BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic representation of a modified vacuum chamber according to the invention, including a plasma treater with a plasma-gas source past the metal-evaporation stage of a conventional process in order to passivate the top side of the metal layer deposited over a web running from a feed roller to a take-up roller in the vacuum chamber.
FIG. 2 is a schematic representation of the same vacuum chamber of FIG. 1 wherein the plasma treater of the invention is placed in a separate, higher-pressure zone of the chamber.