The number of types of electronic devices that are commercially available has increased tremendously the past few years and the rate of introduction of new devices shows no signs of abating. Devices such as tablet, laptop, desktop, and all-in-one computers, cell phones, storage devices, wearable-computing devices, portable media players, navigation systems, monitors, adapters, and others, have become ubiquitous.
The functionality of these devices has likewise greatly increased. This has led to increased complexity inside these electronic devices. An electronic device can now include one or more processors, radios, displays, and other components. At the same time, the demand for smaller and thinner devices continues unabated. As a result, space inside electronic devices is at a premium and saving it is a constant priority.
The inclusion of some of these circuits, such as the radios, can necessitate the use of high speed data lines from one internal component to another. High-speed connector structures, such as coaxial cables, can be used. Coaxial connectors can include a shielded conductor terminating at each end in a connector insert or plug. Signals can then be conveyed from a first receptacle on a first board, through a coaxial cable to a second receptacle, which can be located on the first or a second board.
But these connectors can consume a large amount of board space. That is, each receptacle has a footprint of its own that can consume area on a board. Also, each coaxial receptacle might need a certain amount of space between itself and other coaxial receptacles and devices.
Connections can be made using these connectors during device assembly. If a connection is difficult to form, it can slow the assembly process, increase costs, and increase the amount of rework that might need to be done. For this reason, it can be desirable for the connection to be simple to make.
Also, some of these electronic devices can be manufactured in very high volumes. To meet demand for these products, it can be desirable that these connectors be readily manufactured.
Thus, what is needed are high-speed connectors that save space in an electronic device, are simple to connect, and are readily manufactured.
Accordingly, embodiments of the present invention can provide high-speed connectors that save space in an electronic device, are simple to connect, and are readily manufactured. An illustrative embodiment of the present invention can provide a high-speed connector having high-speed connections for a coaxial cable, a shielded trace on a board, or other high-speed interconnect structure. The high-speed connections can be integrated with low-speed contacts in a board-to-board structure to save space in an electronic device. These and other embodiments of the present invention can provide high-speed connections that are simple to connect. The board-to-board structure can include a board-to-board plug, where each high-speed connection includes a high-speed contact having a lateral portion. The lateral portion can include right-angle tabs to guide or position a central conductor of a coaxial cable. The central conductor of each coaxial cable can be soldered to a corresponding lateral portion. Ground contacts for the board-to-board plug can include crimping portions to connect to an outer shield of each coaxial cable. These and other embodiments of the present invention can provide high-speed connections that are readily manufactured by relying on stamped contacts and molded housings.
In these and other embodiments of the present invention, the high-speed contacts can be shielded by ground structures on the high-speed connector. These ground structures can be laterally around or can surround the high speed contacts on one, two, three, four, or more sides. This shielding can protect signals on the high-speed contacts from coupling by noise and other signals, and can protect other signals from coupling from signals on the high-speed contacts. The ground structures can include ground contacts that can be located adjacent to high-speed signal contacts, as well as ground shields that can be located around a perimeter and other locations on the high-speed connector.
In these and other embodiments of the present invention, connections to high-speed contacts can be made via high-speed signal traces on a board, such as a printed circuit board or flexible circuit board. The high-speed signal traces can be shielded by ground or other low-impedance lines on two or more sides. The high-speed traces can connect to a high-speed contact in either a plug or receptacle of the high-speed connector. The shielding ground lines can connect to ground contacts and ground shields that can laterally be positioned around or can surround the high-speed contact.
In these and other embodiments of the present invention, one or more low-speed contacts can be replaced with one or more larger power or other contacts. In these and other embodiments of the present invention the low-speed contacts can be omitted and the high-speed connector can include an array of high-speed contacts.
While embodiments of the present invention are well-suited to providing high-speed connectors that include connections for coaxial cables, other embodiments of the present invention can provide high-speed connectors that can include connections for one or more other types of cables, such as twin-axial, twisted pair, shielded twisted pair, fiber optic, single conductor, or other types of cables and combinations of these and coaxial cables.
In these and other embodiments of the present invention, contacts, ground contacts, ground shields, and other conductive portions of a high-speed connector can be formed by stamping, metal-injection molding, machining, micro-machining, 3-D printing, or other manufacturing process. The conductive portions can be formed of stainless steel, steel, copper, copper titanium, phosphor bronze, or other material or combination of materials. They can be plated or coated with nickel, gold, or other material. The nonconductive portions can be formed using injection or other molding, 3-D printing, machining, or other manufacturing process. The nonconductive portions can be formed of silicon or silicone, rubber, hard rubber, plastic, nylon, liquid-crystal polymers (LCPs), or other nonconductive material or combination of materials.
These and other embodiments of the present invention can provide high-speed connectors that can be located in various types of devices, such as portable computing devices, tablet computers, desktop computers, laptops, all-in-one computers, cell phones, wearable-computing devices, storage devices, portable media players, navigation systems, monitors, power supplies, adapters, remote control devices, audio devices, chargers, and other devices. These high-speed connectors can provide pathways for signals that are compliant with various standards such as Universal Serial Bus (USB), a High-Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI), power, Ethernet, DisplayPort, Thunderbolt, Lightning and other types of standard and non-standard interfaces that have been developed, are being developed, or will be developed in the future.
Various embodiments of the present invention can incorporate one or more of these and the other features described herein. A better understanding of the nature and advantages of the present invention can be gained by reference to the following detailed description and the accompanying drawings.
Board-to-board receptacle 200 can be located on board 202 and board-to-board plug 100 can be located on board 102. Boards 202 and 102 can be printed circuit boards, flexible circuit boards, or other appropriate substrate. Board-to-board plug 100 can include connections for one or more coaxial cables 190. A center conductor 192 of coaxial cable 190 can connect to high-speed contacts 160. High-speed contacts 160 can be shielded by ground contacts 170 and ground shields 176. This shielding can protect signals conveyed by the coaxial cables 190 from interference by other signals. This shielding can also protect other signals from interference by signals conveyed by coaxial cables 190.
Coaxial cables 190 can be fixed to board-to-board plug 100 by crimping portions 174. Crimping portions 174 can be tightened around coaxial cable 190 to hold coaxial cable 190 in place. Crimping portions 174 can also physically and electrically connect to a shielding 194 or braided layer of coaxial cable 190. Center conductors 192 of coaxial cables 190 can be shielded by ground shields 180 and can connect to high-speed contacts 160. High-speed contacts 160 can be supported by housing 110. Housing 110 can include a central recess 112 surrounded by raised outer portion 130. Raised outer portion 130 can include a first edge 132 and a second edge 134. Ground contacts 170 and ground shields 176 can shield high-speed contacts 160. Low-speed contacts 140 can be located on first edge 132, while low-speed contacts 150 can be located on second edge 134.
Board-to-board receptacle 200 can include housing 210 having a recess 212 surrounding a raised central portion 220 and a raised outer portion 230. Board-to-board receptacle 200 can include ground shields 290 that can physically and electrically connect to ground shields 176 on board-to-board plug 100. High-speed contacts 260 can be located in recess 212, on a first edge 222 of raised central portion 220, and a first edge 232 of the raised outer portion 230. Ground contacts 270 can be located in recess 212, on the first edge 222 of raised central portion 220, and the first edge 232 of the raised outer portion 230. Low-speed contacts 240 can be located in recess 212, on the first edge 222 of raised central portion 220, and the first edge 232 of the raised outer portion 230. Low-speed contacts 250 can be located in recess 212, on a second edge 224 of raised central portion 220, and a second edge 234 of the raised outer portion 230.
When board-to-board plug 100 and board-to-board receptacle 200 are mated, raised central portion 220 can fit in central recess 112, raised outer portion 130 can fit in recesses 212, ground contacts 170 can connect to ground contacts 270, ground shields 176 can connect to ground shields 290, low-speed contacts 240 and 250 can connect to corresponding low-speed contacts 140 and 150, and high-speed contacts 260 can connect to high-speed contacts 160.
In these and other embodiments of the present invention, some or all of the conductive structures, such as the ground shields and various contacts, can be formed by stamping or other process. The housings, such as plug housing 110 and receptacle housing 210, can be insert molded around one or more of these conductive structures. Some or all of the remaining contacts and ground portions can be stamped and then fit to either plug housing 110 or receptacle housing 210. An example is shown in the following figure.
Instead of receiving signals on coaxial cables, board-to-board plug 300 can convey high-speed signals on traces (not shown) on board 302. These traces can be shielded by ground or other low-impedance lines (not shown) on either side in order to reduce coupling between the high-speed signals conveyed by the traces and other signals. The traces can terminate at high-speed contacts 360 in board-to-board plug 300.
Similarly, instead of receiving signals on coaxial cables, board-to-board receptacle 400 can convey high-speed signals on traces (not shown) on board 402. These traces can be shielded by ground or other low-impedance lines (not shown) on either side in order to reduce coupling between the high-speed signals conveyed by the traces and other signals. The traces can terminate at high-speed contacts 460 in board-to-board receptacle 400.
Board-to-board plug 300 can include housing 310. Housing 310 can include central recess 312 surrounded by raised outer portion 330. Housing 310 can also include recesses 314. High-speed contacts 360 can be located in recesses 314. Low-speed contacts 340 can be located on a first side 332 of raised outer portion 330. Low-speed contacts 350 can be located on a second side 334 of raised outer portion 330. Ground shields 380 can latterly surround high-speed contacts 360 on four sides, though grounds shields in this and other embodiments can surround high-speed contacts on fewer or more than four sides.
Board-to-board receptacle 400 can include recess 412 around raised central portion 420 and raised portions 462. Recess 412 can be surrounded by raised outer portion 430. High-speed contacts 460 can be located on raised portions 462. Low-speed contacts 440 can be located in recess 412, on a first edge 422 of raised central portion 420, and a first edge 432 of raised outer portion 430. Low-speed contacts 450 can be located in recess 412, on a second edge 424 of raised central portion 420, and a second edge 434 of raised outer portion 430. Ground contacts 470 can be located on raised central portion 420.
When board-to-board plug 300 and board-to-board receptacle 400 are mated, raised central portion 420 can fit in central recess 312, raised portions 462 can fit in recesses 314, ground contacts 470 can connect to inside surface 382 of ground shields 380, ground shields 480 can connect to ground shields 380, low-speed contacts 440 and 450 can connect to corresponding low-speed contacts 340 and 350, and high-speed contacts 460 can connect to high-speed contacts 360.
In these and other embodiments of the present invention, a larger number of high-speed contacts might be needed in a high-speed connector. These high-speed connectors might or might not include a number of low-speed contacts. An example is shown in the following figure.
Board-to-board plug 500 can include housing 510. Housing 510 can include central recess 512. A first row of high-speed contacts 540 can each be located in a recess 514 in housing 510. A second row of high-speed contacts 550 can each be located in a recess 514 in housing 510. Ground shields 580 can provide shielding for high-speed contacts 540 and high-speed contacts 550. Ground contacts 570 can be located in recesses 572 in housing 510.
Board-to-board receptacle 600 can include housing 610. Housing 610 can include recess 612 defining a raised central portion 620. Raised central portion 620 can fit in central recess 512 in board-to-board plug 500. High-speed contacts 640 and high-speed contacts 650 can be located on raised portions 652. Ground contacts 670 can be located in raised portions 672. Ground shields 680 can be located on raised outer portion 630.
When board-to-board plug 500 is mated with board-to-board receptacle 600, raised central portion 620 can fit in central recess 512, raised portions 662 can fit in recesses 514, raised portions 672 can fit in recesses 572, high-speed contacts 640 can connect to high-speed contacts 540, high-speed contacts 650 can connect to high-speed contacts 550, ground contacts 670 can connect to ground contacts 570, and ground shields 680 can connect to ground shields 580.
As before, board-to-board plug 500 can convey high-speed signals on traces (not shown) on board 52. These traces can be shielded by ground or other low-impedance lines (not shown) on either side in order to reduce coupling between the high-speed signals conveyed by the traces and other signals. The traces can terminate at high-speed contacts 540 and 550 in board-to-board plug 500.
Similarly, instead of receiving signals on coaxial cables, board-to-board receptacle 600 can convey high-speed signals on traces (not shown) on board 602. These traces can be shielded by ground or other low-impedance lines (not shown) on either side in order to reduce coupling between the high-speed signals conveyed by the traces and other signals. The traces can terminate at high-speed contacts 460 in board-to-board receptacle 400.
Coaxial cables 790 can be fixed to board-to-board plug 700 by crimping portions 774. Crimping portions 774 can be tightened around coaxial cable 790 to hold coaxial cable 790 in place. Crimping portions 774 can also physically and electrically connect to a shielding 794 or braided layer of coaxial cable 790. Center conductors 792 of coaxial cables 790 can be shielded by ground shields 780 and can connect to high-speed contacts 760. High-speed contacts 760 can be supported by housing 710. Housing 710 can include a central recess 712 surrounded by raised outer portion 730. Raised outer portion 730 can include a first edge 732 and a second edge 734. Ground contacts 770 and ground shields 776 can shield high-speed contacts 760.
Board-to-board receptacle 800 can include housing 810 having a recess 812 surrounding a raised central portion 820 and a raised outer portion 830. Board-to-board receptacle 800 can include ground shields 890 that can physically and electrically connect to ground shields 776 on board-to-board plug 700. High-speed contacts 860 can be located in recess 812, on a first edge 822 of raised central portion 820, and a first edge 832 of the raised outer portion 830. Ground contacts 870 can be located in recess 812, on the first edge 822 of raised central portion 820, and the first edge 832 of the raised outer portion 830.
When board-to-board plug 700 and board-to-board receptacle 800 are mated, raised central portion 820 can fit in central recess 712, raised outer portion 730 can fit in recesses 812, ground contacts 770 can connect to ground contacts 870, ground shields 776 can connect to ground shields 890, and high-speed contacts 860 can connect to high-speed contacts 760.
Many of the structures in board-to-board plug 700 and board-to-board receptacle 800 can be the same or similar as structures in the other examples, such as the example in
In these and other embodiments of the present invention, some or all of the conductive structures, such as the ground shields and various contacts, can be formed by stamping or other process. The housings, such as plug housing 710 and receptacle housing 810, can be insert molded around one or more of these conductive structures. Some or all of the remaining contacts and ground portions can be stamped and then fit to either plug housing 710 or receptacle housing 810.
While embodiments of the present invention are well-suited to providing high-speed connections for coaxial cables, these and other embodiments of the present invention can provide high-speed connectors that include board-to-board plugs and receptacles for one or more other types of cables, such as twin-axial, twisted pair, shielded twisted pair, fiber optic, single conductor, or other types of cables and combinations of these and coaxial cables.
In various embodiments of the present invention, contacts, ground contacts, ground shields, and other conductive portions of a high-speed connector can be formed by stamping, metal-injection molding, machining, micro-machining, 3-D printing, or other manufacturing process. The conductive portions can be formed of stainless steel, steel, copper, copper titanium, phosphor bronze, or other material or combination of materials. They can be plated or coated with nickel, gold, or other material. The nonconductive portions can be formed using injection or other molding, 3-D printing, machining, or other manufacturing process. The nonconductive portions can be formed of silicon or silicone, rubber, hard rubber, plastic, nylon, liquid-crystal polymers (LCPs), or other nonconductive material or combination of materials.
Embodiments of the present invention can provide high-speed connectors that can be located in various types of devices, such as portable computing devices, tablet computers, desktop computers, laptops, all-in-one computers, cell phones, wearable-computing devices, storage devices, portable media players, navigation systems, monitors, power supplies, adapters, remote control devices, chargers, and other devices. These high-speed connectors can provide pathways for signals that are compliant with various standards such as Universal Serial Bus (USB), a High-Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI), power, Ethernet, DisplayPort, Thunderbolt, Lightning and other types of standard and non-standard interfaces that have been developed, are being developed, or will be developed in the future.
The above description of embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form described, and many modifications and variations are possible in light of the teaching above. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications to thereby enable others skilled in the art to best utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. Thus, it will be appreciated that the invention is intended to cover all modifications and equivalents within the scope of the following claims.
This application is a continuation of U.S. application Ser. No. 16/585,421, filed Sep. 27, 2019, which is incorporated by reference.
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7074085 | Chen | Jul 2006 | B2 |
8272881 | Miyazaki | Sep 2012 | B2 |
9209540 | Raff | Dec 2015 | B2 |
9225115 | Malek | Dec 2015 | B2 |
20130023162 | Harlan | Jan 2013 | A1 |
20130295784 | Hasegawa | Nov 2013 | A1 |
20150222062 | Sloey | Aug 2015 | A1 |
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20220216657 | Sloey | Jul 2022 | A1 |
Number | Date | Country | |
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20220216657 A1 | Jul 2022 | US |
Number | Date | Country | |
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Parent | 16585421 | Sep 2019 | US |
Child | 17577325 | US |