Patent Application
20150253762
The present disclosure relates to an integrated management system including a management device connected to a substrate processing apparatus that processes a substrate, a management device for managing information indicative of a state of each of at least one substrate processing apparatus, a method of displaying information for a substrate processing apparatus, and a recording medium.
In a substrate processing apparatus, there are a lot of information occurrence points of an information such as data (monitoring data) indicating a temperature, a gas flow rate, or the like, and data (event data) indicating an operation state of the substrate processing apparatus. A management device may be connected to the substrate processing apparatus to exchange data and be used to manage the state of the substrate processing apparatus. The management device is configured to receive, from the substrate processing apparatus, data indicating an operation state of the substrate processing apparatus, data indicating the progress of a process (substrate processing) of the substrate processing apparatus, data indicating a transfer state of a substrate to be processed, or the like, and store each of the received data in an accumulation unit in a readable form. Further, a user and a maintenance personnel (hereinafter, also referred to as an operator) of the substrate processing apparatus may operate the above-mentioned management device and perform analysis by reading predetermined data stored in the accumulation unit.
Meanwhile, there is a recent need to establish energy-saving measures such as power consumption reduction, greenhouse gas reduction, and the like for semiconductor manufacturing factories in which a number of semiconductor manufacturing apparatuses as substrate processing apparatuses, are operated. To establish energy-saving measures, it may be necessary to refer to utility data indicating an apparatus operation rate, power consumption, gas consumption, or the like. The operator may acquire data by properly selecting information that specifies data such as power consumption required for energy-saving measures and input the data into the management device. Then, energy-saving measures may be established by analyzing read data based on a predetermined analysis method.
Here, a system for monitoring (supervising) data such as power consumption and gas consumption required for energy-saving measures may be configured as a separate system that is not related to the quality of products produced by the substrate processing apparatus. For this reason, the system may analyze data merely associated with a part of the substrate processing apparatuses or a part of the substrate processing apparatuses connected to the management device. Thus, there has been difficulty in recognizing various data required for energy-saving measures such as the operation rate, power consumption, and gas consumption of each substrate processing apparatus in semiconductor manufacturing factories where a plurality of substrate processing apparatuses are installed.
The present disclosure provides some embodiments of an integrated management system, a management device, a method of displaying information for a substrate processing apparatus, and a recording medium, which are capable of accumulating various data collected from each substrate processing apparatus installed in a semiconductor manufacturing factory, processing the accumulated data into data required to save energy for each substrate processing apparatus, and displaying the same.
According to one embodiment of the present disclosure, there is provided an integrated management system including a substrate processing apparatus configured to process a substrate and a management device, the management device including: an accumulation unit configured to accumulate specified information including power consumption information indicating a power consumed in the substrate processing apparatus, gas consumption information indicating a gas consumed in the substrate processing apparatus, or operation information indicating an operation state of the substrate processing apparatus; and a processing display unit configured to acquire predetermined information that meets a predetermined condition from the specified information accumulated in the accumulation unit and calculate at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an operation rate of the substrate processing apparatus based on the predetermined information.
According to another embodiment of the present disclosure, there is provided a management device including: an accumulation unit configured to accumulate specified information including power consumption information indicating a power consumed in a substrate processing apparatus configured to process a substrate, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus; and a processing display unit configured to acquire predetermined information that meets a predetermined condition from the specified information accumulated in the accumulation unit and calculate at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus based on the predetermined information.
According to another embodiment of the present disclosure, there is provided a method of displaying information for a substrate processing apparatus, including: accumulating specified information including power consumption information indicating a power consumed in the substrate processing apparatus configured to process a substrate, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus; and acquiring predetermined information that meets a predetermined condition from the specified information accumulated in the act of accumulating the specified information, calculating at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus based on the predetermined information, and displaying a calculation result.
According to another embodiment of the present disclosure, there is provided a non-transitory computer-readable recording medium storing an information provision program, including: accumulating specified information including power consumption information indicating a power consumed in a substrate processing apparatus, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus by generating a predetermined data table including the specified information; receiving an instruction to acquire predetermined information that meets a predetermined condition and repetitively searching the predetermined data table for the predetermined information; terminating the act of searching for the predetermined information; and calculating at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus, from the predetermined information which is acquired based on the predetermined condition, and displaying a calculation result.
According to the present disclosure in some embodiments, it is possible to provide an integrated management system, a management device, and a method of displaying information for a substrate processing apparatus, which are capable of displaying various kinds of information such as an apparatus operation rate, a power consumption, an inert gas consumption, and the like of respective substrate procession apparatus to recognize various kinds of information indicating a state of energy saving of an overall semiconductor manufacturing factory (or an overall particular area) or a state of energy saving for each substrate processing apparatus installed in a factory. Further, it is possible to contribute to energy-saving measures by analyzing data using the information.
Hereinafter, one embodiment of the present disclosure is described.
First of all, the configuration of an integrated management system 103 according to the present embodiment is described with reference to
As shown in
The configuration of the management device 500 according to this embodiment configured to exchange data with the foregoing substrate processing system 100 is described mainly with reference to
As shown in
The management device 500 includes a control unit 501 configured as a central processing unit (CPU), a memory (RAM) 502 having a memory area therein, a storage unit 503 configured as a storage device such as an HDD, a display unit 508 such as a display device serving as a display means, and a computer having a communication control unit 504 serving as a communication means. The memory 502, the storage unit 503, and the communication control unit 504 as described above are configured to exchange data with the control unit (CPU) 501 via an internal bus 507, or the like. Further, the control unit (CPU) 501 has a clock function (not shown). In addition, the memory 502 is configured as a memory area (work area) where programs, data, and the like read by the control unit (CPU) 501 are temporarily kept. The display unit 508 such as a display device is connected to the management device 500. The display unit 508 is configured as, e.g., a touch panel or the like, and displays such a command screen as shown in
The communication control unit 504 is connected via the network 400 to a controller 280 of the substrate processing system 100 (substrate processing apparatus 101), which will be described later. The communication control unit 504 is configured to receive information such as monitoring data from the substrate processing system 100 and transfer it to the memory 502. The communication control unit 504 may receive information such as monitoring data at regular timings when data is acquired at predetermined intervals (e.g., 0.1 second intervals), at timings when a predetermined event such as the completion of a recipe or step, occurs, for example, or at timings when information is generated.
The storage unit 503 includes, for example, a flash memory, a hard disk drive (HDD), or the like. The storage unit 503 stores, for example, a control program for controlling the operation of the substrate processing system 100, a data collection program for collecting information about the substrate processing apparatus 101 from the substrate processing system 100, a data accumulation program for storing predetermined information of the information collected from the substrate processing system 100 in an accumulation unit 505 in a predetermined format, and a recipe that describes a substrate processing procedure, conditions, and the like described later, in a readable manner. Also, the storage unit 503 stores a data analysis program described later. By executing the data analysis program by the control unit 501, a data table stored in the accumulation unit 505, which will be described later, is deployed, and data is processed by the processing display unit 506, thereby displaying, for example, such a command screen as shown in
Here, the data accumulation program is a program for managing information accumulated in the accumulation unit 505, which will be described later. For example, the data accumulation program stores predetermined information collected from the substrate processing system 100 in the accumulation unit 505 in a predetermined format in response to a request from the data analysis program. That is, the data accumulation program stores predetermined information collected from the substrate processing system 100 in the accumulation unit 505, for example, a data table as shown in
Further, the recipe may be configured as a combination of steps of a substrate processing process, which will be described later, for producing specified results when executed by the controller 280 described later. That is, the recipe is a so-called execution table with a structure (sequence) which allows for setting a temperature set value, a gas flow rate set value, and a pressure set value for each time step such that, for example, a substrate processing process such as a film forming process for making the thickness of a formed film coincide with a target value can be performed. A control program for executing the recipe and a transfer program for controlling a transfer mechanism are collectively referred to simply as programs. Further, in this embodiment, the programs include a data accumulation program and a data analysis program (information provision program), as well as the recipe.
Further, the management device 500 may be configured as, but not limited to, a dedicated computer, and may also be configured as a general-purpose computer. For example, the management device 500 according to this embodiment may be configured by preparing a computer-readable recording medium 509 (e.g., a magnetic tape, a magnetic disk such as a flexible disk or hard disk, an optical disk such as a CD or DVD, an optical magnetic disk such as an MO, and a semiconductor memory such as a USB memory or memory card) that stores the above described programs, and installing the programs in a general-purpose computer, e.g., using the recording medium 509. Also, a means for supplying a program to the general-purpose computer is not limited to supplying a program through the recording medium 509. For example, a program may be supplied via a communication means such as the Internet or a dedicated line, rather than through the recording medium 509.
The accumulation unit 505 is configured to acquire information about the substrate processing apparatus 101 from the substrate processing system 100 through the above described memory 502 and accumulate the information in a readable manner. A relational database (RDB), for example, is built as the accumulation unit 505.
Various information (data), such as operation information about an operation state of the substrate processing system 100, power consumption information about power consumed in the substrate processing system 100, and gas consumption information about gas consumed in the substrate processing system 100, may be acquired from the substrate processing system 100 and accumulated in the accumulation unit 505 in a readable manner.
Hereinafter, the data table of
The operation information may include apparatus-specific information (apparatus name, measurement points that specify areas within a factory, etc.) that specifies the substrate processing apparatus 101 of the substrate processing system 100 in operation, which is a source of information generation, operation time information that specifies an operation start time and an operation stop time of the substrate processing system 100, and recipe-specific information (a recipe name, an execution start time and an execution stop time of a recipe, and a recipe termination state (normal termination or abnormal termination), etc.) that specifies a recipe for substrate processing executed by the substrate processing apparatus 101 of the substrate processing system 100. Also, in this embodiment, an apparatus operation rate (hereinafter, sometimes simply referred to as an operation rate) refers to a ratio of the time during which the substrate processing apparatus 101 of the substrate processing system 100 executes a predetermined recipe for substrate processing per day (24 hours). That is, the substrate processing system 100 (or substrate processing apparatus 101) is not in operation until the start of a next recipe after the termination of a recipe. Thus, the operation time of the substrate processing system 100 (or substrate processing apparatus 101) corresponds to the time during which a recipe for substrate processing is executed (recipe execution time), and an operation start time and an operation stop time of the substrate processing system 100 (or substrate processing apparatus 101) are consistent with the execution start time and the execution stop time of the recipe, respectively.
The power consumption information may include apparatus power consumption information about the substrate processing apparatus 101 and power consumption time information that specifies a power consumption start time and a power consumption stop time of the substrate processing apparatus 101. Further, the power consumption information may include heating power consumption information indicative of power consumption of a heater 270, which is a heating unit of the substrate processing apparatus 101, which will be described later, and heating time information that specifies a power consumption start time and a power consumption stop time of the heater 207, or may include exhaust power consumption information indicating power consumption of a vacuum pump 246, which is an exhaust unit of the substrate processing apparatus 101, which will be described later, and exhaust time information that specifies a power consumption start time and a power consumption stop time of the vacuum pump 246, or may include control power consumption information indicating the power consumption of the controller 280 of the substrate processing apparatus 101, which will be described later, and exhaust time information that specifies a power consumption start time and a power consumption stop time of the controller 280.
The apparatus power consumption information, the heating power consumption information, the exhaust power consumption information, and the control power consumption information indicate, for example, a unit (e.g., kWh or the like) and at least one selected from total power consumption, maximum power consumption, minimum power consumption, and average power consumption of each type during a predetermined interval of data acquisition. Also, in this embodiment, the accumulation unit 505 may acquire and accumulate the average power consumption during a predetermined interval of data acquisition as each type of power consumption information.
The gas consumption information may include inert gas consumption information about an inert gas supply system, which will be described later, and inert gas consumption time information that specifies a consumption start time of an inert gas and a consumption stop time of an inert gas. Also, the gas consumption information may include processed gas consumption information about a process gas supply system described later and process gas consumption time information that specifies a consumption start time of an inert gas and a consumption stop time of a process gas.
The gas consumption information may be indicative of, for example, a unit (e.g., km3, l, or the like) and at least one selected from raw consumption data (measurement value), total power consumption (integrated value), maximum consumption, minimum consumption, and average consumption of an inert gas or process gas during a predetermined interval of data acquisition. Also, in this embodiment, the accumulation unit 505 may acquire and accumulate average gas consumption during a predetermined interval of data acquisition as inert gas or process gas consumption information.
Further, the operation information, the power consumption information, and the gas consumption information may differ from one another in number even during the same predetermined time. That is, the operation information is usually acquired by the hour, by the day, or the like. Also, the intervals of data acquisition of the power consumption information depend on those of data collection by a power sensor, and the power consumption information is usually acquired by the second, or the like, for example. In addition, the gas consumption information depends on intervals of data collection by a gas flow rate sensor and is usually acquired by the second, or the like, for example. The process gas consumption information may be collected at intervals of 1 second or less, depending on the type of substrate processing. For the substrate processing, the inert gas consumption information may be collected at intervals of 1 second or less, depending on the type of substrate processing. Meanwhile, for supplying an inert gas into a transfer chamber from a gas supply unit in order to purge an interior of the transfer chamber connected to a process chamber, the inert gas consumption information is collected by the hour or by the day. In this way, the intervals of data acquisition depend on its usage, purpose, or the like.
Further, although the data table of
Upon start-up of the management device 500, a data analysis program similar to a file such as a table or program stored in the storage unit 503, may be read into the memory 502. When the control unit 501 receives a command such as, e.g., a data display request (instruction), from the command screen of
Here, the controller 280 serving as a control unit of the substrate processing apparatus 101 described later may have the same configuration as the management device 500. In this case, the controller 280 may have an accumulation unit corresponding to the above described accumulation unit 505, aside from the storage unit 503. Further, the controller 280 may be configured to store information including the above described operation information, power consumption information, gas consumption information, and the like in a predetermined format in the accumulation unit by executing a data accumulation program (not shown), for example. At this time, the controller 280 may include the foregoing processing display unit 506, and the processing display unit 506 of the controller 280 may be implemented by executing a data analysis program. Likewise, a controller serving as a control unit of the group management device 102 may have the same configuration as the management device 500, and this controller may be configured to execute a data accumulation program and a data analysis program.
Subsequently, an operation of the management device 500 according to the present embodiment is described.
First of all, when the management device 500 is started, each program stored in the storage unit 503 starts running. This executes, for example, a data collection program, which allows the communication control unit 504 to receive various kinds of data including monitoring data or the like with time data added thereto from the substrate processing apparatus 101 and transmit it to the memory 502. Next, the control unit 501 reads information about the substrate processing apparatus 101 stored in the memory 502, and stores it in the accumulation unit 505. In this embodiment, the control unit 501 stores predetermined information in the accumulation unit 505 in a predetermined format (e.g., in the form of the data table shown in
Here, an item “overall factory” indicates information about all substrate processing apparatuses 101 installed in a semiconductor manufacturing factory that is within the accumulation unit 505 and that is to be processed and displayed on the display unit 508. Also, not all the substrate processing apparatuses 101 are to be displayed; for example, any substrate processing apparatus that is stopped for periodic maintenance or due to a failure may not be displayed. However, information about all the substrate processing apparatuses 101 installed in the semiconductor manufacturing factory may be displayed.
Further, an item “area” indicates information about all substrate processing apparatuses 101 (or a group of substrate processing apparatuses) installed in a specific area, e.g., floor, in the semiconductor manufacturing factory that is within the accumulation unit 505 and that is to be processed and displayed on the display unit 508. Specifically, in a case where a floor (e.g., the second floor) in a three-story building is divided into three areas: “Area 1”, “Area 2”, and “Area 3”, all the substrate processing apparatuses 101 (or a group of substrate processing apparatuses) installed all over the second floor may be further divided into three areas: “Area 1”, “Area 2”, and “Area 3”, and the items “Area 1”, “Area 2”, and “Area 3” may be displayed on such a command screen as shown in
In addition, an item “substrate processing apparatus” indicates information about a specific substrate processing apparatus 101 installed in a semiconductor manufacturing factory that is within the accumulation unit 505 and that is to be processed and displayed on the display unit 508. At this time, as stated above, other items may be displayed on another screen such that they can be selected. Also, a selection may be made and displayed, for example, by maker, fabrication line, apparatus type, etc.
Furthermore, the items “calendar month”, “calendar week”, and “calendar day” indicate information that is within the accumulation unit 505 and that is to be processed and displayed on the display unit 508 monthly, weekly, and, daily, respectively. That is, a cycle of data search within the accumulation unit 505 is specified by selecting these items. An item “calendar month (year-to-year comparison)” indicates a comparison between this year's information and last year's information, over a predetermined period of time, e.g., six months' from this month.
While the command screen shown in
Further, while the present embodiment is described with respect to a substrate processing apparatus 101 hereinafter, the present disclosure is not limited thereto and apparatuses other than the substrate processing apparatus 101 may also be displayed. For example, a film thickness measuring instrument, a particle counter, or the like may be displayed. Additionally, information regarding substrate processing results (e.g., film thickness, etc.) may be accumulated in the accumulation unit 505.
Subsequently, upon receiving a command, such as, e.g., a data display request (instruction), from the command screen of
For example, the processing display unit 506 calculates the operation rate of the substrate processing apparatus 101 from recipe-specific information (a recipe name, an execution start time of a recipe and an execution stop time of a recipe, and a recipe termination state) that specifies a recipe for substrate processing executed by the substrate processing system 100 (or substrate processing apparatus 101) over a predetermined period.
For example, the processing display unit 506 calculates a total number of operations by calculating the number of times the substrate processing system 100 (or substrate processing apparatus 101) is started up and stopped over a predetermined period, and creates a graph, table, or the like of the calculated total number of operations based on time information related to the predetermined period of time specified by the command and displays it on the display unit 508.
Subsequently, the execution of an information provision program including a data accumulation program and a data analysis program according to the present embodiment is described mainly with reference to
First of all, when power is applied to the management device 500, the control unit 501 is started. Then, the control unit 501 acquires various kinds of programs including a data accumulation program and a data analysis program from the storage unit 503. When various kinds of programs acquired by the control unit 501 are sent to the memory 502, the memory 502 reads the programs and the programs are deployed in the memory 502. Then, the programs are started and start running (step 1).
The control unit 501 creates a predetermined data table of utility data such as, e.g., operation information, power consumption information, and inert gas information, in the accumulation unit 505 by executing the data accumulation program. Also, in this embodiment, although not particularly shown, the control unit 501 may also create a data table of data (monitoring data) indicating a temperature, a gas flow, or the like and data (event data) indicating an operation state of the substrate processing apparatus 101 by executing the data accumulation program. Further, the control unit 501 may create a data table by executing not only the data accumulation program but also the data analysis program. That is, the foregoing data table creation function may be added to the data analysis program (step 2).
Subsequently, the data analysis program started by the control unit 501 is deployed in the memory 502 and brought to standby. That is, the display unit 508 displays such a command screen as shown in
When the button such as a radio button is pressed and the control unit 501 receives the data display request (instruction), the control unit 501 checks the content of the data display request (instruction) data, and derives a predetermined condition (step 4).
Subsequently, the control unit 501 executes the data accumulation program, searches the data table (
When the control unit 501 determines that data acquisition is completed, the control unit 501 executes the data analysis program and processes the acquired data (step 7). For example, the control unit 501 creates data on at least one of the power consumption, the inert gas consumption, and the apparatus operation rate of the substrate processing apparatus 101, over a predetermined period of time, based on to the foregoing predetermined condition. Here, regarding the power consumption, power consumption data per hour, for example, is integrated over 24 hours to create power consumption data per day. Next, the power consumption data per day is integrated over 7 days to create power consumption data per week. Also, the power consumption data per day is integrated for 1 month to create power consumption data per month. Further, in some cases, the power consumption data per day may be integrated for 1 year to create power consumption data per year. Likewise, the control unit 501 executes the data analysis program, and creates inert gas consumption data per day or apparatus operation rate data per day and calculates the inert gas consumption and apparatus operation rate of the substrate processing apparatus 101 based on this data. Specifically, inert gas consumption data per year or apparatus operation rate data per year is integrated for one week and then for one month based on a predetermined condition to create the inert gas consumption data and the apparatus operation rate data about the substrate processing apparatus 101. Moreover, data acquired about every substrate processing apparatus 101 installed in the overall factory is processed based on a predetermined condition. In step 7, the overview screen of
Then, the control unit 501 displays the processed data in a predetermined format, for example, on the display unit 508, based on the above described predetermined condition by executing the data analysis program (step 8). Particularly, when the item “overall factory” and any one of the items “calendar month”, “calendar week”, and “calendar day” are selected in
After displaying the processed data in a predetermined format, the control unit 501 returns to the above-described step (step 3) and waits for a next data display request (instruction). Thus, according to this embodiment, the data analysis program is executed by the control unit 501 even if a predetermined button is pressed on the overview screen of
Subsequently, an example of an overview screen displayed when radio buttons indicating the items “overall factory” and “monthly calendar” are pressed in the command screen illustrated in
Here, in the present embodiment illustrated in
Further, in
In an item “apparatus name,” an apparatus name appears. A name such as, e.g., “unit #28” is generally given to the substrate processing apparatus 101, or the like.
In an item “apparatus type,” a name of an apparatus type appears. In the present embodiment, a name of an apparatus type appears as alphabets. For example, when the same alphabet is given, it indicates that the same substrate processing is performed even though apparatus names are different (for example, the same film is formed). Also, in the present embodiment, for example, alphabet 1 letter denotes a substrate processing apparatus that performs a film forming process, or the like, and alphabet 2 letters denotes a measuring instrument such as a film thickness measuring instrument, a resistance measuring instrument, or a particle counter.
An item “state,” any one being operated or idle appears. Regardless of whether a substrate is loaded into the substrate processing apparatus 101, the substrate processing apparatus 101 is in operation as long as the substrate processing apparatus 101 is not stationary (for example, under maintenance). Also, the item “state” may be discriminatively indicated as being operated and idle. Similarly, as for the foregoing measuring instruments, either an active state or inactive state is displayed in a state in which power is ON or OFF, rather than indicating whether the measuring instruments perform measurement.
In an item “operator,” a maker name, an apparatus manager, or the like appears. In the present embodiment, for example, an apparatus manager is indicated in alphabets, like the item “apparatus type.”
Also, the item “apparatus name,” the item “apparatus type,” and the item “operator” may be appropriately edited. For example, a name of an apparatus type or an apparatus manager may appear through various configurations such as a combination of an alphabet and a number, without being limited to such an alphabet as used in the present embodiment.
In an item “power,” power consumption used by each substrate processing apparatus 101 appears. That is, in
In an item “N2,” consumption of a nitrogen (N2) gas used in each substrate processing apparatus 101 appears. That is, in
An item “operation rate,” an average value of a time (ratio) during which the substrate processing apparatus 101 executes a recipe, in 24 hours (a day), in one month (display period), appears. In
Further, as for the item “power,” the item “N2,” and the item “operation rate,” numerical values may be compared between the same apparatus types, and colors of a maximum numerical value and a minimum numerical value may be differentiated to be displayed. Also, an appropriate threshold value may be determined in advance in each item and, for example, a case where a value that appears in each item exceeds a predetermined threshold value or a case where the value that appears in each item does not exceed the predetermined threshold value may be distinguished in color.
Next, items regarding each area are described. In an item “operation state,” a ratio of the substrate processing system 100 (or the substrate processing apparatus 101) in operation in the item “state” to the substrate processing systems 100 (or the substrate processing apparatuses 101) disposed in each area, appears.
In an item “total power consumption,” the sum of power consumption indicated by the item “power” of each of the substrate processing apparatuses 101 disposed in each area appears. Also, in an item “total N2 consumption,” the sum of N2 gas consumption indicated by the item “N2” of each of the substrate processing apparatuses 101 disposed in each area appears.
In an item “average operation rate,” a value obtained by averaging the sum of numerical values indicated by the item “operation rate” with the number of the substrate processing systems 100 (or the substrate processing apparatuses 101) in operation in each area appears. That is, the value is obtained by (the sum of numerical values indicated by “operation rate” in each area/the number of substrate processing apparatuses 101 in operation in each area)×100.
Further, in the item “apparatus name” that appears in
As described above, according to Embodiment 1, various information such as the apparatus operation rate, power consumption, and inert gas consumption of each substrate processing apparatus may be displayed on the screen, and thus, various information indicating a state of energy saving in the overall semiconductor manufacturing factory (or the overall particular area) or a state of energy saving for each substrate processing apparatus installed in the factory can be collectively recognized. Further, by recognizing a detailed state of individual energy saving of the substrate processing apparatuses, or the like installed in the overall semiconductor manufacturing factory (or the overall particular area), and analyzing data by using the information, energy saving measures may be established. For example, energy saving measures such as collecting substrate processing apparatuses 101 having low apparatus operation rate to a single area, and degeneration-operating the substrate processing apparatuses 101 in areas other than the foregoing area may be taken. Accordingly, an energy saving effect can be anticipated in the overall semiconductor manufacturing factory.
In the overview screen illustrated in
Further, as illustrated in
Further, in the overview screen illustrated in
Further, as illustrated in
Also, in the overview screen illustrated in
Further, as illustrated in
Further, in the overview screen of
That is, first, the processing display unit 506 acquires apparatus-specific information, operation time information, and recipe-specific information from the accumulation unit 505. As described above, the operation start time and the operation stop time of the operation information of the substrate processing system 100 (or the substrate processing apparatus 101) become the execution start time and the execution stop time of the recipe as it is. Thus, since the recipe is executed one time from the operation start time to the operation stop time of one time, the processing display unit 506 associates the operation start time and the operation stop time with the recipe-specific information and gives an execution number to every type of recipe as in the first of the recipe A—the first of recipe B. Thereafter, the processing display unit 506 determines the duration from the operation start time to the operation stop time (one recipe execution time) as a predetermined period, acquires power consumption information and inert gas consumption information of the predetermined period from the accumulation unit 505, calculates total power consumption and total inert gas consumption of the predetermined period and creates a graph based thereon, and displays the same on one screen for comparison. Accordingly, a state of energy saving of the substrate processing system 100 (or the substrate processing apparatus 101) can be more rapidly and accurately analyzed, regardless of a skill of the operator.
Further, a power consumption graph or an inert gas consumption graph may be created at every predetermined period (recipe execution number) and displayed in one screen for comparison. At this time, the processing display unit 506 may acquire recipe-specific information, write a recipe name or a recipe termination situation (normal termination, abnormal termination, etc.), or acquire apparatus-specific information and write an apparatus name, or write a recipe execution termination time (operation stop time), or the like. Also, without being limited to the graph indicating the total power consumption and total inert gas consumption, the processing display unit 506 may calculate any one of total heating power consumption, total exhaust power consumption, total control power consumption, and total process gas consumption at every type of recipe and every recipe execution time and display the same. Accordingly, a state of energy saving of the substrate processing system 100 (or the substrate processing apparatus 101) can be more rapidly and accurately analyzed, regardless of a skill of the operator.
Also, in the present embodiment, although not particularly described, in
Moreover, in the present embodiment, although not particularly described, in
Subsequently, in Embodiment 2, an example of a graph displayed when a radio button for displaying an item “overall factory” in calendar month (year comparison) is pressed in the command screen illustrated in
The processing display unit 506 acquires operation time information of a predetermined period (e.g., one month) from the accumulation unit 505, calculates the number of times that the operation start time and the operation stop time have occurred within the predetermined period, and calculates a total operation number of times within the predetermined period. Then, as illustrated in
The processing display unit 506 acquires operation time information of a predetermined period (e.g., one month) from the accumulation unit 505 and calculates a total operation time of the predetermined period. Then, as illustrated in
The processing display unit 506 first acquires operation time information of a predetermined period (e.g., one month) from the accumulation unit 505, and calculates a total operation time of the substrate processing system 100 as described above. Thereafter, the processing display unit 506 calculates a ratio of the total operation time to the predetermined period, and determines the ratio as an operation rate. That is, for example, in a case where the predetermined period is 24 hours and the total operation time (recipe execution time) of the substrate processing system 100 is 12 hours, an operation rate of the substrate processing system 100 is 50%. Then, as illustrated in
The processing display unit 506 may calculate total power consumption of a predetermined period (e.g., one month) of the substrate processing system 100 (or the substrate processing apparatus 101) and display the same. That is, the processing display unit 506 acquires apparatus power consumption information of a predetermined period from the accumulation unit 505, and calculates a total power consumption of the predetermined period. Then, as illustrated in
The processing display unit 506 may calculate inert gas consumption of a predetermined period (e.g., one month) of the substrate processing system 100 (or the substrate processing apparatus 101) and display the same. That is, the processing display unit 506 acquires inert gas consumption information of a predetermined period from the accumulation unit 505, and calculates total inert gas consumption of the predetermined period. Then, as illustrated in
Further, the processing display unit 506 may calculate process gas consumption of a predetermined period of the substrate processing system 100 (or the substrate processing apparatus 101) and display the same. That is, the processing display unit 506 acquires process gas consumption information of a predetermined period from the accumulation unit 505, and calculates total process gas consumption of the predetermined period. Then, the processing display unit 506 may create a graph of the calculated total process gas consumption and display the same. In general, a process gas is used only in a process step (substrate processing step), and thus, consumption of the process gas is extremely small, compared with an inert gas. Thus, even though the consumption of the process gas is monitored, since the effect of carrying out energy saving measures is marginal, it is omitted in the present embodiment.
In this manner, according to Embodiment 2, various kinds of information such as the total power consumption, the total operation number of times, and the like of the substrate processing apparatus 101 are displayed by calendar week, calendar month, and calendar day, and the like, and thus, various kinds of information of the substrate processing apparatus 101 can be recognized and the information may be helpfully used for analyzing data.
Subsequently, examples of a graph displayed in a case where a radio button for displaying the item “substrate processing apparatus” in the calendar day (lapse of month and day of the day-to-day) is pressed in the command screen illustrated in
As illustrated in
The processing display unit 506 calculates total heating power consumption as power consumption of a predetermined period (e.g., one day) of the heater 207 described later and displays the same. That is, the processing display unit 506 acquires heating power consumption information of the heater 207 of a predetermined period from the accumulation unit 505, calculates total heating power consumption of the predetermined period, creates a graph of the calculated total heating power consumption and displays the same, as illustrated in
The processing display unit 206 calculates total exhaust power consumption as power consumption of a predetermined period (e.g., one day) of the vacuum pump 246 described later and displays the same. That is, the processing display unit 506 acquires exhaust power consumption information of the vacuum pump 246 of a predetermined period from the accumulation unit 505, calculates total exhaust power consumption of the predetermined period, creates a graph of the calculated total exhaust power consumption and displays the same, as illustrated in
The processing display unit 206 calculates total control power consumption as power consumption of a predetermined period (e.g., one day) of the controller 280 described later and displays the same. That is, the processing display unit 506 acquires control power consumption information of the controller 280 of a predetermined period from the accumulation unit 505, calculates total control power consumption of the predetermined period, creates a graph of the calculated total control power consumption and displays the same, as illustrated in
In this manner, according to Embodiment 3, the total power consumption of the substrate processing apparatus 101 is calculated every day, and created as a graph and displayed, and thus, various kinds of information of the substrate processing apparatus 101 can be recognized and the information may be used for analyzing data. As a result, a state of energy saving of the substrate processing apparatus 101 can be analyzed and energy saving measure can be established, regardless of a skill of the operator.
Subsequently, examples of a graph displayed when a radio button for displaying the item “area” in the calendar week (lapse of every one week) is pressed in the command screen illustrated in
As illustrated in
The processing display unit 506 calculates total heating power consumption as power consumption of a predetermined period (e.g., one week) of the apparatus A and displays the same. That is, the processing display unit 506 acquires heating power consumption information, exhaust power consumption information, and control power consumption information of the apparatus A of a predetermined period from the accumulation unit 505, calculates total power consumption of the predetermined period, creates a graph of the calculated total power consumption of the apparatus A and displays the same, as illustrated in
The processing display unit 506 calculates total exhaust power consumption as power consumption of a predetermined period (e.g., one week) of the apparatus B and displays the same. That is, the processing display unit 506 acquires heating power consumption information, exhaust power consumption information, and control power consumption information of the apparatus B of a predetermined period from the accumulation unit 505, calculates total power consumption of the predetermined period, creates a graph of the calculated total power consumption of the apparatus B and displays the same, as illustrated in
The processing display unit 506 calculates total control power consumption as power consumption of a predetermined period (e.g., one week) of the apparatus C and displays the same. That is, the processing display unit 506 acquires heating power consumption information, exhaust power consumption information, and control power consumption information of the apparatus C of a predetermined period from the accumulation unit 505, calculates total power consumption of the predetermined period, creates a graph of the calculated total power consumption of the apparatus C and displays the same, as illustrated in
Further, power consumption of the heater 207, the vacuum pump 246, and the controller 280 are separately calculated in every substrate processing apparatus 101 (apparatus A, apparatus B, and apparatus C), and in
In this manner, according to Embodiment 4, various kinds of information such as total power consumption of the substrate processing apparatus 101 is displayed by calendar week, calendar month, an calendar day, and the like, and thus, various kinds of information of the substrate processing apparatus 101 can be recognized and the information may be helpfully used for analyzing data. As a result, a state of energy saving of the substrate processing apparatus 101 can be analyzed and energy saving measure can be established, regardless of a skill of the operator.
Further, the processing display unit 506 may calculate at least two of a total operation number of times, a total operation time, an operation rate, total power consumption, total heating power consumption, total exhaust power consumption, total control power consumption, total inert gas consumption, and total process gas consumption of the substrate processing system 100 (or the substrate processing apparatus 101) and create a graph, and display the same so as to be compared along the time axis on one screen.
That is, the processing display unit 506 may calculate at least two of the total operation number of times, the total operation time, the operation rate, the total power consumption, and the total inert gas consumption of the substrate processing system 100 (or the substrate processing apparatus 101) of a plurality of predetermined periods (e.g., one month), create a graph in every predetermined day, and display the graph to be compared along the time axis on one screen. For example, the graph indicating the total operation number of times of the substrate processing system 100 (or the substrate processing apparatus 101) of a predetermined period and the graph indicating the total operation time illustrated in
In addition, as illustrated in
In this case, at least two graphs among the graph indicating the total power consumption, the graph indicating the total heating power consumption, the graph indicating the total exhaust power consumption, and the graph indicating the total control power consumption of the predetermined period may be displayed on one screen so as to be compared.
In this manner, at least two graphs are displayed in parallel so as to be compared along the time axis on one screen, and thus, a state of energy saving of the substrate processing system 100 (or the substrate processing apparatus 101) can be more rapidly and accurately analyzed, regardless of a skill of the operator. As a result, a plan of energy saving measures can be easily and accurately made.
Further, the graphs illustrated in
As illustrated in
A manifold 209 having a concentric circle shape with the reaction tube 203 is disposed below the reaction tube 203. The manifold 209 is formed of a metal material such as, e.g., a stainless steel (SUS). The manifold 209 is formed to have a cylindrical shape with the upper and lower end portions opened. The manifold 209 is installed to support the reaction tube 203. Further, an O-ring 220a as a seal member is installed between the manifold 209 and the reaction tube 203. A reaction container is mainly formed by the reaction tube 203 and the manifold 209.
A seal cap 219 is installed below the manifold 209 as a furnace opening lid capable of tightly closing a lower end opening of the manifold 209. The seal cap 219 is formed of a metal such as, e.g., stainless steel, and has a disk shape. An O-ring 220b is installed as a seal member between the seal cap 219 and the manifold 209.
A boat 217 as a substrate support is erected on the seal cap 219 with an insulator 218 formed of, e.g., a quartz cap interposed therebetween. The boat 217 is formed of a heat resistant material such as, e.g., quartz or silicon carbide, and configured to support a plurality of wafers 200 in a horizontal posture and at multiple stages by arranging the wafers 200 in a tube axis direction with the centers of the wafers 200 aligned with one another, as described above.
A rotary mechanism 267 for rotating the boat 217 is installed on the side of the seal cap 219 opposite to the process chamber 201. A rotary shaft 255 of the rotary mechanism 254 is connected to the boat 217 through the seal cap 219, and configured to rotate the boat 217 to thereby rotate the wafer 200. The seal cap 219 is configured to be lifted and lowered in a vertical direction by a boat elevator 115 as a lifting mechanism installed outside of the reaction tube 203, whereby the boat 217 may be loaded into or unloaded from the process chamber 201.
A heater 207 as a heating means (heating mechanism) for heating the interior of the process chamber 201 is installed on an outer side of the reaction tube 203 to have a concentric circle shape surrounding a sidewall surface of the reaction tube 203. The heater 207 is formed to have a cylindrical shape. The heater 207 is supported by a heater base as a support plate so as to be installed vertically.
A temperature sensor is installed as a temperature detector within the reaction tube 203. A controller 280 described later is electrically connected to the heater 207 and the temperature sensor. The controller 280 is configured to control supply of power to the heater 207 based on temperature information detected by the temperature sensor at a predetermined timing such that an internal temperature of the process chamber 201 has a predetermined temperature distribution.
A first nozzle 233a as a first gas introduction part and a second nozzle 233b as a second gas introduction part are installed in the manifold 209 to pass through the manifold 209. A first gas supply pipe 232a is connected to the first nozzle 233a and a second gas supply pipe 232b is connected to the second nozzle 233b. In this manner, the two nozzles 233a and 233b and the two gas supply pipes 232a and 232b are connected to the manifold 209, and it is configured such that a plurality of types of, here, at least two types of process gases can be supplied into the process chamber 201.
The controller 280 described later is electrically connected to mass flow controllers (MFCs) 241a to 241d and valves 243a to 243d. The controller 280 is configured to control the MFCs 241a to 241d such that a flow rate of gas supplied into the process chamber 201 has a predetermined flow rate at a predetermined timing.
A first gas supply system is mainly configured by the first gas supply pipe 232a, the MFC 241a, the valve 243a and the first nozzle 233a. Also, it may be considered that a first gas supply source 240a is included in the first gas supply system. Further, a second gas supply system is mainly configured by the second gas supply pipe 232b, the MFC 241b, the valve 243b and the second nozzle 233b. Also, it may be considered that a second gas supply source 240b is included in the second gas supply system. The process gas supply system according to the present embodiment is configured by the first gas supply system and the second gas supply system.
A first inert gas supply system is mainly configured by a first inert gas supply pipe 232c, the MFC 241c, and the valve 243c. Also, it may be considered that a first inert gas supply source 240c or the first gas nozzle 233a is included in the first inert gas supply system. Further, a second inert gas supply system is mainly configured by a second inert gas supply pipe 232d, the MFC 241d, and the valve 243d. Also, it may be considered that a second inert gas supply source 240d or the second gas nozzle 233b is included in the second inert gas supply system. The inert gas supply system according to the present embodiment is configured by the first inert gas supply system and the second inert gas supply system.
The gas supply systems according to the present embodiment are configured by the first gas supply system, the second gas supply system, the first inert gas supply system and the second inert gas supply system.
A gas containing, e.g., a silicon element (Si) (silicon-containing gas) as a precursor gas is supplied into the process chamber 201 from the first gas supply pipe 232a through the MFC 241a, the valve 243a, and the first nozzle 233a. As the silicon-containing gas, e.g., a dichlorosilane (SiH2Cl2), abbreviation: DCS) gas may be used.
A gas containing, e.g., a nitrogen element (N) (nitrogen-containing gas) as a reaction gas is supplied into the process chamber 201 from the second gas supply pipe 232b through the MFC 241c, the valve 243c, and the second nozzle 233b. As the nitrogen-containing gas, for example, an ammonia (NH3) gas may be used.
An inert gas is supplied into the process chamber 201 from each of the first inert gas supply pipe 232c and the second inert gas supply pipe 232d through the MFCs 241c and 241d, the valves 243c and 243d, the first gas supply pipe 232a, the second gas supply pipe 232b, the first nozzle 233a, and the second nozzle 233b. As the inert gas, for example, the group 18 elements such as a helium (He) gas, a neon (Ne) gas and an argon (Ar) gas, or N2 may be used.
An exhaust pipe 231 is installed on a sidewall of the manifold 209 to evacuate air from the interior of the process chamber 201. A pressure sensor 245 as a pressure detector (pressure detecting unit) for detecting an internal pressure of the process chamber 201, an auto pressure controller (APC) valve 242 as a pressure regulator (pressure regulating unit), and a vacuum pump 246 as an exhaust device are installed in the exhaust pipe 231 in this order from the upper stream side.
The controller 280 described later is electrically connected to the pressure sensor 245 and the APC valve 242. The controller 280 is configured to control the APC valve 242 based on pressure information detected by the pressure sensor 245 such that the internal pressure of the process chamber 201 has predetermined pressure (degree of vacuum). An exhaust system is mainly configured by the exhaust pipe 231, the AFC valve 242 and the pressure sensor 245. Also, it may be considered that the vacuum pump 246 is included in the exhaust system.
The controller 280 as a control unit (control means) is connected to the MFCs 241a to 241d, the valves 243a to 243d, the pressure sensor 245, the APC value 242, the vacuum pump 246, the heater 207, the temperature sensor, the rotary mechanism 267, the boat elevator 215, and the like. A flow adjusting operation of various gases by the MFCs 241a to 241d, an opening and closing operation of the valves 243a to 243d, a pressure regulating operation based on opening and closing of the APC valve 242 and the pressure sensor 245, a pressure adjusting operation based on the pressure sensor 245, a temperature adjusting operation of the heater 207 based on the temperature sensor, actuation and stopping of the vacuum pump 246, a rotational speed adjusting operation of the rotary mechanism 267, a lifting and lowering operation of the boat elevator 215, and the like are controlled by the controller 280.
Next, a substrate processing process as a process of manufacturing a semiconductor device by using the vertical processing furnace 202 of the substrate processing system 100 described above is described. For example, an example of a process of forming a silicon nitride (SiN) film on the wafer 200 as a substrate is described with reference to
Further, in the present embodiment, for example, a DCS gas containing silicon as a precursor gas and an NH3 gas containing nitrogen as a reaction gas are supplied into the heated process chamber 201, and an SiN film is formed on the wafer 200 through a chemical vapor deposition (CVD) method.
First of all, a plurality of wafers 200 are charged in the boat 217 (wafer charging). Then, as illustrated in
The interior of the process chamber 201 is evacuated by the vacuum pump 246 to have a desired pressure (vacuum degree). At this time, an internal pressure of the process chamber 201 is measured by the pressure sensor 245, and a degree of opening of the APC valve 242 is feedback-controlled based on the measured pressure (pressure adjustment). Further, the interior of the process chamber 201 is heated by the heater 207 to have a desired temperature. At this time, in order for the interior of the process chamber 201 to have a desired temperature distribution, specifically, in order for the process chamber 201 to have a temperature distribution allowing for a CVD reaction, supply power to the heater 207 is feedback-controlled based on temperature information detected by the temperature sensor (temperature adjustment). Subsequently, the boat 217, i.e., the wafer 200, starts to be rotated by the rotary mechanism 267. The pressure adjustment, temperature adjustment, and rotation of the wafer 200 are continued until at least a film forming process described later is terminated.
Subsequently, an NH3 gas as a reaction gas is supplied into the process chamber 201. Specifically, the valve 243b installed in the second gas supply pipe 232b is opened. Accordingly, the NH3 gas supplied from the gas source 242b starts to be supplied into the process chamber 201 with the second nozzle 231b interposed therebetween, while adjusting a flow rate by the MFC 241b. Simultaneously, at least one of the valve 243c installed in the first inert gas supply pipe 232c and the valve 243d installed in the second inert gas supply pipe 232d is opened, and an Ar gas, which is an inert gas as a dilution gas or a carrier gas, may be supplied into the process chamber 201.
Subsequently, a DCS gas as a precursor gas is supplied into the process chamber 201 filled with the NH3 gas. Specifically, the valve 243a installed in the first gas supply pipe 232a is opened, and the DCS gas supplied from the first gas source 242a starts to be supplied into the process chamber 201 with the first nozzle 231a interposed therebetween. Simultaneously, at least any one of the valve 243c installed in the first inert gas supply pipe 232c and the valve 243d installed in the second inert gas supply pipe 232d is opened, and an Ar gas, which is an inert gas as a dilution gas or a carrier gas, may be supplied into the process chamber 201.
The DCS gas supplied into the process chamber 201 filled with the NH3 gas is diluted and diffused by the N2 gas and brought into contact with the surface of the wafer 200 heated when passing through the interior of the process chamber 201. As a result, an SiN film is deposited on the wafer 200.
After a predetermined period of time has lapsed, when the SiN film has a predetermined film thickness, the valve 243a is closed and the supply of the DCS gas into the process chamber 201 is stopped. Thereafter, the valve 243b is closed and the supply of the NH3 gas into the process chamber 201 is stopped.
After the supply of the DCS gas and the NH3 gas into the process chamber 201 is stopped, at least any one of the valve 243c and the valve 243d is left open, and the supply of the Ar gas into the process chamber 201 is continued. Thus, the interior of the process chamber 201 is purged by the Ar gas and a residual gas or a reaction product that remains within the process chamber 201 are removed.
When purging is completed, power supply to the heater 207 is stopped to decrease the internal temperature of the process chamber 20, and the degree of opening the APC valve 242 is adjusted to return the internal pressure of the process chamber 201 to an atmospheric pressure. Thereafter, the boat 217 is unloaded from the interior of the process chamber 201 (boat unloading) in reverse order of the order illustrated in the substrate loading process described above, and the wafer 200 with an SiN film having a predetermined thickness formed thereon is discharged from the boat 217 (wafer discharging), and the substrate processing process according to the present embodiment is terminated.
As illustrated in
A susceptor 317 that supports the wafer 200 is disposed in the center of a bottom side within the process chamber 301. The susceptor 317 is formed of a nonmetal material to reduce metal contamination of the wafer 200.
A heater 317b as a heating mechanism is integrally embedded within the susceptor 317 such that it can heat the wafer 200. When power is supplied to the heater 317b, a surface of the wafer 200 is heated to a predetermined temperature (e.g., room temperature to 1000 degrees C.). Further, a temperature sensor is installed in the susceptor 317. The controller 280 as described above is electrically connected to the heater 317b and the temperature sensor. The controller 280 is configured to control supply of power to the heater 317b based on temperature information detected by the temperature sensor at a predetermined timing.
In addition, an electrode for changing impedance is installed within the susceptor 317. The electrode is installed by the medium of an impedance variable mechanism 374. The impedance variable mechanism 374 includes a coil or a variable condenser, and by controlling the number of patterns of the coil or a capacitance value of the variable condenser, the impedance variable mechanism 374 may control a potential of the wafer 200 by the medium of the electrode and the susceptor 317. Further, the foregoing controller 280 is electrically connected to the impedance variable mechanism 374.
A lid 333 is airtightly installed in an opening formed in an upper portion of the upper container 310. A shielding plate 340 is installed below the lid 333. A space between the lid 333 and the shielding plate 340 is a buffer chamber 337. The buffer chamber 337 serves as a distribution space configured to distribute a process gas introduced from a gas introduction portion 334. Then, a process gas that passes through the buffer chamber 337 is supplied from a side gas discharge hole 339 of the shielding plate 340 into the process chamber 301.
A gas supply pipe 332 is connected to the gas introduction portion 334. A gas source for supplying a process gas or an inert gas, an MFC 341 as a flow control device, and a valve 343a as an opening and closing valve are installed in the gas supply pipe 332 in this order from an upstream side. The foregoing controller 280 is electrically connected to the MFC 341 and the valve 343a. The controller 280 is configured to control opening and closing of the valve 343a and the MFC 341 such that a flow rate of gas supplied into the process chamber 301 is a predetermined flow rate. In this manner, it is configured such that, by opening and closing the valve 343a, a process gas or an inert gas may be freely supplied into the process chamber 301 by the medium of the gas supply pipe 332, the buffer chamber 337, and the gas discharge hole 339, while controlling a flow rate by the MFC 341. A gas supply unit according to the present embodiment is mainly configured by the gas supply pipe 332, the MFC 341, and the valve 343a. Also, it may be considered that the gas supply source is included in the gas supply unit according to the present embodiment.
A gas exhaust port 335 for exhausting a process gas or the like from the interior of the process chamber 301 is installed in a lower portion of a sidewall of the lower container 311. An upstream end of the gas exhaust pipe 331 for exhausting a gas is connected to the gas exhaust port 335. An APC 342 as a pressure adjuster, a valve 343b as an opening and closing valve, and a vacuum pump 346 as an exhaust device are installed in the gas exhaust pipe 331 in this order from an upstream. The foregoing controller 280 is electrically connected to the APC 342, the valve 343b, and the vacuum pump 346. It is configured such that, by opening the valve 343b by operating the vacuum pump 346, the interior of the process chamber 301 can be exhausted. Also, it is configured such that, by adjusting a degree of opening of the APC 342, an internal pressure value of the process chamber 301 can be adjusted.
On an outer circumference of the process container 303 (upper container 310), a container-shaped electrode 315 is installed to surround a plasma generation region 324 within the process chamber 301. The container-shaped electrode 315 is formed to have a container shape, e.g., a cylindrical shape. The container-shaped electrode 315 is connected to a high-frequency power 373 that generates a high-frequency power with a matching unit 372 which performs impedance matching interposed therebetween. The container-shaped electrode 315 serves as a discharge mechanism that plasma-excites a process gas supplied into the process chamber 301.
After at least a process gas is supplied into the process chamber 301, a high-frequency power is supplied to the container-shaped electrode 315 to form an electric field, and a magnetic field is formed by using an upper magnet 316a and a lower magnet 316b, thus generating a magnetron discharge plasma in a plasma generation region 324 within the process chamber 301. At this time, as the foregoing electromagnetic field circulates emitted electrons, an ionization generation rate of plasma can be increased and a high-density plasma having long lifespan can be generated.
Further, the substrate processing process performed by using a sheet process chamber regarding the present embodiment has at least a substrate loading process, a substrate processing process, and a substrate unloading process. That is, the substrate processing process performed by using the vertical processing furnace as described above, for example, the substrate processing process includes a substrate loading process, a pressure temperature adjusting process, a treating process, a purge process, and an atmospheric pressure returning substrate unloading process.
According to the present embodiment, one or a plurality of effects can be obtained as follows.
(a) According to the present embodiment, there is provided a management device 500 including an accumulation unit 505 configured to acquire at least any one of power consumption information about power consumed in the substrate processing apparatus 101 that processes a substrate, gas consumption information about gas consumed in the substrate processing apparatus 101, and operation information about an operation state of the substrate processing apparatus 101 and accumulating the same such that it can be read, and a processing display unit 506 configured to acquire information that meets a predetermined condition from the accumulation unit 505, calculate at least any one of power consumption and inert gas consumption consumed by the substrate processing apparatus 101, and an operation rate of the substrate processing apparatus 101, and display the same on a display unit 508. Thus, a state of energy saving of each substrate processing apparatus 101 installed in the overall semiconductor manufacturing factory (or the overall particular area) can be rapidly and accurately analyzed at low cost, regardless of a skill of the operator. Accordingly, it is easy to establish energy saving measures of the substrate processing apparatus 101 or analyze the generation of an abnormal phenomenon of the substrate processing apparatus 101. That is, a plan of energy saving measures of the substrate processing apparatus 101 can be easily made. Further, it may be helpful as a tool that assists a thought of the operator, such as recognition of a problem of the substrate processing apparatus 101, recognition of a sign of failure of the substrate processing apparatus 101, detection of a problem of a recipe, and the like.
(b) According to the present embodiment, the accumulation unit 505 is configured to accumulate apparatus-specific information that specifies the substrate processing apparatus 101 in operation, operation time information that specifies an operation start time and an operation stop time of the substrate processing apparatus 101, and recipe-specific information that specifies a recipe for substrate processing executed by the substrate processing apparatus 101, as operation information indicating an operational situation of the substrate processing apparatus 101. Then, by acquiring at least any one of the apparatus-specific information, the operation time information, and the recipe specific information from the accumulation unit 505, the processing display unit 506 is configured to calculate a total operation number of times of a predetermined period of the substrate processing apparatus 101, a total operation time of the substrate processing apparatus 101 within the predetermined period, and an operation rate of the substrate processing apparatus 101 within the predetermined period, and display the same. Thus, the operation rate, an operation state, and the like of the substrate processing apparatus 101 can be rapidly and accurately analyzed to be recognized, regardless of a skill of the operator. Accordingly, it is easy to establish energy saving measures of the substrate processing apparatus 101. Further, when a plan of the energy saving measures is made, it may also be helpful as a tool that assists a thought of the operator.
(c) According to the present embodiment, the accumulation unit 505 is configured to accumulate apparatus power consumption information of the substrate processing apparatus 101 and power consumption time information that specifies power consumption start time and power consumption stop time of the substrate processing apparatus 101, as power consumption information indicating a power consumption situation of the substrate processing apparatus 101. Then, by acquiring the apparatus power consumption information and the power consumption time information from the accumulation unit 505, the processing display unit 506 is configured to calculate total power consumption of a predetermined period of the substrate processing apparatus 101 and display the same. Thus, total power consumption of the substrate processing apparatus 101 can be rapidly or accurately analyzed to be recognized regardless of a skill of the operator, and it may be helpful to establish energy saving measures. In addition, since power consumption is reduced, the generation of greenhouse gas can be reduced.
(d) According to the present embodiment, the accumulation unit 505 is configured to accumulate inert gas consumption information and inert gas consumption time information that specifies an inert gas consumption start time and an inert gas consumption stop time supplied from auxiliary equipment of a gas supply system, as gas consumption information indicating a gas consumption situation of the substrate processing apparatus 101. Then, by acquiring the inert gas consumption information and the inert gas consumption time information from the accumulation unit 50, the processing display unit 506 is configured to calculate total inert gas consumption of a predetermined period of the substrate processing apparatus 101 and display the same. Thus, consumption of an inert gas which is greatly consumed can be rapidly and accurately analyzed to be recognized regardless of a skill of the operator and it may be helpful to establish energy saving measures.
(e) According to the present embodiment, the substrate processing apparatus 101 includes a heater 207 for heating the wafer 200, and the accumulation unit 505 is configured to accumulate heating power consumption information as power consumption of the heater 207 and heating time information that specifies a power consumption start time and a power consumption stop time of the heater 207. Then, by acquiring the heating power consumption information and the heating time information from the accumulation unit 505, the processing display unit 506 is configured to calculate total heating power consumption of the predetermined period of the heater 207 and display the same. Thus, in the substrate processing apparatus 101, in particular, power consumption of the heater 207, which consumes a large amount of power, can be rapidly and accurately analyzed to be recognized regardless of a skill of the operator and it may be helpful to establish energy saving measures.
(f) According to the present embodiment, a vacuum pump 246 as auxiliary equipment of a gas exhaust system that exhausts the interior of the process chamber 201 which processes the wafer 200 is provided, and the accumulation unit 505 is configured to accumulate exhaust power consumption information as power consumption of the vacuum pump 246 and exhaust time information that specifies a power consumption start time and a power consumption stop time of the vacuum pump 246. Then, by acquiring the exhaust power consumption information and the exhaust time information from the accumulation unit 505, the processing display unit 506 is configured to calculate total exhaust power consumption of a predetermined period of the vacuum pump 246 and display the same. Thus, in the substrate processing apparatus 101, power consumption of the vacuum pump 246, which consumes a large amount of power, can be rapidly and accurately analyzed to be recognized regardless of a skill of the operator and it may be helpful to establish energy saving measures.
(g) According to the present embodiment, the substrate processing apparatus 101 includes the controller 280 that controls at least the heater 207 and the vacuum pump 246, and the accumulation unit 505 is configured to accumulate control power consumption information as power consumption of the controller 280 and control time information that specifies a power consumption start time and a power consumption stop time of the controller 280. Then, by acquiring the control power consumption information and the control time information from the accumulation unit 505, the processing display unit 506 is configured to calculate total control power consumption of a predetermined period of the controller 280 and display the same. Thus, in the substrate processing apparatus 101, power consumption of the controller 280, which consumes a large amount of power, can be rapidly and accurately analyzed to be recognized regardless of a skill of the operator and it may be helpful to establish energy saving measures.
(h) According to the present embodiment, the processing display unit 506 is configured to create a graph of the total operation number of times, the total operation time, the operation rate, the total power consumption, the total heating power consumption, the total exhaust power consumption, the total control power consumption, and the total inert gas consumption described above, and display the same. Thus, visibility can be enhanced and the operator can more rapidly and accurately analyze a state of the substrate processing apparatus 101 and easily find out a problem or fault of the substrate processing apparatus 101.
(i) According to the present embodiment, the processing display unit 506 is configured to create graphs of at least two of the total operation number of times, the total operation time, the operation rate, the total power consumption, the total heating power consumption, the total exhaust power consumption, the total control power consumption, and the total inert gas consumption described above, and display the graphs such that they are compared along a time axis on one screen. Thus, visibility can be enhanced and the operator can more rapidly and accurately analyze a state of the substrate processing apparatus 101 and easily find out a problem or fault of the substrate processing apparatus 101.
For example, the graph of the operation rate illustrated in
In addition, for example, as illustrated in
Moreover, for example, as illustrated in
Further, for example, the processing display unit 506 may calculate a load rate of the substrate processing apparatus 101 and display the same. In general, when a high load rate of the substrate processing apparatus 101 continues for a long period of time, a breaker falls and co nsumption of the substrate processing apparatus 101 becomes early. Thus, by analyzing a load rate of the substrate processing apparatus 101, measures that can help to make a plan of updating the substrate processing apparatus 101, review a breaker, and review a power line can be taken.
Further, in the embodiment described above, at least two graphs are displayed to be compared on one screen, but for example, the operation rate or the total power consumption may be indicated as numerical values and displayed to be compared on one screen.
Additionally, in the embodiment described above, the accumulation unit 505 accumulates acquired information in a table form, but the present disclosure is not limited thereto and the obtained information may be accumulated to be readable by the accumulation unit 505.
Moreover, in the embodiment described above, the accumulation unit 505 acquires information from the substrate processing apparatus 101 through the memory 502, but the present disclosure is not limited thereto, and for example, the accumulation unit 505 may be configured to obtain information directly from the substrate processing apparatus 101.
Further, in the embodiment described above, the accumulation unit 505 accumulate average vales of each consumption of a predetermined interval of data acquisition, as the apparatus power consumption information, the heating power consumption information, the exhaust power consumption information, the control power consumption information, the inert gas consumption information, and the like, and the processing display unit 506 calculates total power consumption, or the like on the basis of each information of the average value and displays the same, but the present disclosure is not limited thereto. For example, the accumulation unit 505 may accumulate a maximum value or a minimum value of each consumption of the predetermined interval of data acquisition, as the apparatus power consumption information, the inert gas consumption information, and the like, and the processing display unit 506 may calculate the total power consumption, or the like on the basis of each information of the maximum value or the minimum value, and display the same.
Further, in the embodiment described above, the group management device 102 is installed in every substrate processing apparatus 101, but the group management device 102 may be shared by the plurality of substrate processing apparatuses 101 as described later.
In addition, in the embodiment described above, the network connection-type power sensor and the inert gas consumption sensor are installed to automate collection of data required for planning energy saving measures and accumulate the same in the accumulation unit. Thus, the operation is finished without causing a trouble such as information aggregate. Also, similarly, a flow rate sensor may also be installed in cooling water, and data may be collected.
While the embodiment of the present disclosure has been described in detail above, the present disclosure is not limited to the embodiment described above and may be variously modified without departing from the spirit and scope of the present disclosure.
For example, as illustrated in
Here, when an information provision program that includes a data accumulation program and a data analysis program is installed in the management device 510, the monitor server 102 or the substrate processing system 100 may need to perform a remote log-in to the management device 510. When the log-in is normally terminated, it is configured such that the data analysis program may be executed. When the monitor server 102 or the substrate processing system 100 fails to log in, the management device 510 is configured not to execute the data analysis program. In this case, the accumulation unit 505 as a database is installed in the management device 510.
When the data analysis program is installed in the monitor server 102, the substrate processing system 100 is configured to execute the data analysis program by performing remote log-in to the monitor server 102 which is connected thereto. For example, when log-in of the substrate processing system 100 (or the substrate processing apparatus 101) connected to the monitor server 102 fails, it is configured such that the data analysis program cannot be executed in the monitor server 102. This is because, if a leakage of data regarding energy saving consumed in the substrate processing system 100 (or the substrate processing apparatus 101) connected to the monitor server 102 occurs, it is impossible to accurately analyze the data. However, the data analysis program may be executed even though every substrate processing system 100 (or substrate processing apparatus 101) fails to log in. Also, in this case, the accumulation unit 505 is installed in the monitor server 102.
When the data analysis program is installed in the controller 280 of the substrate processing system 100 the management device 510 or the monitor server 102 is configured to refer to the result of execution of the data analysis program by performing remote log-in to the substrate processing system 100. At this time, the accumulation unit 505 is installed in the substrate processing system 100.
Further, the management device 510 may execute the data analysis program of the overall factory, for example, and the monitor server 102 may execute the data analysis program of a predetermined area, for example, and the substrate processing system 100 may execute the data analysis program of the substrate processing system 100. At this time, required information may be downloaded from the management device 510 to the monitor server 102 or the substrate processing system 100 or from the monitor server 102 to the substrate processing system 100. Also, required information may be uploaded from the substrate processing system 100 to the monitor server 102 or the management device 510 or from the monitor server 102 to the management device 510. In this case, the accumulation unit 505 may be installed in each of the management device 510, the monitor server 102, and the controller 280 of the substrate processing system 100.
The overview screen illustrated in
Also, in another embodiment described above, various kinds of information such as an apparatus operation rate, power consumption, and inert gas consumption of each substrate processing apparatus 101 may be displayed on the screen, and thus, various kinds of information indicating a state of energy saving in each substrate processing apparatus 101 connected to the group management device 102, a film thicknesses measuring instrument, or the like may be collectively recognized. Further, by recognizing a detailed state of energy saving of individual substrate processing apparatus 101 or the like connected to the group management device 102, data may be analyzed by using the information, thus contributing to energy saving measures. For example, since the apparatus operation rate is low, energy saving measures such that every substrate processing apparatus 101 is connected to the single group management device 102 and degeneration operation is performed may be performed. Thus, energy saving effect can be anticipated.
Moreover, the present disclosure is not limited to a case in which the substrate processing apparatus 101 and the group management device 102 are disposed in the same floor (in the same clean room). For example, the substrate processing apparatus 101 may be disposed in the clean room, the group management device 102 may be disposed in an office (in a floor different from the clean room), and a progress situation of recipe or a state of the substrate processing apparatus 101 may be remotely monitored and analyzed through the network 400 such as a LAN. Alternatively, some components of the management device 500, for example, only the display unit 508, may be disposed in the office.
Step 3 is a process of searching a data table depending on a preset predetermined condition and acquiring desired data, and step 4 is a process of determining termination of data acquisition. Step 3 and step 4 are data obtaining processes. Specifically, in step 3, a data table is searched based on display period data indicating a data acquisition period and display range data indicating a range of a data acquisition target which are set under a predetermined condition, and a measurement value of utility data, for example, at least information related to an apparatus operation rate of the substrate processing apparatus 101 such as power consumption consumed by the substrate processing apparatus 101, inert gas consumption, recipe-specific information, operation information are acquired. For example, in case of operation information, an operation start time and an operation termination time in a display period are repeatedly obtained. Step 4 is repeatedly performed until it is determined that obtaining of every data is terminated. Then, when it is determined that every data has been obtained in step 4, the flow proceeds to step 5.
Step 5 is a data processing process of processing acquired data and displaying a screen. Specifically, based on information obtained in the data obtaining processes (step 3 and step 4) (e.g., power consumption consumed in the substrate processing apparatus 101, inert gas consumption, and information related to an apparatus operation rate of the substrate processing apparatus 101) by the data processing unit 506, an operation state in a predetermined period (information indicating an operation state of the substrate processing apparatus 101 in an area), total power consumption (information of the sum of power consumption of every substrate processing apparatus 101 disposed in the area), total N2 gas consumption (information of the sum of amounts of N2 gas consumed by every substrate processing apparatus 101 disposed in the area), and an average operation rate (information indicating a recipe execution state of every substrate processing apparatus 101 disposed in the area) are created in every area. In this embodiment, while
Then, when a data display request instruction is received in step 6, the data display contents is checked and a predetermined condition is derived (step 7). A data table is searched based on the derived predetermined condition to acquire predetermined data (step 8), and the acquired data is processed and displayed in a predetermined format (step 9). Thereafter, the flow is returned to step 6 and a next data display request is awaited.
Also, in this embodiment (modification), when a predetermined button of the overview screen of
Further, log-in processing, which is omitted in the flow of the information provision program including the data accumulation program and the data analysis program of
Moreover, the screen displayed by the information provision program in the present embodiment (modification) is not limited to the overview screen illustrated in
Also, this embodiment (modification) and the present embodiment (in particular, Embodiment 1) are different only in the display flow of the overview screen illustrated in
Here, in the present embodiment including the modification described above, it is configured such that, after a predetermined item is selected from the overview screen of
Furthermore, as well as being applied to a case of performing a film forming process that forms various films such as an oxide film, a nitride film, and a metal film in the processing process, the present disclosure may also be applied to any other cases of processing a substrate such as a diffusion process, an annealing process, a nitriding process, and a lithography process. In addition, as well as being applied to a thin film forming device, the present disclosure may also be applied to any other substrate process devices such as an etching device, an annealing device, an oxidation device, a nitriding device, an exposing device, an application device, a mold device, a developing device, a dicing device, a wire bonding device, a drying device, a heating device, an inspection device, and the like. Also, in the present disclosure, these various substrate processing apparatuses may coexist in a single substrate processing system.
Moreover, the present disclosure may also be applied to a substrate processing apparatus such as a liquid crystal display (LCD) manufacturing apparatus that processes a glass substrate, without being limited to a semiconductor manufacturing apparatus or the like that processes a semiconductor wafer as described above.
Hereinafter, some aspects of the present disclosure will be additionally stated as supplementary notes.
According to one aspect of the present disclosure, there is provided an integrated management system including a substrate processing apparatus configured to process a substrate and a management device, the management device including: an accumulation unit configured to accumulate specified information including power consumption information indicating a power consumed in the substrate processing apparatus, gas consumption information indicating a gas consumed in the substrate processing apparatus, or operation information indicating an operation state of the substrate processing apparatus; and a processing display unit configured to acquire predetermined information that meets a predetermined condition from the specified information accumulated in the accumulation unit and calculate at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an operation rate of the substrate processing apparatus based on the predetermined information.
In the integrated management system of Supplementary Note 1, the substrate processing apparatus may include auxiliary equipment, and the accumulation unit may be configured to acquire information on the substrate processing apparatus and the auxiliary equipment, and accumulate the acquired information in a computer-readable manner.
In the integrated management system of Supplementary Note 1, the accumulation unit may be configured to: accumulate, as at least the operation information, apparatus-specific information which specifies the substrate processing apparatus in operation, operation time information which specifies an operation start time and an operation stop time of the substrate processing apparatus, and recipe-specific information which specifies a substrate processing recipe executed by the substrate processing apparatus; accumulate, as the power consumption information, apparatus power consumption information of the substrate processing apparatus, and power consumption time information which specifies a power consumption start time and a power consumption stop time of the substrate processing apparatus; and accumulate, as the gas consumption information, inert gas consumption information of a gas supply system and inert gas consumption time information which specifies an inert gas consumption start time and an inert gas consumption stop time.
In the integrated management system of Supplementary Note 1, the substrate processing apparatus may include a heating unit configured to heat the substrate, an exhaust unit configured to evacuate an interior of a process chamber for processing the substrate in the substrate processing apparatus, and a control unit configured to control the heating unit and the exhaust unit, and wherein the accumulation unit is configured to accumulate, as the power consumption information, heating power consumption information indicating power consumption of the heating unit, heating time information which specifies a power consumption start time and a power consumption stop time of the heating unit, exhaust power consumption information indicating power consumption of the exhaust unit, exhaust time information which specifies a power consumption start time and a power consumption stop time of the exhaust unit, control power consumption information indicating power consumption of the control unit, and control time information which specifies a power consumption start time and a power consumption stop time of the control unit.
In the integrated management system of Supplementary Note 1, the accumulation unit may be configured to accumulate, as the gas consumption information, process gas consumption information of a gas supply system and process gas consumption time information which specifies a process gas consumption start time and a process gas consumption stop time.
In the integrated management system of Supplementary Note 1, the processing display unit may be configured to calculate: total operation number of times of the substrate processing apparatus for a predetermined period; a total operation time of the substrate processing apparatus for the predetermined period; an operation rate of the substrate processing apparatus for the predetermined period; total power consumption of the substrate processing apparatus for the predetermined period; total heating power consumption of a heating unit for the predetermined period; total exhaust power consumption of an exhaust unit for the predetermined period; total control power consumption of a control unit for the predetermined period; and total inert gas consumption of a gas supply system for the predetermined period.
In the integrated management system of Supplementary Note 6, the processing display unit may be configured to generate graphs of the total operation number of times, the total operation time, the operation rate, the total power consumption, the total heating power consumption, the total exhaust power consumption, the total control power consumption, and the total inert gas consumption, and display the generated graphs.
In the integrated management system of Supplementary Note 6, the processing display unit may be configured to generate graphs of at least two among the total operation number of times, the total operation time, the operation rate, the total power consumption, the total heating power consumption, the total exhaust power consumption, the total control power consumption, and the total inert gas consumption, and display the generated graphs to be compared along a time axis on one screen.
According to another aspect of the present disclosure, there is provided a management device including: an accumulation unit configured to accumulate specified information including power consumption information indicating a power consumed in a substrate processing apparatus configured to process a substrate, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus; and a processing display unit configured to acquire predetermined information that meets a predetermined condition from the specified information accumulated in the accumulation unit and calculate at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus based on the predetermined information.
According to another aspect of the present disclosure, there is provided a method of displaying information for a substrate processing apparatus, including: accumulating specified information including power consumption information indicating a power consumed in a substrate processing apparatus configured to process a substrate, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus; and acquiring predetermined information that meets a predetermined condition from the specified information accumulated in the act of accumulating the specified information, calculating at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus based on the predetermined information, and displaying a calculation result.
In the method of Supplementary Note 10, the act of accumulating the specified information may include accumulating, as the operation information, apparatus-specific information which specifies the substrate processing apparatus in operation, operation time information which specifies an operation start time and an operation stop time of the substrate processing apparatus, and recipe-specific information which specifies a substrate processing recipe executed by the substrate processing apparatus, and the act of displaying the predetermined information includes calculating the apparatus operation rate of the substrate processing apparatus based on the operation time information and the recipe-specific information, calculating an average value of the apparatus operation rate for a display period of the apparatus operation rate, and displaying a calculated average value.
In the method of Supplementary Note 11, the apparatus operation rate may be indicative of a ratio of recipe execution time in a day.
In the method of Supplementary Note 11, the act of displaying the predetermined information may include calculating an average apparatus operation rate by averaging the calculated apparatus operation rate for the substrate processing apparatus in operation, which is specified in the apparatus-specific information, and displaying the calculated average apparatus operation rate.
In the method of Supplementary Note 11, the recipe-specific information may include at least one among a name of a recipe, an execution start time of the recipe and an execution stop time of the recipe, and a termination state of the recipe (normal termination or abnormal termination), and the like.
In the method of Supplementary Note 10, the act of displaying the predetermined information may include calculating a total power consumption and a total inert gas consumption by integrating the power consumption and the inert gas consumption calculated for each of the substrate processing apparatus, calculating an average apparatus operation rate by averaging the apparatus operation rate of each of the substrate processing apparatus, and displaying the calculated average apparatus operation rate.
In the method of Supplementary Note 10, the act of accumulating the specified information may include generating a predetermined data table that stores the specified information, and the act of displaying the predetermined information includes: receiving an instruction to acquire the predetermined information that meets the predetermined condition; repetitively searching the predetermined data table for the predetermined information; and calculating, after the predetermined information is acquired by act of repetitively searching the predetermined data table, at least one among the power consumption consumed in the substrate processing apparatus, the inert gas consumption, and the apparatus operation rate of the substrate processing apparatus, from the predetermined information which is acquired based on the predetermined condition.
According to another aspect of the present disclosure, there is provided an information provision program executed by a management device configured to manage a substrate processing apparatus for processing a substrate, including: accumulating specified information including power consumption information indicating a power consumed in a substrate processing apparatus, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus; and acquiring predetermined information that meets a predetermined condition, calculating at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus based on the predetermined information, and displaying a calculation result.
According to another aspect of the present disclosure, there is provided an information provision program including: accumulating specified information including power consumption information indicating a power consumed in a substrate processing apparatus, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus; acquiring predetermined information that meets a predetermined condition; and calculating at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus based on the predetermined information, and displaying a calculation result.
According to another aspect of the present disclosure, there is an information provision program including: accumulating specified information including power consumption information indicating a power consumed in a substrate processing apparatus, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus by generating a predetermined data table including the specified information; receiving an instruction to acquire predetermined information that meets a predetermined condition and repetitively searching the predetermined data table for the predetermined information; terminating the act of searching for the predetermined information; and calculating at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus, from the predetermined information which is acquired based on the predetermined condition, and displaying a calculation result.
According to another aspect of the present disclosure, there is provided a non-transitory computer-readable recording medium storing an information provision program that causes a management device configured to manage a substrate processing apparatus for processing a substrate, to perform: accumulating specified information including power consumption information on power consumed in the substrate processing apparatus, gas consumption information on gas consumed in the substrate processing apparatus, or operation information on an operation state of the substrate processing apparatus; and acquiring information that meets a predetermined condition, calculating at least one among power consumption consumed in the substrate processing apparatus, inert gas consumption, and an operation rate of the substrate processing apparatus, and displaying a calculation result.
According to another aspect of the present disclosure, there is provided a computer-readable recording medium storing an information provision program including: accumulating specified information including power consumption information indicating a power consumed in a substrate processing apparatus, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus; acquiring predetermined information that meets a predetermined condition; and calculating at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus based on the predetermined information, and displaying a calculation result.
According to another aspect of the present disclosure, there is provided a computer-readable recording medium storing an information provision program, including: accumulating specified information including power consumption information indicating a power consumed in a substrate processing apparatus, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus by generating a predetermined data table including the specified information; receiving an instruction to acquire predetermined information that meets a predetermined condition and repetitively searching the predetermined data table for the predetermined information; terminating acquisition of the predetermined information by searching for the predetermined information; and calculating at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus, from the predetermined information which is acquired based on the predetermined condition, and displaying a calculation result.
According to another aspect of the present disclosure, there is provided a computer-readable recording medium storing a data analysis program including: receiving an instruction to acquire predetermined information that meets a predetermined condition; repetitively searching a predetermined data table that defines specified information including power consumption information indicating a power consumed in a substrate processing apparatus, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus; terminating acquisition of the predetermined information by searching for the predetermined information; and calculating at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus, from the predetermined information which is acquired based on the predetermined condition, and displaying a calculation result.
According to another aspect of the present disclosure, there is provided a data analysis program including: receiving an instruction to acquire predetermined information that meets a predetermined condition; repetitively searching g a predetermined data table that defines specified information including power consumption information indicating a power consumed in a substrate processing apparatus, gas consumption information indicating a gas consumed in the substrate processing apparatus, and operation information indicating an operation state of the substrate processing apparatus; terminating acquisition of the predetermined information by searching for the predetermined information; and calculating at least one among a power consumption consumed in the substrate processing apparatus, an inert gas consumption, and an apparatus operation rate of the substrate processing apparatus, from the predetermined information which is acquired based on the predetermined condition, and displaying a calculation result.
This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2012-212553, filed on Sep. 26, 2012, the entire contents of which are incorporated herein by reference.
According to the present disclosure in some embodiments, it is possible to provide an integrated management system, a management device, and a method of displaying information for a substrate processing apparatus, which are capable of accumulating various data collected from each substrate processing apparatus installed in a semiconductor manufacturing factory, processing the accumulated data into data required to save energy for each substrate processing apparatus, and displaying the same.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2012-212553 | Sep 2012 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2013/075686 | 9/24/2013 | WO | 00 |
