Claims
- 1. An infrared sensitive material comprising a polymeric semiconductor compound having an infrared absorption band crosslinked with a spiropyran capable of producing a visible absorption band, wherein the material is adapted to produce a visible image when exposed to infrared radiation during use.
- 2. The infrared sensitive material of claim 1 wherein the semiconductor compound, when exposed to infrared radiation, is adapted to transfer charges to the spiropyran during use, thereby producing the visible image by changing the absorption and birefringence of the material during use.
- 3. The infrared sensitive material of claim 2 wherein the semiconductor compound, when exposed to infrared radiation, is adapted to generate the charges transferred to the spiropyran during use.
- 4. The infrared sensitive material of claim 1 wherein the semiconductor compound, when exposed to infrared radiation, is adapted to transfer charges to the spiropyran to produce a ring opening in the spiropyran during use, thereby generating a visible absorption band in the material during use.
- 5. A film comprising the infrared sensitive material of claim 1.
- 6. A film comprising the infrared sensitive material of claim 1 wherein the film is between about 0.1 and 20 microns thick.
- 7. A film comprising the infrared sensitive material of claim 1 wherein the film is between about 5 and 15 microns thick.
- 8. The infrared sensitive material of claim 1 wherein the polymeric semiconductor compound comprises a polydiacetylene.
- 9. An infrared sensitive material comprising a polymenc semiconductor compound having an infrared absorption band crosslinked with a spiropyran capable of producing a visible absorption band, wherein the material is adapted to produce a visible image when exposed to infrared radiation during use, and wherein the polymenc semiconductor compound comprises a polythiophene.
- 10. An infrared sensitive material comprising a polymenc semiconductor compound having an infrared absorption band crosslinked with a spiropyran capable of producing a visible absorption band, wherein the material is adapted to produce a visible image when exposed to infrared radiation during use, and wherein the polymenc semiconductor compound comprises a polyvinylcarbazole.
- 11. An infrared sensitive material comprising a polymenc semiconductor compound having an infrared absorption band crosslinked with a spiropyran capable of producing a visible absorption band, wherein the material is adapted to produce a visible image when exposed to infrared radiation during use, and wherein the polymenc semiconductor compound comprises a polypyrrole.
- 12. An infrared sensitive material comprising a polymenc semiconductor compound having an infrared absorption band crosslinked with a spiropyran capable of producing a visible absorption band, wherein the material is adapted to produce a visible image when exposed to infrared radiation during use, and wherein the material is polymerized and oriented by a Langmuir-Blodgett method.
- 13. An infrared sensitive material comprising a polymeric semiconductor compound having an infrared absorption band crosslinked with a spiropyran capable of producing a visible absorption band, wherein the material is adapted to produce a visible image when exposed to infrared radiation during use, which comprises a plurality of commonly oriented monomolecular layers.
- 14. An infrared sensitive material comprising a polymeric semiconductor compound having an infrared absorption band crosslinked with a spiropyran capable of producing a visible absorption band, wherein the material is adapted to produce a visible image when exposed to infrared radiation during use and wherein the material is oriented by application of an electric field and polymerized.
Parent Case Info
This is a continuation of application Ser. No. 07/973,026, filed Nov. 6, 1992, now U.S. Pat. No. 5,434,032.
GOVERNMENT RIGHTS
This invention was made in part with government support. The U.S. government has certain rights to the invention disclosed herein.
US Referenced Citations (3)
Continuations (1)
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Number |
Date |
Country |
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973026 |
Nov 1992 |
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