Patent Application
20110300815
In the field of telecommunications, there is a trend to reduce both the size and the expenses associated with infrastructure equipment. The result is a demand on telecommunications infrastructure equipment providers to manufacture smaller equipment that can be operated and maintained in a more cost effective manner, while retaining all the functionality of legacy equipment. The modularity of designs proposed for such equipment, along with the desire of equipment operators to be able to quickly change out modular components with minimal impact on service availability, has introduced new thermal management challenges for dissipating heat generated by telecommunications infrastructure equipment.
For the reasons stated above and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the specification, there is a need in the art for improved systems for modular equipment mounting in telecommunications system.
The Embodiments of the present invention provide methods and systems for cooling electronics equipment enclosures, and will be understood by reading and studying the following specification.
In one embodiment, a locking mechanism for securing a module within an electronics enclosure comprises: a lever arm component rotatably coupled to a first side of an electronics module and a second side of the electronics module that opposes the first side, wherein the lever arm component rotates about a first axis that passes through the electronics module; a first latching arm component including a first latching hook, the first latching arm component rotatably coupled to the lever arm component on the first side of the electronics module, wherein the first latching arm component rotates about a second axis that run parallel to and offset from the first axis; a second latching arm component including a second latching hook, the second latching arm component rotatably coupled to the lever arm component on the second side of the electronics module, wherein the second latching arm component rotates about the second axis that runs parallel to and offset from the first axis; and at least one secondary fastener coupled to the electronics module. The first axis and second axis are oriented in an over-center configuration such that when the lever arm component is rotated about the first axis from a first position to a second position, the second axis will pass through a locking axis. When the lever arm component is rotated about the first axis from the first position to the second position, the first latching hook and the second latching hook apply a force against at least a first hook mechanism of the electronics enclosure that presses the electronics module against a heat sink of the electronics enclosure.
Embodiments of the present invention can be more easily understood and further advantages and uses thereof more readily apparent, when considered in view of the description of the preferred embodiments and the following figures in which:
In accordance with common practice, the various described features are not drawn to scale but are drawn to emphasize features relevant to the present invention. Reference characters denote like elements throughout figures and text.
In the following detailed description, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of specific illustrative embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that logical, mechanical and electrical changes may be made without departing from the scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense.
This disclosure describes improved systems for modular equipment mounting in telecommunications system. Embodiments of the present invention described herein provide means for removing heat from modularized telecommunications electronics, particularly modules comprising high power amplifiers used in wireless telecommunications, while also providing a means for quickly and securely mounting such modules within an electronics enclosure. Further, one or more embodiments of the present invention described herein further provide means that assist a technicians in carrying and handling such modules during the installation or removal process.
Solutions provided by embodiments of the present invention provide a mounting mechanism in the form of a lever arm component of an electronics module that is designed to provide a force onto a hook feature that secures a heat transferring surface of the electronics module to a heat sink feature of an electronics enclosure that houses the electronics module. The lever arm component provides a means for amplifying the force exerted by the technician when latching the electronics module to the heat sink, increasing the force that holds the electronics module to the heat sink to provide for a correspondingly better thermal connection between the two, thus improving thermal performance. The lever arm components further spans the width of the module and to serve as a handle that provides a gripping point for the module. Once installed into the electronics enclosure the handle provided by the lever arm tucks out of the way so that no portion of the lever arm protrudes above the upper surface or past any side surface of the module. This ensures that sufficient clearance is provided so that the enclosure doors can be sealed once the module is installed.
Electronics module 110 is installed within an enclosure 130, such as shown in
The high power electronic components 115 are located within electronics module 110 such that they either directly or indirectly establish a heat transferring interface 140 that facilitates the transfer of thermal energy generated by the components 115 to the heat sink 132. Heat sink 132, in turn, facilitates dissipation of that thermal energy to the external environment surrounding the enclosure 130. In one embodiment, the heat transferring interface 140 comprises part of the device body of the high power electronic components 115. In one embodiment, either the heat transferring interface 140 or the heat sink 132 further comprises a thermal phase-change material, or other thermally conducting material.
In order to secure electronics module 110 within enclosure 130 so that the heat transferring interface 140 of module 110 is firmly in contact with heat sink 132, the embodiment shown in
Mounting mechanism 120 secures electronics module 110 onto heat sink 132 by engaging the latching hooks 124 and 124′, and secondary fastener 125, with corresponding hook mechanism 142 and 144 located on heat sink 132. In one embodiment, hook mechanism 142 and 144 are continuous extruded metal components mounted in parallel to the length of heat sink 132 from approximately upper panel 134 towards lower panel 136. In one embodiment secondary fastener 125 is also an extruded metal component running the width of module 110.
The lever arm component 122 and latching arm components 123 and 123′ are coupled together, and to the module 110 using an “over-center” dual pivot-axis configuration. The lever arm component 122 spans the width of module 110 from the first side of module 110 to the second side of module 110. The lever arm component 122 is coupled to the module 110 at pivot points 160 and 160′. The pivot points 160 and 160′ are aligned to form a first axis of rotation for lever arm component 122 about module 110. The latching arm components 123 and 123′ are each respectively coupled to the lever arm component 122 at a pivot point 164 and 164′. Pivot points 164, 164′ form a second axis or rotation that is offset from the first axis formed by pivot points 160, 160′ such that the pivot points 164, 164′ will rotate about pivot points 160, 160′ via an arced path as lever arm component 122 is operated.
In operation, electronics module 110 is installed by first engaging secondary fastener 125 into the heat sink's second hook mechanism 144. With the lever arm component 122 rotated into a disengaged position (that is, clockwise as viewed from
In alternate embodiments the electronics enclosure 130 is sized to accommodate one or more additional electronics modules such as module 110. In one such embodiment, these additional modules are installed onto heat sink 132 using the same heat sink hook mechanisms 142 and 144 described above for mounting module 110.
As shown in
In one embodiment, in operation, de-installation of electronics module 110 is performed by rotating the lever arm component 122 to disengage the latching mechanism 120 and rotating electronics module 110 to disengage secondary fastener 125 from heat sink hook 144. When electronics module 110 is not installed in enclosure 130, lever arm component 122 functions as a handle for holding and carrying the electronics module 110. In one embodiment, electronics module 110 weight approximately 16-18 pounds. Accordingly, in one embodiment, the hardware for implementing mounting mechanism 120 is specified to support the weight of electronics module 110 when carried by lever arm component 122.
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement, which is calculated to achieve the same purpose, may be substituted for the specific embodiment shown. This disclosure is intended to cover any adaptations or variations of the present invention. Therefore, it is manifestly intended that this invention be limited only by the claims and the equivalents thereof.
