Claims
- 1. Capacitor charging means for use in developing a linearly-varying ramp signal in signal-responsive devices comprising:
- an integrated-circuit (IC) chip to be produced in sequential lots by an IC process, said chip having first and second MOS transistors each with gate, drain and source electrodes;
- said first transistor being formed as an MOS capacitor to be charged and discharged;
- said second transistor being formed as an MOS resistor;
- means developing a controlled voltage across said MOS resistor and providing that the voltage is maintained at its controlled value across said MOS resistor during development of said ramp voltage to produce through said MOS resistor a constant current directly proportional to the magnitude of said voltage and inversely proportional to the magnitude of resistance of said MOS resistor; and
- circuit means responsive to said current through said MOS resistor and operable to supply to said MOS capacitor a charging current directly proportional to said constant MOS resistor current;
- whereby when the oxide layer produced by the IC process for making chips with said first and second MOS transistors varies in thickness from one IC chip to a subsequently produced chip produced by that process, the effect on the charging of said MOS capacitor resulting from the change in capacitance of the MOS capacitor of said subsequently produced chip in relation to the capacitance of the MOS capacitor of the previously produced chip is at least partly compensated for by the corresponding change in resistance of the MOS resistor on the subsequently produced chip caused by said variation in oxide thickness, thereby tending to maintain the rate of charging of said MOS capacitor constant regardless of changes in oxide thickness.
- 2. Capacitor charging means as in claim 1, wherein the gate of said second transistor is connected to an element distinct from and having a potential different from the drain of said second transistor.
- 3. The method of developing a linearly-varying ramp signal comprising the steps of:
- utilizing an MOS chip-forming process to form IC chips each with at least two MOS transistors having gate, drain and source electrodes;
- one of said MOS transistors being arranged to serve as a resistor;
- the other of said MOS transistors being arranged to serve as a capacitor;
- producing a controlled current through said MOS resistor by applying a constant voltage across said MOS resistor; and
- applying said controlled current to said MOS capacitor to produce a linearly changing voltage on said capacitor;
- whereby when the oxide layer produced in the chip-forming process for said first and second MOS transistors varies in thickness from one IC chip to a subsequently produced chip produced by that process, the effect on the rate of charging of said MOS capacitor resulting from the change in capacitance of the subsequently produced MOS capacitor in relation to the capacitance of the previously produced chip is at least partly compensated for by the corresponding change in resistance of said MOS resistor on the subsequently produced chip caused by said variation in oxide thickness, thereby tending to maintain the rate of charging of said MOS capacitor relatively constant from one lot of IC chips to a subsequent lot of IC chips, regardless of lot-to-lot changes in oxide thickness.
Parent Case Info
This application is a divisional application of application Ser. No. 08/317,691 filed Oct. 5, 1994, now U.S. Pat. No. 5,612,639, which is a divisional of application Ser. No. 07/876,756 as originally filed on May 1, 1992, now U.S. Pat. No. 5,446,322.
US Referenced Citations (7)
Divisions (2)
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Number |
Date |
Country |
Parent |
317691 |
Oct 1994 |
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Parent |
876756 |
May 1992 |
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