This application claims the priority benefit of Chinese Patent Application Serial Number 202110229729.6 filed on Mar. 2, 2021, the full disclosure of which is incorporated herein by reference.
The present disclosure relates to the technical field of heat dissipation for interface connectors, particularly to an interface connector capable of dissipating heat for a stack-type signal module.
Conventional interface connectors are used for insertion of optical modules, which control the laser diode to emit optical signals corresponding to electric signals to convert electric signals into optical signals through a chip based on electric signals. During operation, chips and laser diodes in the optical module would generate heat. When the temperature of optical modules rises to certain level, the operation of optical modules would be affected without performing heat dissipation. Considering the signal transmission rate is increasing for conventional interface connectors, to allow optical signals to be transmitted over a long distance in an optical cable, the operating power of chips of optical modules is increasing accordingly. Thus, heat dissipation for interface connectors is a critical issue.
The embodiments of the present disclosure provide an interface connector tended to solve the problem of heat dissipation for conventional interface connectors used for stack-type signal modules.
The present disclosure provides an interface connector, comprising a housing, a first heat dissipating member, and a second heat dissipating member. A first accommodating space and a second accommodating space are disposed in the housing. The first accommodating space is adjacent to the second accommodating space. The first accommodating space accommodates a first mating connector. The second accommodating space accommodates a second mating connector. The first heat dissipating member is disposed at the outside of the housing and passes through the housing. The first heat dissipating member extends into the first accommodating space to be connected to the first mating connector. The second heat dissipating member is disposed in the housing. The second heat dissipating member extends into the second accommodating space to be connected to the second mating connector.
The housing of the interface connector comprises a first outer surface and a second outer surface adjacent to the first outer surface. The first heat dissipating member comprises a first heat dissipating member body and a first extending part. The first heat dissipating member body is disposed on the first outer surface. The first extending part extends from the first heat dissipating member body along the second outer surface.
The first heat dissipating member of the interface connector further comprises a second extending part extending from the first heat dissipating member body into the first accommodating space through the housing. The second extending part abuts against the first mating connector inserted in the first accommodating space.
The interface connector further comprises a connecting member passing through the housing and is connecting with the first heat dissipating member and the second heat dissipating member.
The first heat dissipating member of the interface connector comprises a first through hole. The housing comprises a second through hole. The second heat dissipating member comprises a groove hole. The connecting member passes through the first through hole and the second through hole in order and is engaged with the groove hole.
The second heat dissipating member of the interface connector comprises a second heat dissipating member body and a third extending part. The third extending part extends from the second heat dissipating member body into the second accommodating space and abuts against the second mating connector inserted in the second accommodating space.
The housing of the interface connector comprises a partitioning part partitioning the inner space of the housing to form the first accommodating space and the second accommodating space. The second heat dissipating member is engaged with the partitioning part.
The interface connector comprises a first elastic member disposed in the first accommodating space. The first elastic member is opposite to the first heat dissipating member. Two opposite surfaces of the first mating connector abut against the first heat dissipating member and the first elastic member, respectively.
The interface connector comprises a second elastic member disposed in the second accommodating space. The second elastic member is opposite to the second heat dissipating member. Two opposite surfaces of the second mating connector abut against the second heat dissipating member and the second elastic member, respectively.
The interface connector comprises a third heat dissipating member disposed in the housing. The housing comprises a third accommodating space and a fourth accommodating space. The third accommodating space accommodates a third mating connector. The fourth accommodating space accommodates a fourth mating connector. The first heat dissipating member extends into the third accommodating space to be connected to the third mating connector. The third heat dissipating member extends into the fourth accommodating space to be connected to the fourth mating connector. The third heat dissipating member is connected with the first heat dissipating member.
In the embodiments of the present disclosure, the first heat dissipating member is disposed at the outside of the housing and is connected to the first mating connector, and the second heat dissipating member is disposed inside the housing and is connected to the second mating connector. The second heat dissipating member is connected to the first heat dissipating member. The heat from the first mating connector is transferred to the first heat dissipating member by heat conduction and then is dissipated to the air through the first heat dissipating member. The heat from the second mating connector stacked with the first mating connector is transferred to the second heat dissipating member by heat conduction, then is transferred from the second heat dissipating member to the first heat dissipating member by heat conduction, and finally escapes to the air through the first heat dissipating member. By disposing the first heat dissipating member and the second heat dissipating member at the outside and the inside of the housing, and by connecting the first heat dissipating member with the second heat dissipating member, the heat emitted by the first mating connector and the second mating connector can be effectively dissipated through the connected first heat dissipating member and the second heat dissipating member. The heat dissipation issue of optical modules equipped with high power chips can be well handled.
It should be understood, however, that this summary may not contain all aspects and embodiments of the present disclosure, that this summary is not meant to be limiting or restrictive in any manner, and that the disclosure as disclosed herein will be understood by one of ordinary skill in the art to encompass obvious improvements and modifications thereto.
The features of the exemplary embodiments believed to be novel and the elements and/or the steps characteristic of the exemplary embodiments are set forth with particularity in the appended claims. The Figures are for illustration purposes only and are not drawn to scale. The exemplary embodiments, both as to organization and method of operation, may best be understood by reference to the detailed description which follows taken in conjunction with the accompanying drawings in which:
The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the disclosure are shown. This present disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.
Certain terms are used throughout the description and following claims to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This document does not intend to distinguish between components that differ in name but function. In the following description and in the claims, the terms “include/including” and “comprise/comprising” are used in an open-ended fashion, and thus should be interpreted as “including but not limited to”. “Substantial/substantially” means, within an acceptable error range, the person skilled in the art may solve the technical problem in a certain error range to achieve the basic technical effect.
The following description is of the best-contemplated mode of carrying out the disclosure. This description is made for the purpose of illustration of the general principles of the disclosure and should not be taken in a limiting sense. The scope of the disclosure is best determined by reference to the appended claims.
Moreover, the terms “include”, “contain”, and any variation thereof are intended to cover a non-exclusive inclusion. Therefore, a process, method, object, or device that includes a series of elements not only includes these elements, but also includes other elements not specified expressly, or may include inherent elements of the process, method, object, or device. If no more limitations are made, an element limited by “include a/an . . . ” does not exclude other same elements existing in the process, the method, the article, or the device which includes the element.
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In this embodiment, the housing 10 also comprises a separating part 16. The separating part 16 connects the top wall 11 and the bottom wall 12 and divides the inner space of the housing 10 to a left part and a right part. The partitioning part 15 connects the sidewall 13 and the separating part 16 and divides both the left and right parts into a stack-type structural configuration. On the right part are the first accommodating space S1 and the second accommodating space S2, and on the left part are a third accommodating space S3 and a fourth accommodating space S4. A first mating connector L1 is inserted into the first accommodating space S1 through a first interface M1 of the housing 10. A second mating connector L2 is inserted into the second accommodating space S2 through a second interface M2 of the housing 10. Although other mating connectors are not shown in the figures, they could also be inserted into the third accommodating space S3, and the fourth accommodating space S4.
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In summary, embodiments of the present disclosure provide an interface connector. The first heat dissipating member is disposed at the outside of the housing and is connected to the first mating connector, and the second heat dissipating member is disposed inside the housing and is connected to the second mating connector. The second heat dissipating member is connected to the first heat dissipating member. The heat from the first mating connector is transferred to the first heat dissipating member by heat conduction, and then is dissipated to the air through the first heat dissipating member. The heat from the second mating connector stacked with the first mating connector is transferred to the second heat dissipating member by heat conduction, then is transferred from the second heat dissipating member to the first heat dissipating member by heat conduction, and finally escapes to the air through the first heat dissipating member. By disposing the first heat dissipating member and the second heat dissipating member at the outside and the inside of the housing, and by connecting the first heat dissipating member with the second heat dissipating member, the heat emitted by the first mating connector and the second mating connector can be effectively dissipated through the connected first heat dissipating member and the second heat dissipating member. The heat dissipation issue of optical modules equipped with high power chips can be well handled.
It is to be understood that the term “comprises”, “comprising”, or any other variants thereof, is intended to encompass a non-exclusive inclusion, such that a process, method, article, or device of a series of elements not only comprise those elements but further comprises other elements that are not explicitly listed, or elements that are inherent to such a process, method, article, or device. An element defined by the phrase “comprising a . . . ” does not exclude the presence of the same element in the process, method, article, or device that comprises the element.
Although the present disclosure has been explained in relation to its preferred embodiment, it does not intend to limit the present disclosure. It will be apparent to those skilled in the art having regard to this present disclosure that other modifications of the exemplary embodiments beyond those embodiments specifically described here may be made without departing from the spirit of the disclosure. Accordingly, such modifications are considered within the scope of the disclosure as limited solely by the appended claims.
Number | Date | Country | Kind |
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202110229729.6 | Mar 2021 | CN | national |
Number | Name | Date | Kind |
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9668379 | Bucher | May 2017 | B1 |
20100232800 | Meadowcroft | Sep 2010 | A1 |
Number | Date | Country |
---|---|---|
108061943 | May 2018 | CN |
110197962 | Sep 2019 | CN |
110364884 | Oct 2019 | CN |
111541074 | Aug 2020 | CN |
211789719 | Oct 2020 | CN |
212160165 | Dec 2020 | CN |
Number | Date | Country | |
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20220287205 A1 | Sep 2022 | US |