Various embodiments of the inventions described herein relate to the field of proximity sensors, and components, devices, systems and methods associated therewith.
Optical proximity sensors, such as the AVAGO TECHNOLOGIES™ HSDL-9100 surface-mount proximity sensor, the AVAGO TECHNOLOGIES™ APDS-9101 integrated reflective sensor, the AVAGO TECHNOLOGIES™ APDS-9120 integrated optical proximity sensor, and the AVAGO TECHNOLOGIES™ APDS-9800 integrated ambient light and proximity sensor, are known in the art. Such sensors typically comprise an integrated high efficiency infrared emitter or light source and a corresponding photodiode or light detector, and are employed in a large number of hand-held electronic devices such as mobile phones, Personal Data Assistants (“PDAs”), laptop and portable computers, portable and handheld devices, amusement and vending machines, industrial automation machinery and equipment, contactless switches, sanitary automation machinery and equipment, and the like.
Referring to
As further shown in
Many optical proximity sensors generally include a metal shield, such as shield or housing 18 of the type shown in
The amount of reflected, diffracted or refracted IR radiation and undesired crosstalk or interference between light emitter 16 and light detector 12 may also be exacerbated by the presence of a window disposed above sensor 10, which in some applications is provided as part of a portable or other type of electronic device in which proximity sensor 10 is housed and mounted.
As will now be seen, at least some optical proximity sensors of the prior art rely upon the use of an externally mounted metal shield 18, which is required to reduce the amount of crosstalk or interference that might otherwise occur between LED 16 and light detector 12, as well as to help increase the detection distance of the device. Metal shields 18 are quite small, however, making them difficult to manufacture in high volumes, and thus expensive to fabricate. Such metal shields 18 also generally require expensive automated equipment to attach same to sensors 10 in a mass production setting. Moreover, the quality of metal shields 18 often varies, and issues commonly arise with suppliers being unable to meet the tight dimensional tolerances required for such small devices. Metal shields 18 can also detach from sensor 10, thereby adding another failure point for sensor 10.
What is need is an optical proximity sensor design that eliminates the need to include a metal shield 18, but which retains high crosstalk and interference rejection characteristics so that an optical proximity sensor can be provided that features improved performance, lower cost, increased manufacturability and improved reliability.
In some embodiments, there is provided an optical proximity sensor comprising an infrared light emitter operably connected to and driven by a light emitter driving circuit, a light detector operably connected to and driven by a detector sensing circuit, a first component disposed over and covering at least portions of the light emitter and comprising first external surfaces thereof, and a second component disposed over and covering at least portions of the light detector and comprising second external surfaces thereof, the first and second components being separated at least partially by a gap disposed therebetween, wherein the sensor is configured such that at least a first portion of light emitted by the light detector passes through a portion of the first component, at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through a portion of the second component for detection by the light detector, a layer of infrared attenuating or blocking material is disposed over at least portions of the first and second external surfaces located adjacent to the gap, and the infrared attenuating or blocking material is configured to attenuate or block substantially the transmission of undesired direct, scattered or reflected infrared light between the light emitter and the light detector and thereby minimize optical crosstalk and interference between the light emitter and the light detector.
In other embodiments, there is provided a method of making an optical proximity sensor comprising mounting an infrared light emitter on a substrate, mounting an infrared light detector on the substrate, the infrared light detector being spaced apart from the infrared light emitter on the substrate, forming or placing a first infrared light pass component over at least portions of the light emitter, the first infrared light pass component comprising first external surfaces, forming or placing a second infrared light pass component over at least portions of the light detector such that at least portions of the first and second components are separated by a gap, the second infrared light pass component comprising second external surfaces, and forming or placing a layer of infrared light attenuating or blocking material over at least portions of the first and second external surfaces located adjacent to the gap, the infrared light attenuating material being configured to attenuate or block substantially the transmission of undesired direct, scattered or reflected infrared light between the light emitter and the light detector and thereby minimize optical crosstalk and interference between the light emitter and the light detector.
Further embodiments are disclosed herein or will become apparent to those skilled in the art after having read and understood the specification and drawings hereof.
Different aspects of the various embodiments of the invention will become apparent from the following specification, drawings and claims in which:
The drawings are not necessarily to scale. Like numbers refer to like parts or steps throughout the drawings, unless otherwise noted.
Referring now to
Light rays transmitted through optically transmissive material or first component 31 and originating from light emitter 16, and other reflected, diffracted or refracted IR radiation, might, but for the presence of layers 33, leak across to light detector 12 through optically transmissive material 32 (or second component 32), which would manifest itself as undesired crosstalk or interference between light emitter 16 and light detector 12 and thereby degrade the performance of proximity sensor 10.
According to one embodiment, first and second molded optically transmissive infrared light pass components 31 and 32 are formed using an infrared-pass and optically transmissive transfer molding compound such as NITTO DENKO™ NT-8506 clear transfer molding compound or PENCHEM Technologies™ OP 579 infrared pass optoelectronic epoxy. Other suitable optically transmissive epoxies, plastics, polymers or other materials may also be employed. In some embodiments, and as discussed in further detail below, optically transmissive infrared light pass components 31 and 32 are molded during the same manufacturing step, or may be molded separately. See Technical Data Sheet NT-8506 entitled “Clear Transfer Molding Compound NT-8506” dated 2001 and PENCHEM OP 579 IR Pass Optoelectronic Epoxy Data Sheet, Revision 1, dated April, 2009, both of which documents are hereby incorporated by reference herein, each in its respective entirety.
Referring now to
Continuing to refer to
Referring now to
One material suitable for application on the external surfaces of sensor 10 to form layers 33 is an ink manufactured in Singapore under the name “DIC SCREEN INK,” product Number 21-S175, having the designation “Safire Black.” This material was tested by applying same to the external surfaces of an AVAGO TECHNOLOGIES APDS-9900 proximity sensor manufactured in accordance with the foregoing description regarding the first, second, third and fourth components, and the application of layers 33 to the external surfaces thereof. A Data Sheet entitled “APDS-9900 AND APDS-9901 Digital Proximity and Ambient Light Sensor” published by Avago Technologies on Mar. 23, 2011 is hereby incorporated by reference herein, in its entirety.
Note that in
At step 150 in
Included within the scope of the present invention are methods of making and having made the various components, devices and systems described herein.
Various embodiments of the invention are contemplated in addition to those disclosed hereinabove. The above-described embodiments should be considered as examples of the present invention, rather than as limiting the scope of the invention. In addition to the foregoing embodiments of the invention, review of the detailed description and accompanying drawings will show that there are other embodiments of the invention. Accordingly, many combinations, permutations, variations and modifications of the foregoing embodiments of the invention not set forth explicitly herein will nevertheless fall within the scope of the invention.
This application claims priority and other benefits from, and is a continuation-in-part of, U.S. patent application Ser. No. 12/495,739 filed Jun. 30, 2009 entitled “Optical Proximity Sensor Package with Molded Infrared Light Rejection Barrier and Infrared Pass Components” to Costello et al. (hereafter “the '739 patent application”). The '739 patent application is also incorporated by reference herein, in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
5155777 | Angelopoulos et al. | Oct 1992 | A |
5367393 | Ohara et al. | Nov 1994 | A |
5567953 | Horinouchi et al. | Oct 1996 | A |
5675143 | Heimlicher | Oct 1997 | A |
5760390 | Vezzalini et al. | Jun 1998 | A |
5811797 | Kobachi et al. | Sep 1998 | A |
6064062 | Bohn | May 2000 | A |
6135816 | Mashiyama et al. | Oct 2000 | A |
6180881 | Isaak | Jan 2001 | B1 |
6364706 | Ando et al. | Apr 2002 | B1 |
6572410 | Volstorf et al. | Jun 2003 | B1 |
6635955 | Scheidle | Oct 2003 | B2 |
6674653 | Valentine | Jan 2004 | B1 |
6677934 | Blanchard | Jan 2004 | B1 |
6740862 | Paritsky et al. | May 2004 | B2 |
6771671 | Fields et al. | Aug 2004 | B1 |
6855933 | Stone et al. | Feb 2005 | B2 |
6885300 | Johnston et al. | Apr 2005 | B1 |
7026710 | Coyle et al. | Apr 2006 | B2 |
7172126 | Schmidt et al. | Feb 2007 | B2 |
7229295 | Ice et al. | Jun 2007 | B2 |
7256483 | Epler et al. | Aug 2007 | B2 |
7258264 | Ice et al. | Aug 2007 | B2 |
7277012 | Johnston et al. | Oct 2007 | B2 |
7289142 | Silverbrook | Oct 2007 | B2 |
7348536 | Bockel et al. | Mar 2008 | B2 |
7387033 | Qing et al. | Jun 2008 | B2 |
7387907 | Hsu et al. | Jun 2008 | B2 |
7427806 | Arndt et al. | Sep 2008 | B2 |
7485818 | Chou | Feb 2009 | B2 |
7510888 | Guenther et al. | Mar 2009 | B2 |
7514666 | Yee et al. | Apr 2009 | B2 |
7582513 | Kroeninger et al. | Sep 2009 | B2 |
7675132 | Waitl et al. | Mar 2010 | B2 |
7755029 | Tang et al. | Jul 2010 | B2 |
7767485 | Ogawa et al. | Aug 2010 | B2 |
7851246 | Camacho | Dec 2010 | B2 |
8026472 | Arnold | Sep 2011 | B2 |
8031174 | Hamblin et al. | Oct 2011 | B2 |
8097852 | Yao | Jan 2012 | B2 |
8143608 | Yao et al. | Mar 2012 | B2 |
8207517 | Wang et al. | Jun 2012 | B2 |
8275922 | Barrett et al. | Sep 2012 | B2 |
8420999 | Costello et al. | Apr 2013 | B2 |
8575537 | Yao et al. | Nov 2013 | B2 |
20020172472 | Nelson et al. | Nov 2002 | A1 |
20040065894 | Hashimoto et al. | Apr 2004 | A1 |
20050088900 | Chan | Apr 2005 | A1 |
20050110157 | Sherrer et al. | May 2005 | A1 |
20050199786 | Yoshida et al. | Sep 2005 | A1 |
20060016994 | Basoor et al. | Jan 2006 | A1 |
20060017069 | Bergmann | Jan 2006 | A1 |
20060022212 | Waitl et al. | Feb 2006 | A1 |
20060022215 | Arndt et al. | Feb 2006 | A1 |
20060049533 | Kamoshita | Mar 2006 | A1 |
20060118807 | Ives et al. | Jun 2006 | A1 |
20070045524 | Rains et al. | Mar 2007 | A1 |
20070072321 | Sherrer et al. | Mar 2007 | A1 |
20070085157 | Fadell | Apr 2007 | A1 |
20070246646 | Lum et al. | Oct 2007 | A1 |
20080006762 | Fadell et al. | Jan 2008 | A1 |
20080011939 | Yee et al. | Jan 2008 | A1 |
20080011940 | Zhang et al. | Jan 2008 | A1 |
20080012033 | Arndt | Jan 2008 | A1 |
20080049210 | Takaoka | Feb 2008 | A1 |
20080116379 | Teder | May 2008 | A1 |
20080118241 | TeKolste et al. | May 2008 | A1 |
20080165115 | Herz et al. | Jul 2008 | A1 |
20080173790 | Cheng et al. | Jul 2008 | A1 |
20080173963 | Hsu et al. | Jul 2008 | A1 |
20080179503 | Camargo et al. | Jul 2008 | A1 |
20080197376 | Bert et al. | Aug 2008 | A1 |
20080223934 | Havens | Sep 2008 | A1 |
20080265266 | Bogner et al. | Oct 2008 | A1 |
20080296478 | Hernoult | Dec 2008 | A1 |
20080308738 | Li et al. | Dec 2008 | A1 |
20080308917 | Pressel et al. | Dec 2008 | A1 |
20090027652 | Chang et al. | Jan 2009 | A1 |
20090057799 | Chan et al. | Mar 2009 | A1 |
20090101804 | Le | Apr 2009 | A1 |
20090129783 | Ori et al. | May 2009 | A1 |
20090159900 | Basoor | Jun 2009 | A1 |
20090168088 | Rosenblatt | Jul 2009 | A1 |
20090267173 | Takahashi et al. | Oct 2009 | A1 |
20100030039 | Lamego et al. | Feb 2010 | A1 |
20100171027 | Yun | Jul 2010 | A1 |
20100246771 | Hawver et al. | Sep 2010 | A1 |
20100282951 | Costello et al. | Nov 2010 | A1 |
20100327164 | Costello | Dec 2010 | A1 |
20110024627 | Yao | Feb 2011 | A1 |
20110057102 | Yao | Mar 2011 | A1 |
20110057104 | Yao et al. | Mar 2011 | A1 |
20110057129 | Yao et al. | Mar 2011 | A1 |
20110121181 | Costello et al. | May 2011 | A1 |
20110204233 | Costello et al. | Aug 2011 | A1 |
20110297831 | Yao et al. | Dec 2011 | A1 |
20120070145 | Wong et al. | Mar 2012 | A1 |
20120160994 | Costello et al. | Jun 2012 | A1 |
Number | Date | Country |
---|---|---|
1743886 | Aug 2006 | CN |
1832217 | Sep 2006 | CN |
1455564 | Sep 2004 | EP |
2486000 | Jun 2012 | GB |
63308973 | Dec 1988 | JP |
11242926 | Sep 1999 | JP |
2006-114737 | Apr 2006 | JP |
2006-261380 | Sep 2006 | JP |
2008-181097 | Aug 2008 | JP |
2008-265187 | Nov 2008 | JP |
2009032571 | Feb 2009 | JP |
2009-137528 | Jun 2009 | JP |
WO-2006045531 | May 2006 | WO |
WO 2008078806 | Jul 2008 | WO |
WO 2009072786 | Jun 2009 | WO |
WO-2012068213 | May 2012 | WO |
Entry |
---|
Agilent HSDL-9100 Miniature Surface-Mount Proximity Sensor Data Sheet, Aug. 26, 2004. |
APDS-9900 and APDS-9901 Digital Proximity and Ambient Light Sensor, Mar. 23, 2011. |
APDS-9120 Integrated Optical Sensors Preliminary Datasheet. |
APDS-9800 Integrated Ambient Light and Proximity Sensors Data Sheet, Mar. 21, 2011. |
Technical Data Sheet NT-MB-IRL3801, Nirtto Denko Corporation, 2008. |
Penchem OP 580 IR Filtyer Optoelectronic Epoxy, Apr. 2009. |
“Agilent HSDL-9100 Miniature Surface-Mount Proximity Sensor Data Sheet”, Dec. 21, 2007. |
Avago Technologies, “Avago Technologies Announces Ultra-Thin Integrated Ambient Light and Proximity Sensor Module for Use in Mobile Phones”, Wireless Design and Development Nov. 27, 2009. |
Avago Technologies, “APDS-9005 Miniature Surface-Mount Ambient Light Photo Sensor”, Jan. 2007. |
Avago Technologies, “APDS-9101—Integrated Reflective Sensor”, Data Sheet 2007. |
Avago Technologies, “APDS-9700 Signal Conditioning IC for Optical Proximity Sensors”, Jan. 4, 2008. |
Avago Technologies, “HSDL-9100—Surface-Mount Proximity Sensor”, Data Sheet 2006. |
Avago Technologies, “Integrated Optical Proximity Sensors Prelim Datasheet”, APDS-9120 Feb. 25, 2009. |
AZ Optics, “Device Debuts as the World's Best-Performing Integrated Light/Proximity Sensor”, Nov. 11, 2008. |
Costello, “U.S. Appl. No. 12/495,739”, Optical Proximity Sensor Package with Molded Infrared Light Rejection Barrier and Infrared Pass Components Jun. 30, 2009. |
IDES—The Plastic Web, “Si Photo Diode Chip”, Dec. 19, 2007. |
Ishihara, “A Dual Face Package Using a Post with Wire Components: Novel Structure for PoP Wafer Level CSP and Compact Image Sensor Package”, Electronic Components and Technology Conference 2008 , 1093-1098. |
Khamal, Ibrahim “Infra-Red Proximity Sensor (II)”, Apr. 4, 2008. |
Losee, “A ⅓ Format Image Sensor with Refractory Metal Light Shield for Color Video Applications”, Solid State Circuits Conference, Digest of Technical Papers, 36th ISSCC, IEEE International Volume. Feb. 1989, 90-91. |
Nitto Denko Corporation, “Technical Data Sheet”, NT-8506 2001. |
Penchem Technologies Data Sheet, “Penchem OP 579”, IR Pass Optoelectronic Epoxy Apr. 2009. |
Tan, “U.S. Appl. No. 12/623,767”, Ifrared Proximity Sensor Package with Improved Crosstalk Isolation, filed Nov. 23, 2009, 30 pages. |
Tyntek, “Data Sheet for AlGaAs/GaAs Infrared Chip”, TK116IRA Nov. 2006. |
Tyntek, “Data Sheet for AlGaAs/GaAs Infrared Chip”, TK 114IRA Mar. 2004. |
Tyntek, “Data Sheet for Si Photo-diode Chip”, TK 043PD Jun. 2004. |
Tyntek, “Si Photo-Diode Chip—TK043PD Data Sheet”, Dec. 19, 2007. |
Xydar, “G-930—Solvay Advanced Polymers—Liquid Crystal Polymer Data Sheet”, reproduced from website at www.ides.com/grades/ds/E22219.htm on Dec. 17, 2007. |
“A4 Masking Sheet—A4 Masking Sheet”, Downloaded from website: <http://www.stix2.com.au/a4-masking-sheet-13/a4-masking-sheet.html> 2012, Product Description. |
“Altera 40/100 Gigabit Ethernet”, Altera Corporation Product Sheet Copyright 1995-2012, 3 pages. |
“Altera's 10-Gbps Ethernet (XAUI) Solution”, Altera Corporation Product Sheet , Copyright 1995-2012, 2 pages. |
“Nordson Ink-Dot I.D. System”, Nordson Corporation Product Sheet 2012, 2 pages. |
“SerialLite II Protocol”, Altera Reference Manual Oct. 2005, 84 pages. |
Morgavi, Paul , “Panasonic Print Head Technology and Market Applications”, IMI Europe, Digital Printing Conferences 2007, Presentation, Nov. 7 to 9, 2007, 24 pages. |
Number | Date | Country | |
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20110204233 A1 | Aug 2011 | US |
Number | Date | Country | |
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Parent | 12495739 | Jun 2009 | US |
Child | 13098436 | US |