Circuits for electrically characterising or monitoring manufacturing processes

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H01L22/34

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/34Circuits for electrically characterising or monitoring manufacturing processes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
In-line device electrical property estimating method and test struc...
- Patent number 12,360,153
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including circuitry under bond pads
- Patent number 12,362,244
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Chiara Cerafogli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor device and method of testing the stack typ...
- Patent number 12,362,324
- Issue date Jul 15, 2025
- SK hynix Inc.
- Seong Hwi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with external power sensor
- Patent number RE50485
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Juergen Hoegerl
Information Patent Grant
Contamination detection method
- Patent number 12,354,922
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Random instruction-side stressing in post-silicon validation
- Patent number 12,353,307
- Issue date Jul 8, 2025
- Synopsys, Inc.
- Hillel Mendelson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit
- Patent number 12,322,665
- Issue date Jun 3, 2025
- NXP B.V.
- Denizhan Karaca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for measuring the gap
- Patent number 12,313,392
- Issue date May 27, 2025
- Semes Co., Ltd.
- Chung Woo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wide bandgap semiconductor structure for irradiation characteristic...
- Patent number 12,295,154
- Issue date May 6, 2025
- Nanjing University
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process monitoring system and method
- Patent number 12,288,703
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Sung Hung
- G05 - CONTROLLING REGULATING
Information Patent Grant
GaN HEMT device for irradiation damage detection and detection and...
- Patent number 12,287,360
- Issue date Apr 29, 2025
- Nanjing University
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 12,283,531
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacture
- Patent number 12,283,532
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit of semiconductor apparatus and test system including t...
- Patent number 12,283,533
- Issue date Apr 22, 2025
- SK Hynix Inc.
- Jong Seok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer configured for single touch-down testing
- Patent number 12,270,853
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit test structure and method of using
- Patent number 12,253,558
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method and alignment device
- Patent number 12,255,113
- Issue date Mar 18, 2025
- STAR TECHNOLOGIES (WUHAN) CO., LTD.
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Model parameter test structures for transistors and preparation met...
- Patent number 12,224,216
- Issue date Feb 11, 2025
- Changxin Memory Technologies, Inc.
- Guochao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a defect detector and data storage sys...
- Patent number 12,211,758
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Kyounghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including a parameter measuring structur...
- Patent number 12,211,760
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring semiconductor reliability and predicting device failure...
- Patent number 12,203,973
- Issue date Jan 21, 2025
- Tartan Silicon Systems, Inc.
- Alan Paul Aronoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process tool for analyzing bonded workpiece interface
- Patent number 12,205,855
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure for use in dynamic random access memory and manufact...
- Patent number 12,198,991
- Issue date Jan 14, 2025
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including crack sensor
- Patent number 12,181,432
- Issue date Dec 31, 2024
- SK hynix Inc.
- Jong Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit filler and method thereof
- Patent number 12,183,729
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Monitoring circuit and semiconductor device
- Patent number 12,174,247
- Issue date Dec 24, 2024
- SK Hynix Inc.
- Tae-Pyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic circuit and semiconductor device
- Patent number 12,170,338
- Issue date Dec 17, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Daisy-chain seal ring structure
- Patent number 12,170,234
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for ring frame cleaning and inspection
- Patent number 12,165,901
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NON-CONTACT WAFER METROLOGY SYSTEM
- Publication number 20250237490
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Apparatus, Method of Manufacturing Semiconduct...
- Publication number 20250232993
- Publication date Jul 17, 2025
- Kokusai Electric Corporation
- Shin TSUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
- Publication number 20250233029
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR EVALUATING INFLUENCE OF PROCESS ON SEMICON...
- Publication number 20250233027
- Publication date Jul 17, 2025
- SK HYNIX INC.
- Seong Joo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESS MONITORING SYSTEM AND METHOD
- Publication number 20250226249
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Sung HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250226270
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Lian DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE
- Publication number 20250218876
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Manufacture
- Publication number 20250218877
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TYPE SENSOR, WAFER TYPE SENSOR AND SUBSTRATE PROCESSING M...
- Publication number 20250218883
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Yong Jun SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EVALUATION APPARATUS, EVALUATION METHOD, AND STORAGE MEDIUM
- Publication number 20250183101
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Tsuyoshi MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-CONDUCTIVE CONTACT PIN AND VERTICAL PROBE CARD HAVING SAME
- Publication number 20250180603
- Publication date Jun 5, 2025
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Level Parametric Prediction Boosting Method and System for Impr...
- Publication number 20250174497
- Publication date May 29, 2025
- MEDIATEK INC.
- Chin-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Level Parametric Prediction Boosting Method and Die-Level Param...
- Publication number 20250174498
- Publication date May 29, 2025
- MEDIATEK INC.
- Chin-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL THERMAL SENSING FOR SYSTEM MONITORING AND CONTROL
- Publication number 20250167050
- Publication date May 22, 2025
- ADVANCED MICRO DEVICES, INC.
- Srividhya Venkataraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING CIRCUIT TEST STRUCTURE
- Publication number 20250164548
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20250157940
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PAD WITH MULTIPLE PROBING AREAS AND METHOD OF PR...
- Publication number 20250157860
- Publication date May 15, 2025
- STMicroelectronics International N.V.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING A PLURALITY OF DIES
- Publication number 20250159911
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- YOSEOP LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING CELL OVER PERIPHERY STRUCTURE AND SEMICONDUCTO...
- Publication number 20250140332
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Changyoung Lee
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD INCLUDING POSITIONING A DUMMY SOURCE DIE OR A DESTINATION SI...
- Publication number 20250132206
- Publication date Apr 24, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY SYSTEM WITH TWIN PLANAR MOTOR STAGE
- Publication number 20250118602
- Publication date Apr 10, 2025
- KLA Corporation
- Michel Pharand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20250107154
- Publication date Mar 27, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA (TSV) TESTING
- Publication number 20250093404
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE FOR USE IN DYNAMIC RANDOM ACCESS MEMORY AND MANUFACT...
- Publication number 20250096048
- Publication date Mar 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCAN TESTABLE THROUGH SILICON VIAS
- Publication number 20250087539
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087538
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Myeonghoon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING ACCESS FOR STACKED SEMICONDUCTOR DEVICES AND ASSOCIATED SYS...
- Publication number 20250087537
- Publication date Mar 13, 2025
- Micron Technology, Inc.
- Lingming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250076368
- Publication date Mar 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhiguo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIRECTIONAL ILLUMINATION FOR HYBRID BONDING DEFECT DETECTION
- Publication number 20250076212
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Venkatakaushik VOLETI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20250067798
- Publication date Feb 27, 2025
- SK HYNIX INC.
- Tae-Pyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS

Circuits for electrically characterising or monitoring manufacturing processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

In-line device electrical property estimating method and test struc...

Memory device including circuitry under bond pads

Stack type semiconductor device and method of testing the stack typ...

Semiconductor module with external power sensor

Contamination detection method

Random instruction-side stressing in post-silicon validation

Integrated circuit

Apparatus and method for measuring the gap

Wide bandgap semiconductor structure for irradiation characteristic...

Wafer process monitoring system and method

GaN HEMT device for irradiation damage detection and detection and...

Stacked semiconductor device test circuits and methods of use

Semiconductor structure and method of manufacture

Test circuit of semiconductor apparatus and test system including t...

Semiconductor wafer configured for single touch-down testing

Circuit test structure and method of using

Alignment method and alignment device

Model parameter test structures for transistors and preparation met...

Semiconductor devices having a defect detector and data storage sys...

Integrated circuit devices including a parameter measuring structur...

Monitoring semiconductor reliability and predicting device failure...

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Process tool for analyzing bonded workpiece interface

Test structure for use in dynamic random access memory and manufact...

Semiconductor devices including crack sensor

Integrated circuit filler and method thereof

Monitoring circuit and semiconductor device

Logic circuit and semiconductor device

Daisy-chain seal ring structure

System and method for ring frame cleaning and inspection

Patents Applicationslast 30 patents

NON-CONTACT WAFER METROLOGY SYSTEM

Substrate Processing Apparatus, Method of Manufacturing Semiconduct...

SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME

METHOD AND APPARATUS FOR EVALUATING INFLUENCE OF PROCESS ON SEMICON...

WAFER PROCESS MONITORING SYSTEM AND METHOD

SEMICONDUCTOR STRUCTURE

STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE

Semiconductor Structure and Method of Manufacture

SUBSTRATE TYPE SENSOR, WAFER TYPE SENSOR AND SUBSTRATE PROCESSING M...

EVALUATION APPARATUS, EVALUATION METHOD, AND STORAGE MEDIUM

ELECTRO-CONDUCTIVE CONTACT PIN AND VERTICAL PROBE CARD HAVING SAME

Die-Level Parametric Prediction Boosting Method and System for Impr...

Die-Level Parametric Prediction Boosting Method and Die-Level Param...

LOCAL THERMAL SENSING FOR SYSTEM MONITORING AND CONTROL

METHOD OF USING CIRCUIT TEST STRUCTURE

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

INTEGRATED CIRCUIT PAD WITH MULTIPLE PROBING AREAS AND METHOD OF PR...

MEMORY DEVICE INCLUDING A PLURALITY OF DIES

MEMORY DEVICE HAVING CELL OVER PERIPHERY STRUCTURE AND SEMICONDUCTO...

METHOD INCLUDING POSITIONING A DUMMY SOURCE DIE OR A DESTINATION SI...

METROLOGY SYSTEM WITH TWIN PLANAR MOTOR STAGE

LOGIC CIRCUIT AND SEMICONDUCTOR DEVICE

THROUGH-SILICON VIA (TSV) TESTING

TEST STRUCTURE FOR USE IN DYNAMIC RANDOM ACCESS MEMORY AND MANUFACT...

SCAN TESTABLE THROUGH SILICON VIAS

SEMICONDUCTOR DEVICE

TESTING ACCESS FOR STACKED SEMICONDUCTOR DEVICES AND ASSOCIATED SYS...

SEMICONDUCTOR PACKAGE

MULTIDIRECTIONAL ILLUMINATION FOR HYBRID BONDING DEFECT DETECTION

MONITORING CIRCUIT AND SEMICONDUCTOR DEVICE