Integrated circuit cell library for multiple patterning

Abstract

A method is disclosed for defining a multiple patterned cell layout for use in an integrated circuit design. A layout is defined for a level of a cell in accordance with a dynamic array architecture so as to include a number of layout features. The number of layout features are linear-shaped and commonly oriented. The layout is split into a number of sub-layouts for the level of the cell. Each of the number of layout features in the layout is allocated to any one of the number of sub-layouts. Also, the layout is split such that each sub-layout is independently fabricatable. The sub-layouts for the level of the cell are stored on a computer readable medium.

Description

BACKGROUND

In modern semiconductor fabrication, optical lithography is used to pattern layout features onto a semiconductor wafer. Current step-and-repeat optical lithography systems and step-scan-and-repeat optical lithography systems use illumination sources with wavelengths of 365 nanometers (nm) (Hg Mine), 248 nm (KrF B-X excimer laser), and 193 nm (ArF B-X excimer laser). Historically, it has been possible to use illumination wavelengths larger than the layout feature sizes to be patterned. However, as layout feature sizes continue to decrease without a corresponding decrease in available illumination wavelength, the difference between the smallest wavelength and smallest layout feature size has become too large for successful lithographic rendering of the features. For example, lithographers are having great difficulty patterning 65 nm layout feature sizes with the 193 nm illumination source. Moreover, layout feature sizes are expected to continue to decrease from 65 nm to 45 nm, and on to 32 nm.

Lithographers use the following formula from Lord Rayleigh to estimate the optical system capability: resolution (half-pitch)=k₁λ/NA, where k₁ is a fitting variable roughly corresponding to a process window, λ is the illumination wavelength, and NA is the numerical aperture of the lithographic system. When the wavelength λ was larger than the half-pitch, typical values for k₁ were over 0.50. Because the feature size has been decreasing by a factor of 0.7 for each technology node, the value of k₁ has been steadily decreasing for each technology node, while the wavelength λ has been constant, and the NA has been increasing by only 1.1 to 1.2 per technology node step. Additionally, for a NA greater than about 0.93, immersion systems are needed in which water replaces air as the medium between the final lens and the photoresist on the wafer. These immersion systems are expected to support a NA up to about 1.35, with no clear, cost-effective solution thereafter.

In view of the foregoing, a solution is needed to enable patterning of nano-scale feature sizes without having to further decrease illumination wavelength λ and/or further increase numerical aperture NA.

SUMMARY

In one embodiment, a method is disclosed for defining a multiple patterned cell layout for use in an integrated circuit design. The method includes an operation for defining a layout for a level of a cell. The layout is defined in accordance with a dynamic array architecture to include a number of layout features. The number of layout features are linear-shaped and commonly oriented. The method also includes an operation for splitting the layout into a number of sub-layouts for the level of the cell, such that each of the number of layout features in the layout is allocated to any one of the number of sub-layouts. The layout is split such that each sub-layout is independently fabricatable. The method further includes an operation for storing the number of sub-layouts for the level of the cell on a computer readable medium.

In another embodiment, a method is disclosed for creating a cell library for multiple patterning of a chip layout. The method includes an operation for defining a cell to include a number of levels having a respective linear layout defined in accordance with a dynamic array architecture. The dynamic array architecture is defined by layout features that are linear-shaped and commonly oriented. The cell represents an abstraction of a logic function and encapsulates lower-level integrated circuit layouts for implementing the logic function. For one or more select levels of the cell, the method includes an operation for splitting the respective linear layout into a number of sub-layouts, such that each of the number of layout features in the respective linear layout is allocated to any one of the number of sub-layouts, and such that each sub-layout is independently fabricatable. The method further includes an operation for storing a definition of the cell in a cell library on a computer readable medium. The definition of the cell includes the number of sub-layouts associated with each of the select levels of the cell.

In another embodiment, a method is disclosed for designing an integrated circuit for fabrication. In the method, a plurality of cells are placed together on a chip layout to satisfy a netlist of the integrated circuit. The plurality of cells are selected from a cell library for multiple patterning of the chip layout. Each of the plurality of cells includes a common level having a respective linear layout defined in accordance with a dynamic array architecture. The dynamic array architecture is defined by layout features that are linear-shaped and commonly oriented. Each linear layout is split into a number of sub-layouts, such that each layout feature in each linear layout is allocated to any one of the number of sub-layouts. Layout features allocated to a given sub-layout form a consistent pattern within the common level of a given cell. The plurality of cells are placed together such that the consistent pattern of layout features, as formed by the given sub-layout within the common level, extends in an uninterrupted manner across the plurality of cells. The extension of the consistent pattern of layout features formed by the given sub-layout across the plurality of cells defines a portion of a chip-wide mask layout for the common level. The method also includes an operation for storing the chip-wide mask layout for the common level on a computer readable medium.

In another embodiment, a set of masks for fabricating a common level of a semiconductor chip is disclosed. The set of masks includes a first mask having an area defined in accordance with a dynamic array architecture to include a first number of linear layout features. The first number of linear layout features are commonly oriented. Also, each of the first number of linear layout features is devoid of a substantial change in traversal direction across the first mask. The first number of linear layout features form a first sub-layout that defines a first portion of one or more cells. Each of the one or more cells represents an abstraction of a logic function and encapsulates lower-level integrated circuit layouts for implementing the logic function. The set of masks also includes a second mask having an area defined in accordance with the dynamic array architecture to include a second number of linear layout features. The second number of linear layout features are commonly oriented with the first number of linear layout features. Also, each of the second number of linear layout features is devoid of a substantial change in traversal direction across the second mask. The area of the second mask defined in accordance with the regular architecture is to be aligned with the area of the first mask defined in accordance with the regular architecture. The second number of linear layout features form a second sub-layout which defines a second portion of the one or more cells.

Other aspects and advantages of the invention will become more apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an illustration showing an exemplary layout for a level of a cell defined in accordance with the dynamic array architecture, in accordance with one embodiment of the present invention;

FIG. 2A is an illustration showing a splitting of the layout of FIG. 1 into two sub-layouts, in accordance with one embodiment of the present invention;

FIG. 2B is an illustration showing the first sub-layout as defined in the layout splitting of FIG. 2A, in accordance with one embodiment of the present invention;

FIG. 2C is an illustration showing the second sub-layout as defined in the layout splitting of FIG. 2A, in accordance with one embodiment of the present invention;

FIG. 2D is an illustration showing the splitting of the layout of FIG. 2A into three sub-layouts, in accordance with one embodiment of the present invention;

FIG. 3 is an illustration showing a PCT processed version of the sub-layout of FIG. 2C, in accordance with one embodiment of the present invention;

FIGS. 4A-4C are illustrations showing possible sub-layout sequences for a layout that is split into three sub-layouts, in accordance with one embodiment of the present invention;

FIG. 5A is an illustration showing a gate level layout and metal 2 level layout for a cell, in accordance with one embodiment of the present invention;

FIGS. 5B-5E are illustrations showing different variants of the cell of FIG. 5A, in accordance with one embodiment of the present invention;

FIG. 5F-5G are illustrations showing placement of cell variants next to each other such that the sub-layout patterns for multiple levels extend across the cell boundaries, in accordance with one embodiment of the present invention;

FIG. 6A is an illustration showing a non-segmented layout of a level of a cell, in accordance with one embodiment of the present invention;

FIG. 6B is an illustration showing a first non-segmented sub-layout including the linear-shaped layout features designated by the label A in FIG. 6A, in accordance with one embodiment of the present invention;

FIG. 6C is an illustration showing a second non-segmented sub-layout including the linear-shaped layout features designated by the label B in FIG. 6A, in accordance with one embodiment of the present invention;

FIG. 6D is an illustration showing a layout to be used for cutting the linear-shaped features as fabricated by the first and second non-segmented sub-layouts of FIGS. 6B and 6C, in accordance with one embodiment of the present invention;

FIG. 6E is an illustration showing the level of the cell following the line cutting by the layout of FIG. 6D, in accordance with one embodiment of the present invention;

FIG. 7 is an illustration showing a flowchart of a method for defining a multiple patterned cell layout for use in an integrated circuit design, in accordance with one embodiment of the present invention;

FIG. 8 is an illustration showing a flowchart of a method for creating a cell library for multiple patterning of a chip layout, in accordance with one embodiment of the present invention; and

FIG. 9 is an illustration showing a flowchart of a method for designing an integrated circuit for fabrication, in accordance with one embodiment of the present invention.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.

One technique for resolving nano-scale layout features without further decreasing the illumination wavelength and without further increasing the numerical aperture NA is to utilize multiple patterning. More specifically, in multiple patterning, a given layout is split into two or more sub-layouts that are each exposed separately over the same area of the chip in the optical lithography process. Although the individual feature sizes in each of the sub-layouts may be small, i.e., nano-scale, a spacing between adjacent layout features in a given sub-layout is sufficiently large to enable resolution of the small layout features.

It should be appreciated that multiple patterning can be quite difficult in traditional random logic patterns and associated cell libraries because of their two-dimensionally varying nature, i.e., with layout features having bends and forks. Additionally, there can be complex issues associated with splitting of two-dimensionally varying patterns, such as phase shifting conflicts. However, use of a cell library defined in accordance with a dynamic array architecture enables straightforward splitting of a layout into multiple sub-layouts to be used for lithographic exposure.

A cell, as referenced herein, represents an abstraction of a logic function, and encapsulates lower-level integrated circuit layouts for implementing the logic function. It should be understood that a given logic function can be represented by multiple cell variations, wherein the cell variations may be differentiated by feature size, performance, and process compensation technique (PCT) processing. For example, multiple cell variations for a given logic function may be differentiated by power consumption, signal timing, current leakage, chip area, OPC, RET, etc. Additionally, multiple cell variations may be differentiated by sub-layout sequence combination, as described herein. It should also be understood that each cell description includes the layouts for the cell in each level of a chip, as required to implement the logic function of the cell. More specifically, a cell description includes layouts for the cell in each level of the chip extending from the substrate level up through a particular interconnect level.

The dynamic array architecture represents a semiconductor device design paradigm in which linear-shaped layout features are defined along a regular-spaced virtual grate (or regular-spaced virtual grid) in a number of levels of a cell, i.e., in a number of levels of a semiconductor chip. The virtual grate is defined by a set of equally spaced, parallel virtual lines extending across a given level in a given chip area. The virtual grid is defined by a first set of equally spaced, parallel virtual lines extending across a given level in a given chip area in a first direction, and by a second set of equally spaced, parallel virtual lines extending across the given level in the given chip area in a second direction, where the second direction is perpendicular to the first direction. In one embodiment, the virtual grate of a given level is oriented to be substantially perpendicular to the virtual grate of an adjacent level. However, in other embodiments, the virtual grate of a given level is oriented to be either perpendicular or parallel to the virtual grate of an adjacent level.

In one embodiment, each linear-shaped layout feature of a given level is substantially centered upon one of the virtual lines of the virtual grate associated with the given level. A linear-shaped layout feature is considered to be substantially centered upon a particular line of a virtual grate when a deviation in alignment between of the centerline of the linear-shaped layout feature and the particular line of the virtual grate is sufficiently small so as to not reduce a manufacturing process window from what would be achievable with a true alignment between of the centerline of the linear-shaped layout feature and the line of the virtual grate.

In one embodiment, the above-mentioned manufacturing process window is defined by a lithographic domain of focus and exposure that yields an acceptable fidelity of the layout feature. In one embodiment, the fidelity of a layout feature is defined by a characteristic dimension of the layout feature. Also, it should be understood that the centerline of a given linear-shaped layout feature is defined as a virtual line that passes through the cross-sectional centroid of the linear-shaped layout feature at all points along its length, wherein the cross-sectional centroid of the linear-shaped layout feature at any given point along its length is the centroid of its vertical cross-section area at the given point.

In another embodiment, some linear-shaped layout features in a given level may not be centered upon a virtual line of the virtual grate associated with the given level. However, in this embodiment, the linear-shaped layout features remain parallel to the virtual lines of the virtual grate, and hence parallel to the other linear-shaped layout features in the given level. Therefore, it should be understood that the various linear-shaped layout features defined in a layout of a given level are oriented to extend across the given level in a parallel manner.

Also, in the dynamic array architecture, each linear-shaped layout feature is defined to be devoid of a substantial change in direction along its length. The lack of substantial change in direction of a linear-shaped layout feature is considered relative to the line of the virtual grate along which the linear-shaped layout feature is defined. In one embodiment, a substantial change in direction of a linear-shaped layout feature exists when the width of the linear-shaped layout feature at any point thereon changes by more than 50% of the nominal width of the linear-shaped layout feature along its entire length. In another embodiment, a substantial change in direction of a linear-shaped layout feature exists when the width of the linear-shaped layout feature changes from any first location on the linear-shaped layout feature to any second location on the linear-shaped layout feature by more that 50% of the linear-shaped layout feature width at the first location. Therefore, it should be appreciated that the dynamic array architecture specifically avoids the use of non-linear-shaped layout features, wherein a non-linear-shaped layout feature includes one or more bends within a plane of the associated level.

In the dynamic array architecture, variations in a vertical cross-section shape of an as-fabricated linear-shaped layout feature can be tolerated to an extent, so long as the variation in the vertical cross-section shape is predictable from a manufacturing perspective and does not adversely impact the manufacture of the given linear-shaped layout feature or its neighboring layout features. In this regard, the vertical cross-section shape corresponds to a cut of the as-fabricated linear-shaped layout feature in a plane perpendicular to the centerline of the linear-shaped layout feature. It should be appreciated that variation in the vertical cross-section of an as-fabricated linear-shaped layout feature along its length can correspond to a variation in width along its length. Therefore, the dynamic array architecture also accommodates variation in the width of an as-fabricated linear-shaped layout feature along its length, so long as the width variation is predictable from a manufacturing perspective and does not adversely impact the manufacture of the linear-shaped layout feature or its neighboring layout features.

Additionally, different linear-shaped layout features within a given level can be designed to have the same width or different widths. Also, the widths of a number of linear-shaped layout features defined along adjacent lines of a given virtual grate can be designed such that the number of linear-shaped layout features contact each other so as to form a single linear-shaped layout feature having a width equal to the sum of the widths of the number of linear-shaped layout features.

Within a given level defined according to the dynamic array architecture, proximate ends of adjacent, co-aligned linear-shaped layout features may be separated from each other by a substantially uniform gap. More specifically, adjacent ends of linear-shaped layout features defined along a common line of a virtual grate are separated by an end gap, and such end gaps within the level associated with the virtual grate may be defined to span a substantially uniform distance. Additionally, in one embodiment, a size of the end gaps is minimized within a manufacturing process capability so as to optimize filling of a given level with linear-shaped layout features.

Also, in the dynamic array architecture, a level can be defined to have any number of virtual grate lines occupied by any number of linear-shaped layout features. In one example, a given level can be defined such that all lines of its virtual grate are occupied by at least one linear-shaped layout feature. In another example, a given level can be defined such that some lines of its virtual grate are occupied by at least one linear-shaped layout feature, and other lines of its virtual grate are vacant, i.e., not occupied by any linear-shaped layout features. Furthermore, in a given level, any number of successively adjacent virtual grate lines can be left vacant. Also, the occupancy versus vacancy of virtual grate lines by linear-shaped layout features in a given level may be defined according to a pattern or repeating pattern across the given level.

Additionally, within the dynamic array architecture, vias and contacts are defined to interconnect a number of the linear-shaped layout features in various levels so as to form a number of functional electronic devices, e.g., transistors, and electronic circuits. Layout features for the vias and contacts can be aligned to virtual grid, wherein a specification of this virtual grid is a function of the specifications of the virtual grates associated with the various levels to which the vias and contacts will connect. Thus, a number of the linear-shaped layout features in various levels form functional components of an electronic circuit. Additionally, some of the linear-shaped layout features within various levels may be non-functional with respect to an electronic circuit, but are manufactured nonetheless so as to reinforce manufacturing of neighboring linear-shaped layout features. It should be understood that the dynamic array architecture is defined to enable accurate prediction of semiconductor device manufacturability with a high probability.

In view of the foregoing, it should be understood that the dynamic array architecture is defined by placement of linear-shaped layout features on a regular-spaced grate (or regular-spaced grid) in a number of levels of a cell, such that the linear-shaped layout features in a given level of the cell are oriented to be substantially parallel with each other in their traversal direction across the cell. Also, in the dynamic array architecture, prior to PCT processing, each linear-shaped layout feature is defined to be devoid of a substantial change in direction relative to its traversal direction across the cell. Further description of the dynamic array architecture as referenced herein can be found in each of co-pending U.S. patent application Ser. Nos. 11/683,402; 12/013,342; 12/013,356; and Ser. No. 12/013,366, which are incorporated in their entirety herein by reference.

FIG. 1 is an illustration showing an exemplary layout for a level of a cell 101 defined in accordance with the dynamic array architecture, in accordance with one embodiment of the present invention. A number of linear-shaped layout features 105 are placed along virtual lines 103 of a virtual grate associated with the level of the cell 101. The virtual grate is defined by a pitch 107 representing a perpendicular spacing between adjacent virtual lines 103. In this exemplary embodiment, each of the linear-shaped layout features 105 is defined to have a width 109. It should be understood, however, that in other embodiments various linear-shaped layout features in a given level of a cell may be defined to have a number of different widths.

For purposes of description, it should be considered that the pitch 107 of the virtual grate, the width 109 of the linear-shaped features 105, and the occupancy of the virtual grate by the linear-shaped layout features 105, combine such that the layout of the level of the cell 101 is outside a fabrication capability of a given semiconductor fabrication process. Therefore, to facilitate fabrication of the level of the cell 101, the layout can be split into a number of sub-layouts, such that each of the number of linear-shaped layout features 105 in the layout is allocated to any one of the number of sub-layouts, and such that each sub-layout is independently fabricatable within the fabrication capability of the given semiconductor fabrication process.

In one embodiment, a layout including linear-shaped layout features defined in accordance with the dynamic array architecture is split by allocating sidewardly adjacent layout features to different sub-layouts. It should be understood that allocation of sidewardly adjacent layout features to different sub-layouts can be applied with any number of sub-layouts. For example, in the case of double patterning in which two sub-layouts are used, every other layout feature in the layout for the level of the cell is allocated to a common sub-layout. In this case, identification of every other layout feature is made in accordance with a direction perpendicular to a traversal direction of the layout features across the cell.

FIG. 2A is an illustration showing a splitting of the layout of FIG. 1 into two sub-layouts, in accordance with one embodiment of the present invention. Thus, FIG. 2A is an example of double-patterning. A first sub-layout in FIG. 2A includes the layout features 105A. A second sub-layout in FIG. 2A includes the layout features 105B. Therefore, the layout is split such that sidewardly adjacent layout features are allocated to different sub-layouts. More specifically, every other sidewardly adjacent layout feature is allocated to a common sub-layout. Additionally, it should be understood that when multiple linear-shaped layout features are placed in a co-aligned manner on a common virtual grate line, e.g., virtual grate line 103, each of the multiple linear-shaped layout features is allocated to the same sub-layout. In other words, each layout feature on a given virtual grate line is allocated to the same sub-layout.

FIG. 2B is an illustration showing the first sub-layout as defined in the layout splitting of FIG. 2A. FIG. 2C is an illustration showing the second sub-layout as defined in the layout splitting of FIG. 2A. It should be understood that each of the first and second sub-layouts of FIGS. 2B and 2C are to fabricated separately on the chip. In the sub-layout of FIG. 2B, adjacent linear-shaped layout features 105A are separated by a distance 111. Similarly, in the sub-layout of FIG. 2C, adjacent linear-shaped layout features 105B are also separated by the distance 111. If the distance 111 is sufficiently large such that each of the first and second sub-layouts is independently fabricatable within the fabrication capability of a given semiconductor fabrication process, then use of two sub-layouts is adequate. However, if the distance 111 is not sufficiently large to enable independent fabrication of the first and second sub-layouts, the layout of FIG. 2A could be split into more than two sub-layouts.

FIG. 2D is an illustration showing the splitting of the layout of FIG. 2A into three sub-layouts. A first sub-layout in FIG. 2D includes the layout features 105A. A second sub-layout in FIG. 2D includes the layout features 105B. A third sub-layout in FIG. 2D includes the layout features 105C. It should be appreciated that the distance 115 between adjacent layout features in each of the three sub-layouts of FIG. 2D is larger than the distance 111 in the two sub-layouts of FIGS. 2B and 2C. Therefore, each of the three sub-layouts having the layout feature separation distance 115 should be more likely to fall within the fabrication capability of a given semiconductor fabrication process, as compared to the two sub-layouts having the layout feature separation distance 111. Thus, by splitting the layout of a given level of a cell into multiple sub-layouts, it is possible to resolve smaller layout feature sizes.

It should be understood that a given layout can be split into essentially any number of sub-layouts, wherein each sub-layout for the given level of the cell is to be fabricated separately. Also, in various embodiments, a layout for a given level of a cell can be split into a number of sub-layouts based on layout feature function, layout feature location, or a combination thereof. In one embodiment, layout features sharing a common electrical function can be allocated to a common sub-layout. For example, layout features for active region contacts can be commonly allocated to one sub-layout, and layout features for gate contacts can be commonly allocated to another sub-layout. Also, in one embodiment, layout features for vias can be allocated to sub-layouts in accordance with alternating rows and/or columns of the virtual grid upon which the via layout features are placed.

Once a given layout is split into multiple sub-layouts, each of the sub-layouts can be process compensation technique (PCT) processed separately, as each of the sub-layouts will be exposed separately during the lithography process. As used herein, a process compensation technique (PCT) refers to essentially any processing or adjustment of an integrated circuit (IC) layout for the purpose of improving or ensuring successful fabrication of the features defined by the IC layout. Examples of various PCTs include optical proximity correction (OPC), resolution enhancement techniques (RET), etch proximity compensation, gap fill compensation (e.g., use of dielectric or metal to fill gaps), chemical mechanical planarization (CMP) compensation, among others. It should be understood that the term PCT processing, as used herein, refers to any existing or future form of IC layout processing used to improve or ensure successful fabrication of features defined by the IC layout.

FIG. 3 is an illustration showing a PCT processed version of the sub-layout of FIG. 2C, in accordance with one embodiment of the present invention. A number of OPC shapes 117 are placed at various ends of the linear-shaped layout features 105B as part of the PCT processing of the sub-layout. In performing the PCT processing on a given sub-layout, a lithographic buffer region (“litho-buffer” hereafter) 119 is defined around the cell 101 to simulate a chip environment in which the sub-layout for the level of the cell 101 may be placed and fabricated. Generally speaking, a litho-buffer associated with a given sub-layout for a cell level is defined to include a number of features that simulate the neighborhood in which the sub-layout for the cell level will be placed during fabrication on the chip. The size of the litho-buffer for a given cell level is defined by the outward extent of the litho-buffer from the cell. For example, in FIG. 3, the litho-buffer 119 extends outward from the cell 101 to a boundary 121. The size of the litho-buffer for a given cell level is set such that the litho-buffer covers an area capable of lithographically influencing fabrication of the sub-layout in the given cell level.

In one embodiment, a litho-buffer for a cell level defined in accordance with the dynamic array architecture can be defined by surrounding the cell level with duplicate instantiations of itself. However, in another embodiment, the litho-buffer for the cell level defined in accordance with the dynamic array architecture can be defined in a more generalized manner to include a “blanket” of linear features which approximate those present in the cell level. For example, the blanket of linear features can be defined to include a number of linear features placed according to an extension of the virtual grate/virtual grid utilized within the cell level, and according to an extension of the sub-layout of the cell level. Additionally, in the dynamic array architecture, it should be appreciated that PCT corrections may be primarily intended to maintain the line width of each linear-shaped layout feature in critical regions. Therefore, the PCT corrections can be relatively simple, such as one-dimensional corrections similar to those provided by the OPC shapes 117 in FIG. 3. Further description of PCT processing of a given level of a cell can be found in co-pending U.S. patent application Ser. No. 12/033,807, which is incorporated in its entirety herein by reference.

For each layout that is split into a number of sub-layouts, a particular sub-layout sequence can be specified. The sub-layout sequence is defined by allocating an edge layout feature of the layout to a particular sub-layout and by allocating sidewardly adjacent layout features, relative to a direction extending across the layout away from the edge layout feature, according to a fixed ordering of the number of sub-layouts. Because each sub-layout sequence is based on allocation of an edge layout feature to a particular sub-layout, the number of possible sub-layout sequences is equal to the number of sub-layouts into which the layout is split.

FIGS. 4A-4C are illustrations showing possible sub-layout sequences for a layout that is split into three sub-layouts, in accordance with one embodiment of the present invention. In each of FIGS. 4A-4C, the three sub-layouts are designed by the letters A, B, and C, respectively. Also, in each of FIGS. 4A-4C, the fixed ordering of the number of sub-layouts is specified as A-B-C. Therefore, FIG. 4A shows a first sub-layout sequence in which the left edge layout feature 401 is allocated to sub-layout A, and the fixed ordering of sub-layouts (A-B-C) is applied to sidewardly adjacent features based on the allocation of the left edge layout feature 401 to sub-layout A. FIG. 4B shows a second sub-layout sequence in which the left edge layout feature 401 is allocated to sub-layout B, and the fixed ordering of sub-layouts (A-B-C) is applied to sidewardly adjacent features based on the allocation of the left edge layout feature 401 to sub-layout B. FIG. 4C shows a third sub-layout sequence in which the left edge layout feature 401 is allocated to sub-layout C, and the fixed ordering of sub-layouts (A-B-C) is applied to sidewardly adjacent features based on the allocation of the left edge layout feature 401 to sub-layout C.

A number of variants of a cell can be generated by specifying different combinations of sub-layout sequences across the various levels of the cell. For example, FIG. 5A is an illustration showing a gate level layout and metal 2 level layout for a cell 501, in accordance with one embodiment of the present invention. For ease of illustration, gate level layout features 503 and metal 2 level layout features 505 are abbreviated in their traversal direction across the cell 501 to avoid obscuring each other. However, it should be understood that each gate level feature 503 and each metal 2 level feature 505 extends across the cell 501, as indicated by arrows 507.

In the present example, the gate level layout is split into two sub-layouts. Similarly, the metal 2 level layout is split into two sub-layouts. For ease of description, it is assumed that no other levels of the cell 501 are split into sub-layouts. FIGS. 5B-5E are illustrations showing different variants of the cell 501. The gate level layout is split into two sub-layouts identified as 503A and 503B, respectively. The metal 2 level layout is split into two sub-layouts identified as 505A and 505B, respectively. Because the gate level layout is split into two sub-layouts, there are two possible sub-layout sequences for the gate level, i.e., 503A-503B, and 503B-503A. Also, because the metal 2 level layout is split into two sub-layouts, there are two possible sub-layout sequences for the metal 2 level layout, i.e., 505A-505B, and 505B-505A. Therefore, in considering the combination of sub-layout sequences across the levels of the cell 501, four variants of the cell 501 can be generated based on unique sub-layout sequence combinations.

FIG. 5A shows a cell variant 501A in which the combination of sub-layout sequences applied across the levels of the cell 501 is defined by 503A-503B for the gate level and 505A-505B for the metal 2 level. FIG. 5B shows a cell variant 501B in which the combination of sub-layout sequences applied across the levels of the cell 501 is defined by 503B-503A for the gate level and 505A-505B for the metal 2 level. FIG. 5C shows a cell variant 501C in which the combination of sub-layout sequences applied across the levels of the cell 501 is defined by 503A-503B for the gate level and 505B-505A for the metal 2 level. FIG. 5D shows a cell variant 501D in which the combination of sub-layout sequences applied across the levels of the cell 501 is defined by 503B-503A for the gate level and 505B-505A for the metal 2 level.

Because a chip-wide mask is used to fabricate a conglomeration of cells, a given sub-layout pattern should extend across cell boundaries. Therefore, a cell variant having an appropriate sub-layout sequence in each level thereof should be placed next to another cell when the chip-wide layout is placed and routed, such that the sub-layout pattern for a given level extends across cell boundaries. For example, FIG. 5F is an illustration showing placement of cell variant 501B next to cell variant 501A such that the sub-layout patterns for the gate level and the metal 2 level extend across the cell boundaries. Also, FIG. 5G is an illustration showing placement of cell variant 501D next to cell variant 501C such that the sub-layout patterns for the gate level and the metal 2 level extend across the cell boundaries.

The splitting of various layouts of a cell into multiple sub-layouts can be built into the cell library. Through use of the dynamic array architecture, it is possible to split a layout of a given cell level into multiple sub-layouts as the cell library is being created. Also, each variant of a given cell can be stored in the cell library, wherein each cell variant corresponds to a unique combination of sub-layout sequences applied across the levels of the given cell. Thus, during placing and routing of the chip, appropriate cell variants can be selected from the cell library for placement on the chip to ensure that chip-level layout patterns are maintained across the chip. In one embodiment, a router used to place and route the chip is defined to understand how the various layouts for each level of the chip are split, thereby enabling placement of cells such that sub-layouts for a given level align and extend across cell boundaries.

In one embodiment, chip-wide layout splitting of a given level is accomplished by placing appropriate cell variants during the chip place and route process, without considering the chip-wide layout as a whole. In another embodiment, chip-wide layout splitting of a given level can be performed following the chip place and route process. It should be appreciated that in this embodiment, definition of the various cells in accordance with the dynamic array architecture serves to significantly improve the ease by which the chip-wide layout can be split. Each chip-wide sub-layout for a given level is defined on a respective mask. The masks for the various sub-layouts of each level of the chip are stored as layout data files to be sent to the mask fabrication facility. The layout data files can be formatted as GDS II (Graphic Data System) database files, OASIS (Open Artwork System Interchange Standard) database files, or any other type of date file format that can be understood by the mask fabrication facility.

In another embodiment, multiple patterning can be used to implement a line cutting technique for segmentation of a layout defined in accordance with the dynamic array architecture. FIG. 6A is an illustration showing a non-segmented layout of a level of a cell 601, in accordance with one embodiment of the present invention. In the non-segmented layout, each linear-shaped layout feature is defined to extend continuously across the layout, including across cell boundaries. The non-segmented layout can be split into a number of sub-layouts. In the example of FIG. 6A, the non-segmented layout is split into two sub-layouts designated by labels A and B, respectively. FIG. 6B is an illustration showing a first non-segmented sub-layout including the linear-shaped layout features designated by the label A. FIG. 6C is an illustration showing a second non-segmented sub-layout including the linear-shaped layout features designated by the label B. Each of the first and second non-segmented sub-layouts are fabricated separately on the same level of the chip.

FIG. 6D is an illustration showing a layout to be used for cutting the linear-shaped features as fabricated by the first and second non-segmented sub-layouts of FIGS. 6B and 6C. The layout of FIG. 6D includes layout features 609-1 and 609-2 for line cutting at the cell 601 boundary. Also, layout features 609-3 through 609-6 are provided for segmentation of linear features within the cell 601. The layout of FIG. 6D is defined to cut the linear-shaped features as fabricated by the first and second non-segmented sub-layouts of FIGS. 6B and 6C, so as to enable electrical connectivity necessary for the logic function of the cell 601. FIG. 6E is an illustration showing the level of the cell 601 following the line cutting by the layout of FIG. 6D.

In one embodiment, a set of masks are generated for fabricating a common level of a semiconductor chip in accordance with the line cutting technique illustrated by FIGS. 6A-6E. The set of masks includes a first mask having an area defined in accordance with a dynamic array architecture to include a first number of linear layout features defined to extend continuously across the area of the first mask. The first number of linear layout features are commonly oriented. Also, each of the first number of linear layout features is devoid of a substantial change in traversal direction across the first mask. The first number of linear layout features form a first sub-layout, wherein the first sub-layout defines a first portion of one or more cells.

The set of masks also includes a second mask having an area defined in accordance with the dynamic array architecture to include a second number of linear layout features defined to extend continuously across the area of the second mask. The second number of linear layout features are commonly oriented with the first number of linear layout features of the first mask. Each of the second number of linear layout features is devoid of a substantial change in traversal direction across the second mask. The area of the second mask defined in accordance with the dynamic array architecture is to be aligned with the area of the first mask defined in accordance with the dynamic array architecture, thereby causing the second number of linear layout features to be interleaved with the first number of linear layout features. The second number of linear layout features form a second sub-layout, wherein the second sub-layout defines a second portion of the one or more cells.

The set of masks also includes a third mask having an area defined to include a third number of linear layout features. The third number of linear layout features are oriented to be substantially perpendicular to both the first and second number of linear layout features, when the area of the third mask is aligned with the areas of the first and second masks. The third number of linear layout features are defined to provide for cutting of a portion of the first and second number of linear layout features, so as to segment the first and second number of linear layout features to enable electrical connectivity necessary for the logic function of each of the one or more cells. It should be understood that enumeration of the above-mentioned masks as “first,” “second,” and “third” is provided for purposes of mask differentiation and is not intended to convey an absolute number of a given mask.

Also, in another embodiment, the non-segmented layout of FIG. 6A can be formed using a self-aligned double patterning (SADP) process, in lieu of using the separate sub-layout masks of FIGS. 6B and 6C. In this embodiment, the cutting layout, i.e., cut mask, of FIG. 6D can be used to cut the non-segmented layout features formed using the SADP process, so as to yield the layout shown in FIG. 6E. Also, it should be appreciated that the SADP process in this embodiment can be extended to a self-aligned quadruple patterning (SAQP) process, and beyond.

In one embodiment, multiple patterning, as described herein, is performed by separately loading different sub-layouts for a given level into a stepper. In this embodiment, alignment between the layout features of the different sub-layouts should be performed accurately to ensure proper spacing between layout features in the given level. In another embodiment, multiple patterning is performed using a double exposure technique in which multiple sub-layouts can be exposed on a wafer with a single alignment of the wafer to the scanner optical column. In one embodiment, the double exposure technique can be performed with each of multiple sub-layouts on a respective mask. In another embodiment, if the chip size allows, the double exposure technique can be performed with each of the multiple sub-layouts on the same mask, with an offset between the sub-layouts.

Moreover, it should be appreciated that use of the dynamic array architecture assists with alignment of sub-layouts when fabricating a given level of the chip. For example, in one embodiment, alignment in the direction along the length of the linear-shaped layout features may be more relaxed relative to alignment in the perpendicular direction extending between layout features. Also, given the parallelism of the linear-shaped layout features in a given level, proper rotational alignment of the sub-layouts for the given level may be more easily identified.

FIG. 7 is an illustration showing a flowchart of a method for defining a multiple patterned cell layout for use in an integrated circuit design, in accordance with one embodiment of the present invention. The method includes an operation 701 for defining a layout for a level of a cell, wherein the layout is defined in accordance with a dynamic array architecture to include a number of layout features. The number of layout features are linear-shaped and commonly oriented. The method also includes an operation 703 for splitting the layout into a number of sub-layouts for the level of the cell, such that each of the number of layout features in the layout is allocated to any one of the number of sub-layouts, and such that each sub-layout is independently fabricatable.

In one embodiment, a size of the layout features and a spacing between adjacent layout features in the layout for the level of the cell, prior to the splitting of operation 703, are outside a fabrication capability of a given semiconductor fabrication process. However, the size of the layout features and a spacing between adjacent layout features in each sub-layout for the level of the cell, after the splitting of operation 703, are within the fabrication capability of the given semiconductor fabrication process.

In one embodiment, sidewardly adjacent layout features in the layout for the level of the cell are allocated to different sub-layouts. In one embodiment, layout features sharing a common electrical function in the layout for the level of the cell are allocated to a common sub-layout. In one embodiment, layout features for active region contacts are commonly allocated to one sub-layout, and layout features for gate contacts are commonly allocated to another sub-layout. In one embodiment, every other layout feature in the layout for the level of the cell is allocated to a common sub-layout, wherein an identification of every other layout feature is made in accordance with a direction perpendicular to a traversal direction of the layout features across the cell.

The method further includes an operation 705 for storing the number of sub-layouts for the level of the cell on a computer readable medium. It should be understood that each sub-layout for the level of the cell is to be fabricated separately within a common area of a chip. Additionally, operations 701-705 are repeated for a number of levels of the cell.

In one embodiment, the method can also include an operation for defining a sub-layout sequence for the level of the cell by allocating an edge layout feature of the level of the cell to a particular sub-layout, and by allocating sidewardly adjacent layout features (relative to a direction extending across the level of the cell away from the edge layout feature) according to a fixed ordering of the number of sub-layouts for the level of the cell. In this embodiment, the method can further include an operation for generating a number of variants of the cell, wherein each variant of the cell is defined by a unique combination of sub-layout sequences applied across levels of the cell. Each variant of the cell can be stored in a cell library on a computer readable medium.

Additionally, in one embodiment of the method, PCT processing can be performed on each sub-layout to generate a PCT processed version each sub-layout. The PCT processed version of each sub-layout can be stored in a cell library on a computer readable medium. In this embodiment, the PCT processing is performed on a given sub-layout by defining a lithographic buffer region around the given sub-layout. The lithographic buffer region is defined to include a number of features that simulate a neighborhood of the given sub-layout around the cell when placed on a chip.

FIG. 8 is an illustration showing a flowchart of a method for creating a cell library for multiple patterning of a chip layout, in accordance with one embodiment of the present invention. The method includes an operation 801 for defining a cell to include a number of levels having a respective linear layout defined in accordance with a dynamic array architecture. The method also includes an operation 803 in which, for one or more select levels of the cell, the respective linear layout is split into a number of sub-layouts, such that each of the number of layout features in the respective linear layout is allocated to any one of the number of sub-layouts, and such that each sub-layout is independently fabricatable. The method further includes an operation 805 for storing a definition of the cell in a cell library on a computer readable medium. The definition of the cell includes the number of sub-layouts associated with each of the select levels of the cell.

In one embodiment, the method of FIG. 8 further includes an operation for generating a number of variants of the cell. Each variant of the cell is defined by a unique combination of sub-layout sequences applied across the select levels of the cell. A sub-layout sequence for a given level of the cell is defined by allocating an edge layout feature of the given level of the cell to a particular sub-layout, and by allocating sidewardly adjacent layout features (relative to a direction extending across the given level of the cell away from the edge layout feature) according to a fixed ordering of the number of sub-layouts for the given level of the cell. In this embodiment, each variant of the cell is stored in the cell library on the computer readable medium.

Also, in one embodiment, the method of FIG. 8 can include an operation for PCT processing each sub-layout to generate a PCT processed version of each sub-layout. In this embodiment, the PCT processed version of each sub-layout is stored in the cell library on the computer readable medium. Additionally, in one embodiment, prior to being split into the number of sub-layouts in operation 803, each linear layout is outside a fabrication capability of a given semiconductor fabrication process. However, in this embodiment, after splitting of the linear layout in operation 803, each of the number of sub-layouts is within the fabrication capability of the given semiconductor fabrication process.

FIG. 9 is an illustration showing a flowchart of a method for designing an integrated circuit for fabrication, in accordance with one embodiment of the present invention. The method includes an operation 901 for placing a plurality of cells together on a chip layout to satisfy a netlist of the integrated circuit. In operation 901, the plurality of cells are selected from a cell library for multiple patterning of the chip layout. Each of the plurality of cells includes a common level having a respective linear layout defined in accordance with a dynamic array architecture. Also, each linear layout is split into a number of sub-layouts, such that each layout feature in each linear layout is allocated to any one of the number of sub-layouts, and such that layout features allocated to a given sub-layout form a consistent pattern within the common level of a given cell.

Also, the plurality of cells are placed together in operation 901 such that the consistent pattern of layout features formed by the given sub-layout within the common level extends in an uninterrupted manner across the plurality of cells. Moreover, the extension of the consistent pattern of layout features formed by the given sub-layout across the plurality of cells defines a portion of a chip-wide mask layout for the common level. Additionally, each sub-layout is defined on a separate chip-wide mask layout for the common level, wherein each chip-wide mask layout is to be independently fabricated in a co-aligned manner on the common level. The method further includes an operation 903 for storing the chip-wide mask layout for the common level on a computer readable medium.

The invention described herein can be embodied as computer readable code on a computer readable medium. The computer readable medium is any data storage device that can store data which can be thereafter be read by a computer system. Examples of the computer readable medium include hard drives, network attached storage (NAS), read-only memory, random-access memory, CD-ROMs, CD-Rs, CD-RWs, magnetic tapes, and other optical and non-optical data storage devices. The computer readable medium can also be distributed over a network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion. Additionally, a graphical user interface (GUI) implemented as computer readable code on a computer readable medium can be developed to provide a user interface for performing any embodiment of the present invention.

While this invention has been described in terms of several embodiments, it will be appreciated that those skilled in the art upon reading the preceding specifications and studying the drawings will realize various alterations, additions, permutations and equivalents thereof. Therefore, it is intended that the present invention includes all such alterations, additions, permutations, and equivalents as fall within the true spirit and scope of the invention.

Claims

1. A semiconductor chip, comprising: a gate electrode level including a plurality of linear-shaped conductive structures defined to extend lengthwise in a first direction, the plurality of linear-shaped conductive structures positioned in accordance with a fixed pitch such that a distance as measured in a second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the fixed pitch,wherein the plurality of linear-shaped conductive structures includes a first set of linear-shaped conductive structures corresponding to a first sub-layout and a second set of linear-shaped conductive structures corresponding to a second sub-layout, the second set of linear-shaped conductive structures interleaved with the first set of linear-shaped conductive structures such that each linear-shaped conductive structure of the second set of linear-shaped conductive structures is separated from at least one adjacently located linear-shaped conductive structure of the first set of linear-shaped conductive structures by the fixed pitch as measured in the second direction between their first-direction-oriented-lengthwise-centerlines,wherein each of the plurality of linear-shaped conductive structures has a respective total length as measured in the first direction along its first-direction-oriented-lengthwise-centerline, and wherein the total length of each linear-shaped conductive structure of the first set of linear-shaped conductive structures is equal,wherein the first set of linear-shaped conductive structures is manufactured using a first mask, and wherein the second set of linear-shaped conductive structures is manufactured using a second mask different from the first mask, and wherein the first set of linear-shaped conductive structures is manufactured separately from the second set of linear-shaped conductive structures.

2. A semiconductor chip as recited in claim 1, wherein the integer multiple of the fixed pitch is equal to the fixed pitch multiplied by a whole number selected from a set of whole numbers including zero.

3. A semiconductor chip as recited in claim 2, wherein some of the plurality of linear-shaped conductive structures are substantially co-aligned such that the distance as measured in the second direction between their first-direction-oriented-lengthwise-centerlines is substantially equal to zero.

4. A semiconductor chip as recited in claim 1, wherein a spacing between at least one of the linear-shaped conductive structures of the first set of linear-shaped conductive structures and an adjacent one of the linear-shaped conductive structures of the second set of linear-shaped conductive structures is outside a fabrication capability of a semiconductor fabrication process.

5. A semiconductor chip as recited in claim 1, wherein the first set of linear-shaped conductive structures correspond to a first plurality of linear-shaped conductive structures, and wherein the second set of linear-shaped conductive structures correspond to a second plurality of linear-shaped conductive structures, andwherein the fixed pitch of the gate electrode level corresponds to a first pitch, andwherein the semiconductor chip further comprises a first interconnect level including a third plurality of linear-shaped conductive structures defined to extend lengthwise in the first direction, the third plurality of linear-shaped conductive structures positioned in accordance with a second pitch such that a distance as measured in the second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the third plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the second pitch,the first interconnect level including a fourth plurality of linear-shaped conductive structures defined to extend lengthwise in the first direction, the fourth plurality of linear-shaped conductive structures positioned in accordance with a third pitch such that a distance as measured in the second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the fourth plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the third pitch.

6. A semiconductor chip as recited in claim 5, wherein at least one of the second and third pitches is equal to the first pitch.

7. A semiconductor chip as recited in claim 5, wherein at least one of the second and third pitches is equal to the first pitch multiplied by a ratio of integers.

8. A semiconductor chip as recited in claim 1, wherein some linear-shaped conductive structures of the second set of linear-shaped conductive structures are co-aligned such that the distance as measured in the second direction perpendicular to the first direction between their first-direction-oriented-lengthwise-centerlines is equal to zero, and wherein adjacently positioned co-aligned linear-shaped conductive structures of the second set of linear-shaped conductive structures are separated from each other by a uniform end-to-end spacing as measured in the first direction.

9. A semiconductor chip as recited in claim 1, wherein the total length of each linear-shaped conductive structure of the second set of linear-shaped conductive structures is equal.

10. A semiconductor chip, comprising: a gate electrode level including a plurality of linear-shaped conductive structures defined to extend lengthwise in a first direction, the plurality of linear-shaped conductive structures positioned in accordance with a fixed pitch such that a distance as measured in a second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the fixed pitch,wherein the plurality of linear-shaped conductive structure includes a first set of linear-shaped conductive structures corresponding to a first sub-layout and a second set of linear-shaped conductive structures corresponding to a second sub-layout, the second set of linear-shaped conductive structures interleaved with the first set of linear-shaped conductive structures such that each linear-shaped conductive structure of the second set of linear-shaped conductive structures is separated from at least one adjacently located linear-shaped conductive structure of the first set of linear-shaped conductive structures by the fixed pitch as measured between their first-direction-oriented-lengthwise-centerlines,wherein the total length of each linear-shaped conductive structure of the first set of linear-shaped conductive structures is equal to a first total length, and wherein the total length of each linear-shaped conductive structure of the second set of linear-shaped conductive structures is equal to a second total length, and wherein the first total length is different than the second total length,wherein the first set of linear-shaped conductive structures is manufactured using a first mask, and wherein the second set of linear-shaped conductive structures is manufactured using a second mask different from the first mask, and wherein the first set of linear-shaped conductive structures is manufactured separately from the second set of linear-shaped conductive structures.

11. A semiconductor chip as recited in claim 10, wherein some linear-shaped conductive structures of the second set of linear-shaped conductive structures are co-aligned such that the distance as measured in the second direction perpendicular to the first direction between their first-direction-oriented-lengthwise-centerlines is equal to zero, and wherein adjacently positioned co-aligned linear-shaped conductive structures of the second set of linear-shaped conductive structures are separated from each other by a uniform end-to-end spacing as measured in the first direction.

12. A semiconductor chip, comprising: a gate electrode level including a plurality of linear-shaped conductive structures defined to extend lengthwise in a first direction, the plurality of linear-shaped conductive structures positioned in accordance with a fixed pitch such that a distance as measured in a second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the fixed pitch,wherein the plurality of linear-shaped conductive structure includes a first set of linear-shaped conductive structures corresponding to a first sub-layout and a second set of linear-shaped conductive structures corresponding to a second sub-layout and a third set of linear-shaped conductive structures corresponding to a third sub-layout,the first, second, and third sets of linear-shaped conductive structures positioned in a sequential manner in the second direction, wherein each linear-shaped conductive structure of the second set of linear-shaped conductive structures is positioned between at least one adjacently located linear-shaped conductive structure of the first set of linear-shaped conductive structures and at least one adjacently located linear-shaped conductive structure of the third set of linear-shaped conductive structures, and wherein each linear-shaped conductive structure of the third set of linear-shaped conductive structures is positioned between at least one adjacently located linear-shaped conductive structure of the second set of linear-shaped conductive structures and at least one adjacently located linear-shaped conductive structure of the first set of linear-shaped conductive structures,wherein the first set of linear-shaped conductive structures is manufactured using a first mask, and wherein the second set of linear-shaped conductive structures is manufactured using a second mask different from the first mask, and wherein the third set of linear-shaped conductive structures is manufactured using a third mask different from both the first mask and the second mask, andwherein the first set of linear-shaped conductive structures is manufactured separately from both the second and third sets of linear-shaped conductive structures, and wherein the second set of linear-shaped conductive structures is manufactured separately from both the first and third sets of linear-shaped conductive structures, and wherein the third set of linear-shaped conductive structures is manufactured separately from both the first and second sets of linear-shaped conductive structures.

13. A semiconductor chip as recited in claim 12, wherein the integer multiple of the fixed pitch is equal to the fixed pitch multiplied by a whole number selected from a set of whole numbers including zero.

14. A semiconductor chip as recited in claim 13, wherein some of plurality of linear-shaped conductive structures are substantially co-aligned such that the distance as measured in the second direction perpendicular to the first direction between their first-direction-oriented-lengthwise-centerlines is substantially equal to zero.

15. A semiconductor chip as recited in claim 12, wherein a spacing between at least one of the linear-shaped conductive structures of the first set of linear-shaped conductive structures and an adjacent one of the linear-shaped conductive structures of the second set of linear-shaped conductive structures is outside a fabrication capability of a semiconductor fabrication process.

16. A semiconductor chip as recited in claim 15, wherein a spacing between at least one of the linear-shaped conductive structures of the first set of linear-shaped conductive structures and an adjacent one of the linear-shaped conductive structures of the third set of linear-shaped conductive structures is outside a fabrication capability of a semiconductor fabrication process.

17. A semiconductor chip as recited in claim 16, wherein a spacing between at least one of the linear-shaped conductive structures of the second set of linear-shaped conductive structures and an adjacent one of the linear-shaped conductive structures of the third set of linear-shaped conductive structures is outside a fabrication capability of a semiconductor fabrication process.

18. A semiconductor chip as recited in claim 12, wherein the first set of linear-shaped conductive structures correspond to a first plurality of linear-shaped conductive structures, and wherein the second set of linear-shaped conductive structures correspond to a second plurality of linear-shaped conductive structures, andwherein the third set of linear-shaped conductive structures correspond to a third plurality of linear-shaped conductive structures, andwherein the fixed pitch of the gate electrode level corresponds to a first pitch, andwherein the semiconductor chip further comprises a first interconnect level including a fourth plurality of linear-shaped conductive structures defined to extend lengthwise in the first direction, the fourth plurality of linear-shaped conductive structures positioned in accordance with a second pitch such that a distance as measured in the second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the fourth plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the second pitch,the first interconnect level including a fifth plurality of linear-shaped conductive structures defined to extend lengthwise in the first direction, the fifth plurality of linear-shaped conductive structures positioned in accordance with a third pitch such that a distance as measured in the second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the fifth plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the third pitch.

19. A semiconductor chip as recited in claim 18, wherein at least one of the second and third pitches is equal to the first pitch.

20. A semiconductor chip as recited in claim 18, wherein at least one of the second and third pitches is equal to the first pitch multiplied by a ratio of integers.

21. A semiconductor chip as recited in claim 12, wherein each of the plurality of linear-shaped conductive structures has a total length as measured in the first direction along its first-direction-oriented-lengthwise-centerline, and wherein the total length of each linear-shaped conductive structure of the first set of linear-shaped conductive structures is equal.

22. A semiconductor chip as recited in claim 21, wherein the second set of linear-shaped conductive structures includes linear-shaped conductive structures of different total length.

23. A semiconductor chip as recited in claim 22, wherein the third set of linear-shaped conductive structures includes linear-shaped conductive structures of different total length.

24. A semiconductor chip as recited in claim 12, wherein some linear-shaped conductive structures of the second set of linear-shaped conductive structures are co-aligned such that the distance as measured in the second direction perpendicular to the first direction between their first-direction-oriented-lengthwise-centerlines is equal to zero, and wherein adjacently positioned co-aligned linear-shaped conductive structures of the second set of linear-shaped conductive structures are separated from each other by a uniform end-to-end spacing as measured in the first direction.

25. A semiconductor chip as recited in claim 24, wherein some linear-shaped conductive structures of the third set of linear-shaped conductive structures are co-aligned such that the distance as measured in the second direction perpendicular to the first direction between their first-direction-oriented-lengthwise-centerlines is equal to zero, and wherein adjacently positioned co-aligned linear-shaped conductive structures of the third set of linear-shaped conductive structures are separated from each other by the uniform end-to-end spacing as measured in the first direction.