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5712510 | Bui et al. | Jan 1998 | A |
6171947 | Pangrle et al. | Jan 2001 | B1 |
Entry |
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E.T. Ogawa et al., Stress-Induced Voiding under Vias Connected to Wide Cu Metal Leads, Proc. of IRPS, 2002, pp. 312-321 (no month). |