces 13c and 13d. The size relationship between width W1 of first end 32a and width W2 of second end 32b is not limited to the foregoing example. Width W1 and width W2 may be the same, or width W2 may be greater than width W1.
Second bottom plate portion 33 is connected to first bottom plate portion 32, extends in the X-axis direction, and is located side by side with first bottom plate portion 32 in the X-axis direction. Second bottom plate portion 33 does not extend along side surface 13a, and is separated from side surface 13a. Second bottom plate portion 33 projects from side surface 13a in a plan view of bottom surface 11. That is, second bottom plate portion 33 extends from side surface 13a in a direction outward from magnetic core 10, i.e. a direction away from side surface 13a, in a plan view of bottom surface 11. Second bottom plate portion 33 is a region of bottom plate portion 31 that projects in a direction outward from magnetic core 10 from a position corresponding to side surface 13a in a plan view of bottom surface 11. As a result of electrode member 30 including second bottom plate portion 33 that projects outward from side surface 13a, the heat of the reflow furnace or the like during soldering such as reflow soldering can be easily absorbed by second bottom plate portion 33.
Connection plate portion 34 is connected to first end 32a of first bottom plate portion 32, and extends in the direction (Z-axis direction) connecting bottom surface 11 and top surface 12. Connection plate portion 34 is electrically connected to exposed portion 22b via connection portion 40. Connection plate portion 34 includes first side plate portion 35 and second side plate portion 36.
First side plate portion 35 is connected to first end 32a of first bottom plate portion 32, and is located along side surface 13c. First side plate portion 35 is located between exposed portion 22b and magnetic core 10. Second side plate portion 36 is connected to an end of first side plate portion 35, and is raised in a direction away from magnetic core 10. The end of second side plate portion 36 is connected to exposed portion 22b via connection portion 40.
The shape of connection plate portion 34 is not limited as long as it can be connected to drawn portion 22 via connection portion 40.
As illustrated in
As illustrated in
First adhesive 50 contains an adhesive resin material. As first adhesive 50, a known adhesive containing a silicone-based resin, an epoxy-based resin, an acrylic-based resin, or the like may be used. Examples include thermosetting adhesives, photocurable adhesives, and two-part curable adhesives.
As illustrated in
Second adhesive 60 is elongated in the direction (Y-axis direction) of the edge line between side surface 13a and bottom surface 11. The length of the adhesion surface of second adhesive with side surface 13a in the direction (Z-axis direction) orthogonal to the edge line between side surface 13a and bottom surface 11 is, for example, equal to the length of the adhesion surface of second adhesive 60 with second bottom plate portion 33 in the direction (X-axis direction) orthogonal to the edge line between side surface 13a and bottom surface 11. Second adhesive 60 is, for example, in the shape of a fillet. A gap may be formed in a part between second adhesive 60 and side surface 13a or between second adhesive 60 and second bottom plate portion 33. Second adhesive 60 may be divided into a plurality of parts that are arranged at the corner between edge 14a of side surface 13a on the bottom surface 11 side and second bottom plate portion 33.
Second adhesive 60 enters each of the plurality of holes 15. That is, second adhesive 60 fills the plurality of holes 15. Second adhesive 60 is in contact with the surface of magnetic core 10 forming the plurality of holes 15. Second adhesive 60 need not completely fill the plurality of holes 15. For example, second adhesive 60 fills 10% or more of the volume of each of the plurality of holes 15. Second adhesive 60 may fill 50% or more of the volume of each of the plurality of holes 15.
Second adhesive 60 contains an adhesive resin material. As second adhesive 60, a known adhesive containing a silicone-based resin, an epoxy-based resin, an acrylic-based resin, or the like may be used. Examples include thermosetting adhesives, photocurable adhesives, and two-part curable adhesives. For example, the viscosity of second adhesive 60 before curing is higher than the viscosity of first adhesive 50 before curing. Hence, second adhesive 60 before curing is kept from flowing when applied between side surface 13a and second bottom plate portion 33, so that inductor 100 can be manufactured easily. Second adhesive 60 may be made of the same material as first adhesive 50. Since there is no need to use different adhesives for first adhesive 50 and second adhesive 60, inductor 100 can be manufactured easily.
The arrangement of the plurality of holes 15 will be described below.
As illustrated in
The plurality of holes 15 are arranged on both sides of perpendicular line V1, specifically, on the side surface 13c side of perpendicular line V1 (i.e. the negative side of the Y-axis) and on the side surface 13d side of perpendicular line V1 (i.e. the positive side of the Y-axis), in a plan view of bottom surface 11. The plurality of holes 15 are arranged in a symmetrical positional relationship with respect to perpendicular line V1 in a plan view of bottom surface 11.
As illustrated in
The arrangement of the plurality of holes 15 is not limited to the foregoing example. The plurality of holes 15 may be arranged at any positions on edge 14a of side surface 13a, and are designed according to the magnetic properties, strength, etc. required of inductor 100.
A method of manufacturing inductor 100 described above will be described below.
In the method of manufacturing inductor 100, first, a process of pressure molding magnetic core 10 together with coil element 20 is performed (Step S11). The process in Step S11 is performed by pressure molding a dust core so as to contain coil element 20 with coil portion 21 being wound and buried portion 22a of drawn portion 22 being bent by working the conductive wire in advance. For example, the pressure applied during pressure molding is 5 ton/cm 2, and the thermal curing temperature is 185° C. After the pressure molding, exposed portion 22b of drawn portion 22 exposed without being covered with magnetic core 10 protrudes perpendicularly to side surface 13c of magnetic core 10, for example.
Next, a process of adhering first bottom plate portion 32 of electrode member 30 in which bottom plate portion 31 and connection plate portion 34 are formed by cutting and bending a metal material plate in advance to bottom surface 11 of magnetic core 10 using first adhesive 50 is performed (Step S12). In Step S12, first adhesive 50 before curing is applied to at least one of the surface of first bottom plate portion 32 to be adhered to bottom surface 11 and bottom surface 11, and first bottom plate portion 32 and bottom surface 11 are bonded together to thus adhere first bottom plate portion 32 and bottom surface 11 to each other. Here, first bottom plate portion 32 and bottom surface 11 are adhered to each other in a state in which electrode member 30 and magnetic core 10 are in the positional relationship illustrated in
Next, a process of bending exposed portion 22b of drawn portion 22 exposed from magnetic core 10 so as to extend along side surface 13c is performed (Step S13). The insulating coating of the conductive wire in exposed portion 22b is removed by laser irradiation or the like before Step S13, for example.
Next, a process of welding the end of second side plate portion 36 of connection plate portion 34 and exposed portion 22b by laser seam welding or the like is performed (Step S14). Thus, connection portion 40 composed of the plurality of welds 41 is formed.
Next, a process of forming the plurality of holes 15 in edge 14a of side surface 13a of magnetic core 10 is performed (Step S15). The plurality of holes 15 are formed on side surfaces 13a and 13b of magnetic core 10 by, for example, laser processing or drilling. Step S15 may be performed at any timing after Step S11 and before next Step S16.
Next, a process of adhering edge 14a of side surface 13a and second bottom plate portion 33 using second adhesive 60 is performed (Step S16). In Step S16, second adhesive 60 before curing is applied to the corner between edge 14a of side surface 13a and second bottom plate portion 33 so that second adhesive 60 will enter holes 15 formed in Step S15. In Step S16, second adhesive 60 is cured by heating or the like according to need. The curing treatment in Step S12 and the curing treatment in Step S16 may be performed simultaneously.
Through the foregoing Steps S11 to S16, inductor 100 in which magnetic core 10 and electrode member 30 are adhered with first adhesive 50 and second adhesive 60 is manufactured.
As described above, inductor 100 according to this embodiment includes: magnetic core 10 containing a magnetic material and including bottom surface 11, top surface 12, and side surfaces 13a, 13b, 13c, and 13d connected to bottom surface 11 and top surface 12; coil element 20 including coil portion 21 buried in magnetic core 10, and formed by a conductive wire; an electrode member containing a conductive material, located outside of magnetic core 10, and electrically connected to coil element 20; first adhesive 50 containing an adhesive resin material and adhering magnetic core 10 and electrode member 30 to each other; and second adhesive 60 containing an adhesive resin material and adhering magnetic core 10 and electrode member 30 to each other at a position different from first adhesive 50. Electrode member 30 includes: first bottom plate portion 32 located on the bottom surface 11 side of magnetic core 10 to extend along bottom surface 11, and overlapping bottom surface 11 in a plan view of bottom surface 11; and second bottom plate portion 33 connected to first bottom plate portion 32, and projecting from side surface 13a in a plan view of bottom surface 11. First adhesive 50 is located between first bottom plate portion 32 and bottom surface 11. Second adhesive 60 is located at a corner between edge 14a of side surface 13a on the bottom surface 11 side and second bottom plate portion 33.
With this structure, magnetic core 10 and electrode member 30 are adhered and fixed to each other not only with first adhesive 50 but also with second adhesive 60. First adhesive 50 adheres bottom surface 11 of magnetic core 10 and electrode member 30 (specifically, first bottom plate portion 32) to each other, while second adhesive 60 adheres side surface 13a of magnetic core 10, which is a surface different from bottom surface 11, and electrode member 30 (specifically, second bottom plate portion 33) to each other. This keeps electrode member 30 and magnetic core 10 from separating from each other due to vibration and the like from various directions, so that the vibration resistance of inductor 100 can be improved.
In the case where the size of inductor 100 is increased, the heat capacity of magnetic core 10 is high. Accordingly, when soldering bottom plate portion 31 of electrode member 30 to a circuit board or the like by reflow soldering or the like, the solder does not melt easily. However, in inductor 100, since second bottom plate portion 33 projects from side surface 13a of magnetic core 10, the heat from the reflow furnace or the like can be easily absorbed by projecting second bottom plate portion 33 without being transferred to magnetic core 10. That is, the temperature of bottom plate portion 31 rises easily during heating in the reflow furnace or the like. As a result, the solder used for soldering bottom plate portion 31 melts easily, and the wettability of the solder is improved. The reliability of connection between inductor 100 and the circuit board can thus be improved.
In this way, highly reliable inductor 100 can be implemented.
Moreover, for example, magnetic core 10 has the plurality of holes 15 that are open on edge 14a, and second adhesive 60 enters the plurality of holes 15.
As a result of second adhesive 60 entering holes 15 formed in edge 14a of side surface 13a, the anchor effect is exerted and the adhesion strength between side surface 13a of magnetic core 10 and second adhesive 60 increases. This keeps electrode member 30 and magnetic core 10 from separating from each other due to vibration and the like, so that the vibration resistance of inductor 100 can be improved.
Moreover, for example, coil portion 21 is buried in magnetic core 10 in a state in which winding axis C of coil portion 21 is in the direction (Z-axis direction) connecting bottom surface 11 and top surface 12, and the plurality of holes 15 are located outside a region bounded by two virtual lines L1 and L2 that form angles of +10° and −10° with respect to a perpendicular line to side surface 13a passing through winding axis C of coil portion 21 and that pass through winding axis C, in a plan view of bottom surface 11.
With this structure, in the case where holes 15 are formed in magnetic core 10, holes 15 are located at at least a certain distance away from winding axis C of coil portion 21. Such holes 15 are unlikely to block the flow of the magnetic flux through magnetic core 10 generated by coil portion 21. Therefore, a decrease in the magnetic properties of inductor 100 can be suppressed while the vibration resistance of inductor 100 is enhanced by holes 15.
Moreover, for example, shortest distance D2 between the bottoms of the plurality of holes 15 and coil portion 21 is greater than shortest distance D1 between side surface 13a of magnetic core 10 and coil portion 21.
With this structure, in the case where holes 15 are formed in magnetic core 10, holes 15 are located at a distance greater than the shortest distance from outer surface 21a of coil portion 21 to side surface 13a. Such holes 15 are unlikely to block the flow of the magnetic flux through magnetic core 10 generated by coil portion 21. Therefore, a decrease in the magnetic properties of inductor 100 can be suppressed while the vibration resistance of inductor 100 is enhanced by holes 15.
Moreover, for example, coil element 20 includes drawn portion 22 connected to an end of coil portion 21 and extending from coil portion 21 to the outside of magnetic core 10, electrode member 30 includes connection plate portion 34 connected to first end 32a of first bottom plate portion 32 and electrically connected to drawn portion 22, and width W2 of second end 32b of first bottom plate portion 32 opposite to first end 32a is less than width W1 of first end 32a.
As a result of width W2 of second end 32b of first bottom plate portion 32 being reduced in this way, the heat capacity of first bottom plate portion 32 during soldering can be reduced, and heat transfer from first bottom plate portion 32 to magnetic core 10 having high heat capacity can be suppressed. Therefore, the temperature of bottom plate portion 31 rises easily during heating in the reflow furnace or the like, and the wettability of the solder used for soldering bottom plate portion 31 can be improved. Since second end 32b of first bottom plate portion 32 is far from connection plate portion 34, less current flows between coil element 20 and the circuit board on the second end 32b side. Hence, even when width W2 of second end 32b is narrow and the resistance around second end 32b increases, the current flowing to coil element 20 is affected little. The reliability of connection between inductor 100 and the circuit board can thus be improved while suppressing a decrease in the properties of inductor 100.
An inductor according to each variation of the embodiment will be described below. The following description of each variation mainly focuses on the differences from the embodiment, and the description of common parts is omitted or simplified.
First, Variation 1 of the embodiment will be described below.
As illustrated in
Magnetic core 110 has the same structure as magnetic core 10 except that it has the plurality of holes 115 instead of the plurality of holes 15.
The plurality of holes 115 are open on edge 14a of side surface 13a on the bottom surface 11 side. The plurality of holes 115 are each an elongated hole having an opening shape that extends in a direction (Y-axis direction) along bottom surface 11 when viewed facing side surface 13a.
Not all of the plurality of holes 115 need to be elongated holes, and the plurality of holes 115 may include holes having the same shape as holes 15, for example. The plurality of holes 115 may each be an elongated hole having an opening shape extending in a direction other than the Y-axis direction, for example, the direction (Z-axis direction) connecting bottom surface 11 and top surface 12.
As described above, in inductor 101, at least one hole 115 out of the plurality of holes 115 is an elongated hole having an opening shape extending in the direction along bottom surface 11.
As a result of hole 115 being an elongated hole, the anchor effect by second adhesive 60 entering hole 115 is higher than in the case where the opening shape of the hole is circular or the like, and the adhesion strength between side surface 13a of magnetic core 110 and second adhesive 60 increases. This keeps electrode member 30 and magnetic core 110 from separating from each other due to vibration and the like, so that the vibration resistance of inductor 101 can be improved.
Next, Variation 2 of the embodiment will be described below.
As illustrated in
Magnetic core 210 has the same structure as magnetic core 10 except that it has the plurality of holes 215a, 215b, 215c, and 215d instead of the plurality of holes 15.
The depth of hole 215b is greater than the width of the opening of hole 215b in the direction (Y-axis direction) along bottom surface 11 when viewed facing side surface 13a. The same applies to holes 215c and 215d.
The depth of each of the plurality of holes 215a, 215b, 215c, and 215d is greater when the hole is farther from perpendicular line V1 to side surface 13a passing through winding axis C in a plan view of bottom surface 11. That is, the hole depth increases in the order of holes 215a, 215b, 215c, and 215d arranged along bottom surface 11 in the direction away from perpendicular line V1.
As described above, in inductor 102, the depth of each of holes 215b, 215c, and 215d out of the plurality of holes 215a, 215b, 215c, and 215d is greater than the width of the opening of hole in the direction along bottom surface 11.
As a result of holes 215b, 215c, and 215d being greater in depth than in width, the anchor effect by second adhesive 60 entering holes 215b, 215c, and 215d is higher than in the case where the holes are not greater in depth than in width, and the adhesion strength between side surface 13a of magnetic core 210 and second adhesive increases. This keeps electrode member 30 and magnetic core 210 from separating from each other due to vibration and the like, so that the vibration resistance of inductor 102 can be improved.
For example, in inductor 102, the depth of each of the plurality of holes 215a, 215b, 215c, and 215d is greater when the hole is farther from perpendicular line V1 to side surface 13a passing through winding axis C of coil portion 21 in a plan view of bottom surface 11.
With this structure, of the plurality of holes 215a, 215b, 215c, and 215d, a hole farther from perpendicular line V1 is deeper, and the anchor effect is enhanced as a result of second adhesive 60 entering the hole. Of the plurality of holes 215a, 215b, 215c, and 215d, a hole closer to winding axis C of coil portion 21 where the magnetic flux is more likely to be affected is shallower. Such a plurality of holes 215a, 215b, 215c, and 215d are unlikely to block the flow of the magnetic flux through magnetic core 210 generated by coil portion 21. Therefore, a decrease in the magnetic properties of inductor 102 can be suppressed while the vibration resistance of inductor 102 is enhanced by the plurality of holes 215a, 215b, 215c, and 215d.
Next, Variation 3 of the embodiment will be described below.
As illustrated in
Magnetic core 310 has the same structure as magnetic core 10 except that it has the plurality of holes 315a, 315b, and 315c instead of the plurality of holes 15.
The width of the opening of each of the plurality of holes 315a, 315b, and 315c in the direction (Y-axis direction) along bottom surface 11 when viewed facing side surface 13a is greater when the hole is farther from perpendicular line V1 to side surface 13a passing through winding axis C. That is, the hole opening width increases in the order of holes 315a, 315b, and 315c arranged along bottom surface 11 in the direction away from perpendicular line V1.
Moreover, the depth of each of the plurality of holes 315a, 315b, and 315c is greater when the hole is farther from perpendicular line V1 to side surface 13a passing through winding axis C in a plan view of bottom surface 11, as in inductor 102.
As described above, in inductor 103, the width of the opening of each of the plurality of holes 315a, 315b, and 315c in the direction along bottom surface 11 is greater when the hole is farther from perpendicular line V1 to side surface 13a passing through winding axis C of coil portion 21 in a plan view of bottom surface 11.
With this structure, of the plurality of holes 315a, 315b, and 315c, a hole farther from perpendicular line V1 contributes to a greater anchor effect as a result of second adhesive 60 entering the hole. Of the plurality of holes 315a, 315b, and 315c, a hole closer to winding axis C of coil portion 21 where the magnetic flux is more likely to be affected has a smaller opening width in the direction along bottom surface 11. Such a plurality of holes 315a, 315b, and 315c are unlikely to block the flow of the magnetic flux through magnetic core 310 generated by coil portion 21. Therefore, a decrease in the magnetic properties of inductor 103 can be suppressed while the vibration resistance of inductor 103 is enhanced by the plurality of holes 315a, 315b, and 315c.
Next, Variation 4 of the embodiment will be described below.
As illustrated in
As illustrated in
Magnetic core 410 may have the plurality of holes according to any one of Variations 1 to 3 of the embodiment, instead of the plurality of holes 15.
As described above, in inductor 104, the height from bottom surface 411 to each of the plurality of holes 15 is less than the height from bottom surface 411 to coil portion 21.
In the case where the plurality of holes 15 are formed in magnetic core 410, coil portion 21 is closer to top surface 12 than the plane along bottom surface 411 where the plurality of holes 15 are located. Such holes 15 are unlikely to block the flow of the magnetic flux through magnetic core 410 generated by coil portion 21. Therefore, a decrease in the magnetic properties of inductor 104 can be suppressed while the vibration resistance of inductor 104 is enhanced by holes 15.
Next, Variation 5 of the embodiment will be described below.
As illustrated in
Electrode member 530 includes raised piece 537 in addition to the structure of electrode member 30.
Raised piece 537 is located on the magnetic core 10 side of second bottom plate portion 33. Raised piece 537 is connected to second bottom plate portion 33, and extends in the direction (Z-axis direction) from bottom surface 11 toward top surface 12 along side surface 13a. Raised piece 537 is formed, for example, by cutting part of bottom plate portion 31 and bending and raising it. Raised piece 537 may be formed by separately producing a member having the shape of raised piece 537 and connecting the member to second bottom plate portion 33.
Raised piece 537 has opening 538 as a through hole in the direction (X-axis direction) toward side surface 13a. Opening 538 is formed in a region where at least one hole 15 out of the plurality of holes 15 is located when viewed facing side surface 13a. Opening 538 is formed by inner surfaces 537a, 537b, and 537c of raised piece 537 and surface 33a of second bottom plate portion 33. Hence, opening 538 is located directly above second bottom plate portion 33.
The opening shape of opening 538 is, for example, rectangular, but may be any other shape such as semi-circular. Opening 538 may be surrounded only by the inner surfaces of raised piece 537. In inductor 105, second adhesive 60 enters the plurality of holes 15 and also enters opening 538, and is in contact with and adhere to inner surfaces 537a, 537b, and 537c of raised piece 537 forming opening 538.
Inductor 105 may include the magnetic core according to any one of Variations 1 to 4 of the embodiment, instead of magnetic core 10.
As described above, in inductor 105, electrode member 530 includes raised piece 537 connected to second bottom plate portion 33 and extending in the direction from bottom surface 11 toward top surface 12 along side surface 13a. Raised piece 537 has opening 538 in a region where at least one hole 15 out of the plurality of holes 15 is located when viewed facing side surface 13a. Second adhesive 60 enters opening 538, and is in contact with inner surfaces 537a, 537b, and 537c of raised piece 537 forming opening 538.
As a result of second adhesive 60 entering opening 538 of raised piece 537 connected to second bottom plate portion 33, second adhesive 60 is in contact with not only surface 33a of second bottom plate portion 33 but also inner surfaces 537a, 537b, and 537c of raised piece 537. Therefore, even when surface 33a separates from second adhesive 60, the adhesion between second adhesive 60 and inner surfaces 537a, 537b, and 537c prevents magnetic core 10 and electrode member 530 from separating from each other.
Moreover, since opening 538 corresponds in position to the region where at least one hole 15 is located, second adhesive 60 entering opening 538 also enters hole 15. Accordingly, when magnetic core 10 tries to separate from electrode member 530 in the Z-axis direction or the Y-axis direction, second adhesive 60 is caught in both hole 15 and opening 538, so that the separation between magnetic core 10 and electrode member 530 can be further prevented.
While the inductors, etc. according to the embodiment and variations of the present disclosure have been described above, the present disclosure is not limited to such embodiment and variations. Other modifications obtained by applying various changes conceivable by a person skilled in the art to the embodiment and variations and any combinations of the elements in different embodiment and variations without departing from the scope of the present disclosure are also included in the scope of the present disclosure.
For example, although the foregoing embodiment and variations describe the case where the magnetic core has a plurality of holes, the present disclosure is not limited to such. The number of holes in the magnetic core may be one. That is, the magnetic core may have one or more holes. The magnetic core may have no hole, and the second adhesive may adhere the edge of the side surface of the magnetic core having no hole and the second bottom plate portion to each other.
For example, an electric product or an electric circuit using the inductor described above is also included in the present disclosure. Examples of the electric product include power supply devices including the above-described inductor and various devices including the power supply devices.
The inductor according to the present disclosure is useful as an inductor used in various devices and equipment.
Number | Date | Country | Kind |
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2020-196882 | Nov 2020 | JP | national |
This application is the U.S. National Phase under 35 U.S.C. § 371 of International Patent Application No. PCT/JP2021/042198, filed on Nov. 17, 2021, which in turn claims the benefit of Japanese Patent Application No. 2020-196882, filed on Nov. 27, 2020, the entire disclosures of which applications are incorporated by reference herein.
Filing Document | Filing Date | Country | Kind |
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PCT/JP2021/042198 | 11/17/2021 | WO |