Claims
- 1. A method of slicing silicon, the method comprising the steps of:i) mounting a cylindrical silicon ingot block on an ingot support device, and then ii) slicing the cylindrical silicon ingot block, wherein the ingot support device is produced by molding a molding material comprising an acrylic resin and one or more inorganic fillers selected from the group consisting of aluminum hydroxide, barium sulphate, barium carbonate, calcium carbonate, and silica.
- 2. A method of slicing silicon, the method comprising the steps of:i) mounting a cylindrical silicon ingot block on an ingot support device, and then ii) slicing the cylindrical silicon ingot block, wherein the ingot support device is produced by molding a molding material comprising an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminum hydroxide, barium sulphate, barium carbonate, calcium carbonate, and silica.
- 3. A combination for slicing silicon, the combination comprising:i) a cylindrical silicon ingot block mounted on ii) an ingot support device, wherein the ingot support device is produced by molding a molding material comprising an acrylic resin and one or more inorganic fillers selected from the group consisting of aluminum hydroxide, barium sulphate, barium carbonate, calcium carbonate, and silica.
- 4. A combination for slicing silicon, the combination comprising:i) a cylindrical silicon ingot block mounted on ii) an ingot support device, wherein the ingot support device is produced by molding a molding material comprising an unsaturated polyester resin and one ore more inorganic fillers selected from the group consisting of aluminum hydroxide, barium sulphate, barium carbonate, calcium carbonate, and silica.
Parent Case Info
This application is a divisional of Ser. No. 09/264,236 filed Mar. 8, 1999.
US Referenced Citations (9)
Foreign Referenced Citations (1)
Number |
Date |
Country |
11099518 |
Apr 1999 |
JP |