Selection of materials, or shaping, to facilitate cooling or heating

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/36Selection of materials, or shaping, to facilitate cooling or heating

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including plurality of gate fingers with vario...
- Patent number 12,249,543
- Issue date Mar 11, 2025
- Sumitomo Electric Industries, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,249,570
- Issue date Mar 11, 2025
- Rohm Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, assembly structure and method for manufacturing...
- Patent number 12,249,583
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal contacts at periphery of integrated circuit packages
- Patent number 12,249,553
- Issue date Mar 11, 2025
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooler and semiconductor apparatus
- Patent number 12,249,556
- Issue date Mar 11, 2025
- Fuji Electric Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 12,249,551
- Issue date Mar 11, 2025
- Infineon Technologies AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic device assemblies having an electrically insulatin...
- Patent number 12,249,554
- Issue date Mar 11, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated substrate structure
- Patent number 12,249,567
- Issue date Mar 11, 2025
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,243,799
- Issue date Mar 4, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with lid and method for forming the same
- Patent number 12,243,800
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor device assemblies and systems with imp...
- Patent number 12,243,801
- Issue date Mar 4, 2025
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate and circuit module using th...
- Patent number 12,243,841
- Issue date Mar 4, 2025
- TDK Corporation
- Toshiyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with submount includi...
- Patent number 12,243,796
- Issue date Mar 4, 2025
- Nichia Corporation
- Tadaaki Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to control the solder thickness for double sid...
- Patent number 12,243,845
- Issue date Mar 4, 2025
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motor controller heat dissipating systems and methods
- Patent number 12,245,408
- Issue date Mar 4, 2025
- Lyft, Inc.
- Adam Christopher Bender
- B60 - VEHICLES IN GENERAL
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 12,243,791
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inverter device
- Patent number 12,243,790
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Yosuke Miyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stack of split graphics processing logic dies
- Patent number 12,243,797
- Issue date Mar 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,243,798
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jae-Min Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,243,828
- Issue date Mar 4, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device
- Patent number 12,237,268
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for managing heat distribution in a semiconduc...
- Patent number 12,238,898
- Issue date Feb 25, 2025
- Ciena Corporation
- Charles Baudot
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 12,237,245
- Issue date Feb 25, 2025
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including wiring substrate having multiple sig...
- Patent number 12,237,254
- Issue date Feb 25, 2025
- Renesas Electronics Corporation
- Keita Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having supportive plating structures
- Patent number 12,237,275
- Issue date Feb 25, 2025
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 12,237,277
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with stacked printed circuit boards
- Patent number 12,230,622
- Issue date Feb 18, 2025
- Mediatek Inc.
- Ya-Lun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for heat dissipation of semiconductor devices
- Patent number 12,230,550
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- S. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079254
- Publication date Mar 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Po-Yuan SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE GRAPHENE PAD BORDERED WITH PROTECTIVE FILM AND...
- Publication number 20250079256
- Publication date Mar 6, 2025
- Suzhou Nanyi Technology Co., LTD
- Nan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079413
- Publication date Mar 6, 2025
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250079319
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jeongseok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079338
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079253
- Publication date Mar 6, 2025
- Kabushiki Kaisha Toshiba
- Kento ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION SHEET FOR CHIP ON FILM, INSULATION CHIP ON FILM PACKAGE...
- Publication number 20250079252
- Publication date Mar 6, 2025
- AMOGREENTECH CO., LTD.
- In Yong SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...
- Publication number 20250079275
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang SCHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF
- Publication number 20250079255
- Publication date Mar 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20250079264
- Publication date Mar 6, 2025
- ZF Friedrichshafen AG
- Shaozhi Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250079323
- Publication date Mar 6, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Li LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, POWER SUPPLY SYSTEM, VEHICLE, AND PHOTOVOLTAIC SYSTEM
- Publication number 20250070055
- Publication date Feb 27, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Fengqun Lang
- B60 - VEHICLES IN GENERAL
Information Patent Application
THERMAL SPREADER
- Publication number 20250069978
- Publication date Feb 27, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Hardeep Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250069979
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250069981
- Publication date Feb 27, 2025
- Mitsubishi Electric Corporation
- Shogo TOKUMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250070070
- Publication date Feb 27, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Mirko BERNARDONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC SUBSTRATE HAVING CENTRAL SECTION WITH VERTICALLY STACKED FUNCTIO...
- Publication number 20250070005
- Publication date Feb 27, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Stefano Sergio OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20250070030
- Publication date Feb 27, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069980
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
- Publication number 20250070032
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070057
- Publication date Feb 27, 2025
- Fuji Electric Co., Ltd.
- Hiroaki ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070074
- Publication date Feb 27, 2025
- Fuji Electric Co., Ltd.
- Hiroaki HOKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES AND METHODS FOR ASSEMBLING POWER MODULES
- Publication number 20250070093
- Publication date Feb 27, 2025
- MURATA MANUFACTURING CO., LTD.
- Laurence McGarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250062174
- Publication date Feb 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A FILM SUBSTRATE
- Publication number 20250062178
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kyoungsuk YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250062241
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062282
- Publication date Feb 20, 2025
- DENSO CORPORATION
- SHINGO TSUCHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062298
- Publication date Feb 20, 2025
- JCET Group Co., Ltd.
- Yaojian LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062180
- Publication date Feb 20, 2025
- DENSO CORPORATION
- Hiroshi UKEGAWA
- H01 - BASIC ELECTRIC ELEMENTS

Selection of materials, or shaping, to facilitate cooling or heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including plurality of gate fingers with vario...

Semiconductor device

Package structure, assembly structure and method for manufacturing...

Thermal contacts at periphery of integrated circuit packages

Cooler and semiconductor apparatus

Power semiconductor device

Power electronic device assemblies having an electrically insulatin...

Manufacturing method of integrated substrate structure

Electronic packages with integral heat spreaders

Package structure with lid and method for forming the same

Substrates for semiconductor device assemblies and systems with imp...

Electronic component embedded substrate and circuit module using th...

Method for manufacturing semiconductor device with submount includi...

Method and structure to control the solder thickness for double sid...

Motor controller heat dissipating systems and methods

3D semiconductor device and structure with metal layers and memory...

Semiconductor package

Semiconductor device and inverter device

3D stack of split graphics processing logic dies

Semiconductor device and method of fabricating the same

Microelectronic assemblies having topside power delivery structures

Integrated circuit semiconductor device

Method and apparatus for managing heat distribution in a semiconduc...

Flexible electronic structure including a support element

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Semiconductor device including wiring substrate having multiple sig...

Semiconductor devices having supportive plating structures

Package structure and methods of manufacturing the same

Electronic device with stacked printed circuit boards

Structures and methods for heat dissipation of semiconductor devices

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

POWER MODULE AND POWER CONVERSION APPARATUS

THERMALLY CONDUCTIVE GRAPHENE PAD BORDERED WITH PROTECTIVE FILM AND...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

INSULATION SHEET FOR CHIP ON FILM, INSULATION CHIP ON FILM PACKAGE...

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...

ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF

SEMICONDUCTOR POWER MODULE

ELECTRONIC DEVICE

POWER MODULE, POWER SUPPLY SYSTEM, VEHICLE, AND PHOTOVOLTAIC SYSTEM

THERMAL SPREADER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...

IC SUBSTRATE HAVING CENTRAL SECTION WITH VERTICALLY STACKED FUNCTIO...

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER MODULES AND METHODS FOR ASSEMBLING POWER MODULES

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING A FILM SUBSTRATE

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR DEVICE