Selection of materials, or shaping, to facilitate cooling or heating

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/36Selection of materials, or shaping, to facilitate cooling or heating

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Patents Grantslast 30 patents

Information Patent Grant
Module
- Patent number 12,205,862
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including monolithic silicon struct...
- Patent number 12,205,865
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 12,205,915
- Issue date Jan 21, 2025
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-noise heat exchanger
- Patent number 12,207,443
- Issue date Jan 21, 2025
- Dell Products L.P.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable logic device with fine-grained disaggregation
- Patent number 12,206,410
- Issue date Jan 21, 2025
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-cooling semiconductor resistor and manufacturing method thereof
- Patent number 12,205,863
- Issue date Jan 21, 2025
- MONTAGE TECHNOLOGY CO., LTD.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials for the interior, center, and exterior...
- Patent number 12,205,864
- Issue date Jan 21, 2025
- G2F TECH CO., LTD.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,892
- Issue date Jan 21, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF circuit module and manufacturing method therefor
- Patent number 12,199,083
- Issue date Jan 14, 2025
- Murata Manufacturing Co., Ltd.
- Masayuki Aoike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor assemblies including vertically integrated circuits a...
- Patent number 12,199,001
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging stacked substrates and an integrated circuit die using a...
- Patent number 12,199,003
- Issue date Jan 14, 2025
- MARVELL ASIA PTE. LTD.
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure containing embedded silicon-less link chiplet
- Patent number 12,199,025
- Issue date Jan 14, 2025
- Chengdu ECHINT Technology Co., Ltd.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics card including multi-chip module
- Patent number 12,199,080
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,199,002
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,199,004
- Issue date Jan 14, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interposer
- Patent number 12,199,026
- Issue date Jan 14, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and extraction system for extracting an electronic device fr...
- Patent number 12,200,901
- Issue date Jan 14, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device with a supporting member and bonded metal layers
- Patent number 12,191,223
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Xiaopeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,191,224
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package design
- Patent number 12,191,225
- Issue date Jan 7, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,191,279
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal, semiconductor element and semiconductor device
- Patent number 12,191,372
- Issue date Jan 7, 2025
- FLOSFIA INC.
- Ryohei Kanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating substrate comprising diamond and semiconductor int...
- Patent number 12,191,227
- Issue date Jan 7, 2025
- Electronics and Telecommunications Research Institute
- Hyung Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board module
- Patent number 12,193,143
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya Hosotani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with dummy MIM capacitor die
- Patent number 12,183,723
- Issue date Dec 31, 2024
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT
- Publication number 20250020874
- Publication date Jan 16, 2025
- Intel Corporation
- Todd R. COONS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP SIDE COOLING FOR POWER AMPLIFIER MODULE
- Publication number 20250022765
- Publication date Jan 16, 2025
- Qorvo US, Inc.
- Miles Larkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20250022774
- Publication date Jan 16, 2025
- Altera Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022766
- Publication date Jan 16, 2025
- Vanguard International Semiconductor Corporation
- Hsiu-Mei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022843
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna-in-Package Devices and Methods of Making
- Publication number 20250023227
- Publication date Jan 16, 2025
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE STRUCTURE
- Publication number 20250022767
- Publication date Jan 16, 2025
- SDP Global (China) Co., Ltd.
- TIAN-XUN LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING A SEMICONDUC...
- Publication number 20250022768
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM BLOCK ASSEMBLY
- Publication number 20250014962
- Publication date Jan 9, 2025
- PURPLE CLOUD DEVELOPMENT PTE. LTD.
- HSIANG-CHIEH TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...
- Publication number 20250015028
- Publication date Jan 9, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250015063
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20250015123
- Publication date Jan 9, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250014956
- Publication date Jan 9, 2025
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014963
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIES AND METHOD OF FORMING THE SAME
- Publication number 20250015050
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Yuan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...
- Publication number 20250015002
- Publication date Jan 9, 2025
- AOI ELECTRONICS CO., LTD.
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING RING STRUCTURE AND METHODS OF FORMING T...
- Publication number 20250006572
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006582
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION AND PROTECTION OF COMPUTING COMPONENTS FROM LIQUID IMMERS...
- Publication number 20250008637
- Publication date Jan 2, 2025
- Casey Jamesen Carte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
- Publication number 20250006583
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE
- Publication number 20250006602
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...
- Publication number 20250006496
- Publication date Jan 2, 2025
- ADVANCED MICRO DEVICES, INC.
- CHIA CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE
- Publication number 20250006600
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...
- Publication number 20250006569
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250006584
- Publication date Jan 2, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER HAVING SEAL MEMBER BETWEEN POWER SEMI-CONDUCTOR AND INVERT...
- Publication number 20250007363
- Publication date Jan 2, 2025
- American Axle & Manufacturing, Inc.
- Christopher D. Pump
- H01 - BASIC ELECTRIC ELEMENTS

Selection of materials, or shaping, to facilitate cooling or heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Module

Semiconductor device assemblies including monolithic silicon struct...

Microelectronic package with solder array thermal interface materia...

Low-noise heat exchanger

Programmable logic device with fine-grained disaggregation

Self-cooling semiconductor resistor and manufacturing method thereof

Thermal interface materials for the interior, center, and exterior...

Semiconductor device

Multi-die package structures including redistribution layers

RF circuit module and manufacturing method therefor

3D semiconductor devices and structures with metal layers

Electronic package and manufacturing method thereof

Systems and methods for non-overlap enforcement for inverter for el...

Semiconductor assemblies including vertically integrated circuits a...

Packaging stacked substrates and an integrated circuit die using a...

Interposer structure containing embedded silicon-less link chiplet

Electronics card including multi-chip module

Semiconductor package and method of manufacturing the same

Electronic packages with integral heat spreaders

Flexible interposer

Method and extraction system for extracting an electronic device fr...

Semiconductor device with a supporting member and bonded metal layers

Semiconductor package and manufacturing method thereof

Ball grid array package design

Integrated circuit packages and methods of forming the same

Crystal, semiconductor element and semiconductor device

Semiconductor device including surface pressure absorbing member fo...

Heat dissipating substrate comprising diamond and semiconductor int...

Circuit board module

Semiconductor package with dummy MIM capacitor die

Patents Applicationslast 30 patents

STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT

POWER MODULE STRUCTURE

TOP SIDE COOLING FOR POWER AMPLIFIER MODULE

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Antenna-in-Package Devices and Methods of Making

CHIP-ON-FILM PACKAGE STRUCTURE

METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING A SEMICONDUC...

COOLING SYSTEM BLOCK ASSEMBLY

SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

DUMMY DIES AND METHOD OF FORMING THE SAME

SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...

PACKAGE STRUCTURE INCLUDING RING STRUCTURE AND METHODS OF FORMING T...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ISOLATION AND PROTECTION OF COMPUTING COMPONENTS FROM LIQUID IMMERS...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE

REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...

SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE

METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

INVERTER HAVING SEAL MEMBER BETWEEN POWER SEMI-CONDUCTOR AND INVERT...