The present invention relates to semiconductor laser arrays for producing plural output beams in a precise array configuration. In particular, though not exclusively, such laser arrays have applicability in telecommunications devices, graphics devices, image transfer devices, imaging and display technologies, solid-state laser pumping and in optical pumping of arrays of vertical cavity surface emitting laser diodes.
A number of systems in the above technical fields require the production of an array of optical spots with at least some of the following characteristics:
For convenience, throughout the present specification, we shall refer to the x-direction as that which is parallel to the plane of the semiconductor laser array substrate and orthogonal to the beam direction; the y-direction as orthogonal to the plane of the substrate and orthogonal to the beam direction; and the z-direction as the direction of beam propagation.
Monolithic arrays of semiconductor lasers fabricated on a single substrate, in which each contiguous element is identical to its neighbour and in which each element is independently controllable, can meet some of these requirements. Such arrays can be integrated into an optical beam delivery system with a small package form-factor. Such a system is, in principle, easy to mass produce and therefore of relatively low cost.
However, as the number of laser elements required in the array increases, element failures occur, the array yield drops and the cost increases significantly. At the present state of technology, it is prohibitively expensive to manufacture arrays of telecom standard lasers because of the difficulty in cleaving to form the laser output facet with the required degree of precision across an entire array. Thus, many of the benefits of laser integration cannot be realised.
As discussed above, many laser array applications require sub-micron alignment accuracy of the output spots in the x and y directions. Fibre bundles have been used as beam delivery systems to couple the output beams of a laser diode array into a downstream optical system, but this approach becomes expensive, bulky and impractical for large laser arrays (eg. arrays comprising more than ten individual laser outputs). Free-space optics can also be used to couple the output beams of the laser diode array into a downstream optical system, but large arrays of micro-optics are difficult to manufacture and there are significant problems associated with alignment of the optics with both the laser diode array and the downstream optical system.
Problems associated with the manufacture of large laser arrays are numerous. If the laser pitch (i.e. the centre-to-centre distance of adjacent lasers in the array) is too small, adjacent lasers will interact thermally (referred to as ‘thermal cross-talk’). This may result in temperature differences across the array. As many laser characteristics, such as threshold current, slope efficiency etc, are dependent on temperature, thermal cross-talk affects the performance of each laser element across the array. This results in unwanted variability in the output spots. In addition, thermal cross-talk can cause beam steering to take place.
After lapping, there may be a ‘smile’ associated with the flatness caused by distortion of the plane of the substrate. This results in deviation in the position of the optical spots from an intended array formation. The cleave quality may not be uniform across an array which results in varying qualities of output beam between individual lasers in the array. Individual elements of the array may exhibit beam steering effects, even when operated alone, arising from thermal effects during operation.
Thus, trade-offs between performance, reliability, yield and cost will determine the maximum number of elements in the array. Primarily, yield and reliability will limit the practical size of the array. In a typical present day telecoms application, laser arrays are practically limited to fewer than 10 laser elements, and cost effective arrays are typically limited to approximately 4 laser elements.
Further limitations arise from packaging of arrays. For example, the packaging process must not interfere with the flatness of the laser array after bonding. This can arise as a result of inadequate flatness of the carrier or from strain and damage during the bonding process.
For large arrays, mechanical and thermal strain and stress during operation of the array can give rise to significant beam misalignments, especially where free-space optics are used to couple the beams into an optical system.
The use of micro-optics systems to couple laser diode outputs to an optical system also gives rise to other problems. For example, each micro-lens has to be aligned with sub-micron precision to a respective laser element across the array. The micro-optics array may have to be custom built, which is expensive and difficult to package. Thermal and/or mechanical shock or other movement during operation can misalign the beams.
WO 02/47915 A1 describes a laser diode array together with a beam delivery system in the form of a beam-shaping micro-light-pipe array. However, the optical system described in WO '915 relates to resolving specific problems with multi-mode lasers, namely ‘filamentation’ or ‘hot-spots’ that result in non-uniform energy distribution in the near field. Specifically, the apparatus described images the multi-mode laser diodes in the array using a ‘micro-light-pipe array’ (MLPA) to achieve spots with evenly distributed energy by ensuring that each beam experiences a number of bounces from the walls of its respective light pipe in the MLPA through which it travels. Due to the multiple reflections, the illumination in each MLP exit aperture is relatively uniform. The light ‘scrambling’ performed by the MLPA inherently excludes single-mode operation. For the reasons discussed above, the apparatus of WO '915 is inherently limited to arrays having only a relatively small number of light pipes. The described light pipes are rods or tubes of transparent material with a polygonal cross-section which cannot be reliably manufactured to the sub-micron dimensions required for a single transverse mode of operation.
It is an object of the present invention to provide a laser diode array that is robust and cost effective. It is a further object of the present invention to provide a laser diode array that can provide a large scale array of, for example, one hundred or more output spots. It is a further object of the present invention to provide a laser diode array that can deliver an array of output beams having sub-micron alignment. It is a further object of the present invention to provide a laser diode array for generating an array of output beams having substantially a single transverse mode.
At least some of the above objects are achieved by the invention as set out in the accompanying claims.
According to one aspect, the present invention provides an optical system comprising:
According to another aspect, the present invention provides a method for producing an array of laser output beams each having a single transverse mode comprising the steps of:
Embodiments of the present invention will now be described by way of example and with reference to the accompanying drawings in which:
With reference to
Although only two laser diode arrays 2, 3 are illustrated in
Preferably, the common substrate 15 is a packaging substrate to which the laser diode arrays 2, 3 and waveguide array 10 may be bonded using conventional die bonding techniques. Alternatively, the laser diode arrays 2, 3 and the waveguide array 10 may be fabricated together on a common substrate. Preferably, a single monolithic structure is used to provide the waveguide array 10. Alternatively, the waveguide array may be provided as two or more waveguide arrays each bonded to the common substrate 15 and precisely positioned relative to a respective one of the one or more laser diode arrays.
Each of the laser diodes 4 in the arrays 2, 3 is adapted to operate in a single transverse mode of operation. Each of the waveguides 11 in the waveguide array 10 is particularly adapted to maintain, at the outputs 14 thereof, the single transverse mode of any optical beams presented at the inputs 13 thereof.
A single transverse mode in the waveguides can be sustained by appropriate selection of refractive index contrast and thickness of materials.
Also, to sustain the single transverse mode at the waveguide outputs by positioning each laser diode array 2, 3 in relation to the waveguide array 10 with sub-micron registration accuracy using conventional bonding and positioning techniques.
With reference to
Each waveguide 11 may include mode filters and beam shapers to take into account any mode instabilities and beam steer that might otherwise occur across the array during operation. Examples of such mode filters include, for example, a tapered structure to filter out any tendency to multimode operation. In another example, a beam shaper may be incorporated to convert an elliptical optical beam output of a laser into a circular beam by providing a waveguide channel that allows one axis to expand slightly.
In one arrangement, the waveguide array 10 may include a number of photodiode structures 20 for monitoring power output of a respective waveguide 11. Each photodiode structure is coupled to a feedback loop 21 including a sensing circuit 22 for determining the power output. The sensing circuit 22 supplies a control signal 23 to a drive circuit 24 used to power the laser diode array 2. The feedback loop thereby enables the laser diode drive circuit 24 to tune the power output of each laser diode 4 in the array 2 to maintain a substantially constant power output from the or each element in the array.
Thereby, variations in optical output as a function of transverse (x) position in the array may be reduced, minimised or eliminated. For example, with reference to
However, the drive current or electrical power delivered to each laser diode element in the array 2 may be adjusted to modify the profile by virtue of the respective feedback loops and thereby maintain a profile 42 that is constant across the transverse (x) direction.
Preferably, a photodiode structure 20 and associated feedback loop 21 is provided for each waveguide 11 and each corresponding laser diode 5 for maximum control. However, it will be understood that variations in beam outputs as a function of transverse (x) position in the array may be at least reduced by providing photodiode structures 20 periodically across the array, with laser diodes being grouped to correspond to the closest photodiode structure and controlled accordingly.
Each waveguide output 14 may include a lens structure 25 to collimate or focus the optical output therefrom into a downstream optical system. Such lens structures 25 may preferably be integrated into the monolithic structure of the waveguide 10 using known thin-film processing techniques.
With reference to
This configuration provides a number of benefits. In an illustrative example, each single mode laser element 4 provides an output beam 30 of power 100 mW and this beam is coupled into a waveguide 11 which waveguide sub-divides three times to produce a 1 to 8 output for each single laser element 4.
This gives 12.5 mW per output beam 31 (ignoring small losses). In this manner, a ten-element laser array 2 having 500 micron pitch (centre-to-centre distance of elements in the laser diode array) can be converted to an eighty-element array with optical outputs having a 62.5 micron pitch. Each of the waveguides 11 may be provided with a modulator 36 to individually address and modulate each optical output 31. In this manner, very large arrays can be constructed of more than 100 laser elements.
With reference to
This configuration of waveguide array 50 is particularly useful where the laser diode array 2, 3 cannot be manufactured with a pitch sufficiently small to meet the requirements of the application. This configuration also enables a laser diode array to be manufactured with a pitch that is somewhat greater than that otherwise suggested by the performance requirements of the application, which has beneficial effects on power dissipation, and reduction of cross-talk between adjacent devices. This configuration may also assist in maintaining a suitable bond pad size on the laser diode array.
As shown in
The laser array size may thereby be optimised in terms of performance, reliability and cost for a particular application. The use of multiple laser arrays coupled into a single waveguide to give a very large array means that smaller laser arrays 2, 3 can be used with consequent improvements in yield, performance and reliability.
It will be understood that although the embodiment of
With reference to
The configuration of
The optical waveguide arrays are preferably optically passive, ie. not electrically driven to amplify or modulate light passing therethrough. However, optically active structures (e.g. for modulation) could be incorporated therein.
The optical waveguide arrays are preferably fabricated such that light mainly propagates only in the lowest order or fundamental transverse mode of the waveguide. The waveguides may be capable of supporting higher order modes, in which case either the launch optics or mode filters (or both) are designed to ensure optical power propagates substantially only in the fundamental transverse mode.
The waveguide arrays may be fabricated substantially in ferro-electric materials such as lithium niobate or lithium tantalate using conventional techniques including epitaxy, diffusion of ions including Ti or protons to modify the refractive index, etching etc.
The waveguide arrays may be fabricated substantially in silicon, silicon dioxide, silicon nitride or other dielectric materials. The waveguide arrays may be fabricated in III-V materials or other semiconductors. The waveguide arrays may be fabricated with hollow waveguides, clad with metal or other materials, in which the light is confined substantially to the hollow region.
The waveguide arrays may include passive waveguide platforms in which optical elements such as lenses, mode filters and photodiodes are located within the passive waveguides.
Although the waveguide arrays and laser arrays described have been illustrated with elements extending in the x direction, but with only one element extent in the y direction, it will be understood that the laser and waveguide elements may extend in y direction also to provide a full two dimensional array.
Other embodiments are intentionally within the scope of the accompanying claims.
Number | Date | Country | Kind |
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0321145.5 | Sep 2003 | GB | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/GB04/03769 | 9/3/2004 | WO | 5/31/2006 |