Circuits for electrically characterising or monitoring manufacturing processes

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H01L22/34

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/34Circuits for electrically characterising or monitoring manufacturing processes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Logic circuit and semiconductor device
- Patent number 12,170,338
- Issue date Dec 17, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Daisy-chain seal ring structure
- Patent number 12,170,234
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for ring frame cleaning and inspection
- Patent number 12,165,901
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV testing
- Patent number 12,163,998
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for measuring device inside through-silicon via s...
- Patent number 12,159,809
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for determining characteristics of semiconducto...
- Patent number 12,158,492
- Issue date Dec 3, 2024
- FemtoMetrix, Inc.
- Ming Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scan testable through silicon VIAs
- Patent number 12,154,835
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,148,712
- Issue date Nov 19, 2024
- Mitsubishi Electric Corporation
- Kazuya Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,142,539
- Issue date Nov 12, 2024
- Winbond Electronics Corp.
- Ming-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detecting a possible thinning of a substrate of an integr...
- Patent number 12,142,536
- Issue date Nov 12, 2024
- STMicroelectronics (Rousset) SAS
- Alexandre Sarafianos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 12,142,527
- Issue date Nov 12, 2024
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus including antennas and directors
- Patent number 12,136,593
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package with board level reliability
- Patent number 12,131,967
- Issue date Oct 29, 2024
- Texas Instruments Incorporated
- Naweed Anjum
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor mounted wafer
- Patent number 12,131,958
- Issue date Oct 29, 2024
- E-TRON CO., LTD.
- Jeong Woon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing semiconductor appar...
- Patent number 12,131,966
- Issue date Oct 29, 2024
- Kabushiki Kaisha Toshiba
- Fuyuma Ito
- C30 - CRYSTAL GROWTH
Information Patent Grant
Sensor mounted wafer
- Patent number 12,131,968
- Issue date Oct 29, 2024
- E-TRON CO., LTD.
- Ho Seung Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fuse
- Patent number 12,119,310
- Issue date Oct 15, 2024
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on wafer assembly structure and assembly method thereof
- Patent number 12,112,991
- Issue date Oct 8, 2024
- ZHEJIANG LAB
- Qingwen Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate yield prediction based on spectra data from...
- Patent number 12,111,355
- Issue date Oct 8, 2024
- Onto Innovation Inc.
- Xin Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Crack detector units and the related semiconductor dies and methods
- Patent number 12,111,346
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, electronic device, method of performing inspec...
- Patent number 12,112,945
- Issue date Oct 8, 2024
- Sumitomo Chemical Company, Limited
- Noboru Fukuhara
- G01 - MEASURING TESTING
Information Patent Grant
Systems for integrated decomposition and scanning of a semiconducti...
- Patent number 12,094,738
- Issue date Sep 17, 2024
- Elemental Scientific, Inc.
- Tyler Yost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testkey structure for semiconductor device
- Patent number 12,094,790
- Issue date Sep 17, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- Zhi Xiang Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,080,611
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Moo Soon Ko
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Temperature protection circuit
- Patent number 12,078,554
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deterioration checking apparatus and deterioration checking
- Patent number 12,072,368
- Issue date Aug 27, 2024
- Kabushiki Kaisha Toshiba
- Hideaki Majima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-like sensor
- Patent number 12,074,044
- Issue date Aug 27, 2024
- CyberOptics Corporation
- Felix J. Schuda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 12,062,586
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-line electrical detection of defects at wafer level
- Patent number 12,061,229
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsuan Huang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
INSPECTION DEVICE, MOUNTING APPARATUS, INSPECTION METHOD, AND NON-T...
- Publication number 20240404890
- Publication date Dec 5, 2024
- SHINKAWA LTD.
- Makoto TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240404895
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- MOO SOON KO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA S...
- Publication number 20240395640
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuo-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR VOLTAGE GENERATING
- Publication number 20240395641
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Chin King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE FOR VOID AND TOPOGRAPHY MONITORING IN A FLASH MEMORY...
- Publication number 20240395642
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ken-Ying LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDBY CURRENT DETECTION CIRCUIT
- Publication number 20240395635
- Publication date Nov 28, 2024
- WINBOND ELECTRONICS CORP.
- Bo-Lun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODELLING AND PREDICTION OF VIRTUAL QUALITY CONTROL DATA INCORPORAT...
- Publication number 20240387295
- Publication date Nov 21, 2024
- SANDISK TECHNOLOGIES, INC.
- Tsuyoshi Sendoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20240387390
- Publication date Nov 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE
- Publication number 20240379468
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Four-Terminal Resistance Testing Structure
- Publication number 20240379472
- Publication date Nov 14, 2024
- Shanghai Huali Integrated Circuit Corporation
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240379553
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK DETECTOR UNITS AND THE RELATED SEMICONDUCTOR DIES AND METHODS
- Publication number 20240369613
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE PROTECTION CIRCUIT
- Publication number 20240369424
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong CHERN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-LINE ELECTRICAL DETECTION OF DEFECTS AT WAFER LEVEL
- Publication number 20240361381
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HAVING TRENCHES
- Publication number 20240363548
- Publication date Oct 31, 2024
- SK HYNIX INC.
- Geon Hee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM PEELING TEST STRUCTURE AND THIN FILM PEELING TEST METHOD...
- Publication number 20240363455
- Publication date Oct 31, 2024
- SK hynix system ic (Wuxi) Co., Ltd.
- Kyung Wook KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE
- Publication number 20240332096
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE
- Publication number 20240332097
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240332095
- Publication date Oct 3, 2024
- SAMSUNG DISPLAY CO., LTD.
- Hyun Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transmission-Based Temperature Measurement of a Workpiece in a Ther...
- Publication number 20240290664
- Publication date Aug 29, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Michael Storek
- G01 - MEASURING TESTING
Information Patent Application
TEST KEY STRUCTURE
- Publication number 20240290667
- Publication date Aug 29, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- Jin Hui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITHOUT RESISTANCE TRIMMING PADS
- Publication number 20240290668
- Publication date Aug 29, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CIRCUIT AND METHOD FOR OPERATING THE SAME
- Publication number 20240288489
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-WEI HUANG
- G01 - MEASURING TESTING
Information Patent Application
STEERED TRIM CUT
- Publication number 20240290670
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Joseph Yehle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLUSTERED IC DIES TO INCREASE IC DIES PER WAFER
- Publication number 20240282647
- Publication date Aug 22, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Laszlo Andras Fürst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Failure Analysis and Location Method for Short Circuit Structure
- Publication number 20240282648
- Publication date Aug 22, 2024
- Shanghai Huali Integrated Circuit Corporation
- Lingye Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE FOR DETECTING DEFECT IN SEMICONDUCTOR PACKAGE AND...
- Publication number 20240274480
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- HYEON JOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Die Crack Detection in Wafer-to-Wafer Bonding
- Publication number 20240249984
- Publication date Jul 25, 2024
- Western Digital Technologies, Inc.
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POLISHING SYSTEM, SIMULATION AND CONTROL METHOD THEREOF
- Publication number 20240234153
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Sung Hyup KIM
- H01 - BASIC ELECTRIC ELEMENTS

Circuits for electrically characterising or monitoring manufacturing processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Logic circuit and semiconductor device

Daisy-chain seal ring structure

System and method for ring frame cleaning and inspection

TSV testing

System and method for measuring device inside through-silicon via s...

Systems and methods for determining characteristics of semiconducto...

Scan testable through silicon VIAs

Semiconductor device and method of manufacturing semiconductor device

Semiconductor structure

Method of detecting a possible thinning of a substrate of an integr...

Method and system for regulating plasma dicing rates

Electronic apparatus including antennas and directors

Electronic device package with board level reliability

Sensor mounted wafer

Semiconductor wafer and method of manufacturing semiconductor appar...

Sensor mounted wafer

Semiconductor package including test bumps

Integrated fuse

System on wafer assembly structure and assembly method thereof

Semiconductor substrate yield prediction based on spectra data from...

Crack detector units and the related semiconductor dies and methods

Semiconductor wafer, electronic device, method of performing inspec...

Systems for integrated decomposition and scanning of a semiconducti...

Testkey structure for semiconductor device

Display device

Temperature protection circuit

Deterioration checking apparatus and deterioration checking

Wafer-like sensor

Semiconductor device structure with magnetic element

In-line electrical detection of defects at wafer level

Patents Applicationslast 30 patents

INSPECTION DEVICE, MOUNTING APPARATUS, INSPECTION METHOD, AND NON-T...

DISPLAY DEVICE

SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA S...

DEVICE, SYSTEM AND METHOD FOR VOLTAGE GENERATING

TEST STRUCTURE FOR VOID AND TOPOGRAPHY MONITORING IN A FLASH MEMORY...

STANDBY CURRENT DETECTION CIRCUIT

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

MODELLING AND PREDICTION OF VIRTUAL QUALITY CONTROL DATA INCORPORAT...

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE

Four-Terminal Resistance Testing Structure

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

CRACK DETECTOR UNITS AND THE RELATED SEMICONDUCTOR DIES AND METHODS

TEMPERATURE PROTECTION CIRCUIT

IN-LINE ELECTRICAL DETECTION OF DEFECTS AT WAFER LEVEL

WAFER HAVING TRENCHES

THIN FILM PEELING TEST STRUCTURE AND THIN FILM PEELING TEST METHOD...

PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE

PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE

DISPLAY DEVICE

Transmission-Based Temperature Measurement of a Workpiece in a Ther...

TEST KEY STRUCTURE

SEMICONDUCTOR DEVICE WITHOUT RESISTANCE TRIMMING PADS

TEST CIRCUIT AND METHOD FOR OPERATING THE SAME

STEERED TRIM CUT

CLUSTERED IC DIES TO INCREASE IC DIES PER WAFER

Failure Analysis and Location Method for Short Circuit Structure

ELECTRONIC DEVICE FOR DETECTING DEFECT IN SEMICONDUCTOR PACKAGE AND...

System and Method for Die Crack Detection in Wafer-to-Wafer Bonding

WAFER POLISHING SYSTEM, SIMULATION AND CONTROL METHOD THEREOF