Claims
- 1. A kit comprising:a polymerizable composition, wherein the polymerizable composition comprises: at least one polymerizable monomer, and at least one decomplexer; and an initiator component, wherein the initiator component comprises: a complexed amidine initiator, and an optional diluent.
- 2. A bonding composition comprising the polymerizable composition of the kit of claim 1 mixed with the respective initiator component of the kit of claim 1.
- 3. A substrate at least partially coated with the bonding composition of claim 2.
- 4. The substrate of claim 3, wherein the substrate comprises a low surface energy substrate.
- 5. A bonded article comprising:a first substrate, a second substrate, and a polymerized bonding composition of claim 2 that adhesively bonds the first and second substrates together.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a divisional of U.S. application Ser. No. 09/433,236, filed Nov. 4, 1999, now U.S. Pat. No. 6,410,667, the disclosure of which is incorporated herein by reference.
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