Patent Application
20230339064
The present disclosure relates to the technical field of diamond machining, and in particular relates to an integrated machining device for grinding and polishing diamond and a method thereof.
Diamond is known as the hardest material in nature and belongs to a category of superhard materials. Surface machining of the diamond is difficult and inefficient due to superhard characteristics of the diamond.
Surface machining of the traditional single crystal diamond uses hard-contact mechanical polishing to machine a surface of the diamond using a high-speed metal rotary disk. This machining method has been widely used for machining of a surface of diamond crystal of jewelry with high polishing efficiency, while the deficiencies are as follows: first, a roughness of the surface of the diamond crystal after polishing can only reach about 100 nm, which cannot meet needs for diamonds in the semiconductor field; second, a large amount of heat is generated in the hard-contact mechanical polishing, resulting in a surface temperature of the diamond crystal and the high-speed metal rotary disk being too high and easily leading to graphitization of the diamond surface. A large amount of graphite and diamond scraps generated in the grinding will enter the high-speed metal rotary disk, easily causing obvious damage to the high-speed metal rotary disk. Therefore, a replacement frequency of a polishing disk is very high, and polishing effects are poor in repeatability. Moreover, costs of the surface machining of the traditional single crystal diamond is greatly increased.
Microwave plasma etching and chemical polishing are commonly used polishing methods in the field of the semiconductor materials. The microwave plasma etching needs a special expensive etching device and a further surface treatment after etching to form a non-destructive diamond crystal surface. Chemical components of a polishing solution used in the chemical polishing react with the surface of the diamond to reduce a surface roughness of the diamond. However, the chemical polishing causes the surface of the diamond to have poor flatness and poor parallelism prone to produce defects, such as corrosion pits.
At present, methods for grinding and polishing the diamond are two independent systems. A method for machining the diamond from a rough substrate to polishing is complex and time-consuming, and the methods for grinding and polishing the diamond require the diamond to be clamped twice, resulting in positioning errors in a processing of the machining.
The present disclosure provides an integrated machining device for grinding and polishing diamond and a method thereof to overcome the deficiencies of the device for grinding and polishing diamond in the background.
In order to solve the technical problems of the present disclosure, a first technical solution is as follows:
An integrated device for grinding and polishing a diamond comprises a frame, a base device, and a grinding and polishing device, the base device comprises a sliding base configured to feed along a Y-axis relative to the frame and a base configured to be rotatably connected to the sliding base around a Z-axis, the base comprises a fixture configured to clamp the diamond, the grinding and polishing device comprises a shaft disposed along the Z-axis, an inner grinding wheel and an outer polishing wheel are respectively sleeved on the shaft, the outer polishing wheel surrounds the inner grinding wheel, the shaft drives the inner grinding wheel and the outer polishing wheel to rotate together, an upper and lower position relationship between the inner grinding wheel and the outer polishing wheel along the Z-axis is configured to be adjusted, and the diamond on the fixture is ground and polished by rotations of the inner grinding wheel and the outer polishing wheel, feeding of the sliding base, and a rotation of the base.
In a preferred embodiment, the outer polishing wheel is fixedly disposed on the shaft, the inner grinding wheel is configured to slide upward and downward along the Z-axis relative to the shaft, the inner grinding wheel and the shaft rotate synchronously, and the inner grinding wheel slides upward and downward to enable the upper and lower position relationship between the inner grinding wheel and the outer polishing wheel to be adjusted.
In a preferred embodiment, an outer diameter of the inner grinding wheel is smaller than an inner diameter of the outer polishing wheel.
In a preferred embodiment, the inner grinding wheel comprises an inner wheel body and hard abrasives adhered to the inner wheel body by adhesives, the adhesives are at least one of ceramic, metal, resin, or rubber, the hard abrasives are at least one of diamonds, cubic boron nitride, boron carbide, silicon carbide, or aluminum oxide, and particle sizes of the hard abrasives are 0.5-60 μm.
In a preferred embodiment, the outer polishing wheel is made by a sol-gel method, the outer polishing wheel has hard abrasives, the hard abrasives are at least one of diamonds, cubic boron nitride, boron carbide, silicon carbide, or aluminum oxide, and particle size of the hard abrasives are 0.5-60 μm.
In a preferred embodiment, a center of an upper end surface of the base is recessed to define an installation groove, a vacuum pad is disposed in the installation groove, the fixture is disposed on the vacuum pad, and the fixture is stuck to the base by the vacuum pad.
In a preferred embodiment, an upper end surface of the fixture is recessed to define a placement groove, the diamond is disposed in the placement groove, and the diamond is stuck in the placement groove of the fixture by adhesives.
In a preferred embodiment, the fixture uses an inch-thick hard substrate as a substrate, the inch-thick hard substrate is a silicon carbide substrate, a sapphire substrate, a silicon substrate, or a ceramic substrate, and the adhesives are selected from one or more of yellow wax, AB adhesives, epoxy resin, ultraviolet (UV) adhesives, hot-melt adhesives, pressure sensitive adhesives, or latex.
In a preferred embodiment, the fixture comprises a body, two sliding blocks, and two adjusting members, a top wall of the body comprises a base wall and a protruding platform protruding from the base wall, the protruding platform comprises two positioning walls facing the base wall and vertically disposed, the base wall of the body is recessed to define two sliding grooves leading to a side wall of the body, the two sliding grooves are respectively disposed along the two positioning walls, tops of the two sliding blocks horizontally protrude to define two protruding portions, the two sliding blocks are respectively slidably connected to two sliding grooves, the two protruding portions are disposed on the base wall, the two protruding portions form two locking walls, the two locking walls of the two sliding blocks and the two positioning walls respectively face each other, the two adjusting members are respectively connected to the two sliding blocks and the body to adjust the two sliding blocks to slide along the two sliding grooves by the two adjusting members, and the diamond that is stuck to the base wall is clamped by the two locking walls and the two positioning walls.
In a preferred embodiment, the shaft rotates to drive the inner grinding wheel and the outer polishing wheel to rotate together.
In order to solve the technical problems of the present disclosure, a first technical solution is as follows:
A machining method using the integrated device for grinding and polishing, it comprises:
Compared to the existing techniques, the present disclosure has the following advantages.
The grinding and the polishing are integrated into one process for machining the diamond, and the clamping is performed one time for the grinding and the polishing to avoid errors and improve a yield rate caused by multiple clampings. A surface roughness of a large single crystal diamond with an original surface greater than 300 nm can be machined to 0.2-0.4 nm. Scratch damage on the surface of the diamond is less, a surface quality is uniform, a time for the grinding and the polishing is short, and an efficiency is high.
The fixture is stuck to the base by the vacuum pad, clamping is simple and convenient, and an accuracy is high.
The diamond is disposed in the placement groove, and the diamond is stuck in the placement groove of the fixture by the adhesives. Clamping is convenient, and an accuracy is high. A problem that a single crystal diamond is difficult to be clamped and fixed due to a small size (e.g., a square sheet below 10 mm×10 mm) of the single crystal diamond is resolved.
The inner grinding wheel slides upward and downward to adjust the upper and lower position relationship between the inner grinding wheel and the outer polishing wheel, so that switching between the grinding and the polishing is convenient and fast, and machining with automatic grinding and polishing is achieved by cooperating with an automatic rotating grinding machine.
The inner grinding wheel grinds and the outer polishing wheel polishes, so that an efficiency is improved, and a surface quality is ensured.
The inner grinding wheel comprises the inner wheel body and the hard abrasives adhered to the inner wheel body by the adhesives. The adhesives are at least one of ceramic, metal, resin, or rubber, or the hard abrasives are at least one of diamond, cubic boron nitride, boron carbide, silicon carbide, or aluminum oxide. The particle sizes of the hard abrasives are 0.5-60 μm. A grinding efficiency is high, and a service life is long.
The outer polishing wheel is made by the sol-gel method. The outer polishing wheel comprises hard abrasives, and the hard abrasives are at least one of diamond, cubic boron nitride, boron carbide, silicon carbide, or aluminum oxide. The particle sizes of the hard abrasives are 0.5-60 μm. A grinding efficiency is high, and a service life is long.
The top wall of the body comprises the base wall and the protruding platform. The two sliding blocks are respectively slidably connected to two sliding grooves, tops of the two sliding blocks horizontally protrude to define protruding portions, the protruding portions are disposed on the base wall, and the protruding portions form locking walls. The diamond that is stuck to the base wall is clamped by two locking walls and two positioning walls. Therefore, a diamond with a small thickness can be tightly clamped, and diamonds with different sizes can be adopted to solve difficulties in clamping diamond substrates. The clamping is firm, stable, and reliable, assembly and disassembly is simple and convenient, and a machining efficiency is improved.
The technical solution of the present disclosure will be further described below in combination with the accompanying embodiments and drawings.
Referring to
The inner grinding wheel 21 comprises an inner wheel body 210 and hard abrasives 200 adhered to the inner wheel body 210 by adhesives. The adhesives are at least one of ceramic, metal, resin, or rubber. The hard abrasives 200 are at least one of diamonds, cubic boron nitride, boron carbide, silicon carbide, or aluminum oxide, and particle sizes of the hard abrasives 200 are 0.5-60 μm. The outer polishing wheel 22 is made by a sol-gel method. The outer polishing wheel 22 comprises hard abrasives 200. The hard abrasives 200 are at least one of the diamond, the cubic boron nitride, the boron carbide, the silicon carbide, or the aluminum oxide, and particle sizes of the hard abrasives 200 are 0.5-60 μm. For example, the outer polishing wheel 22 is a sol-gel (SG) polishing wheel, and the SG polishing wheel can reduce subsurface damage.
A center of an upper end surface of the base 11 is recessed to define an installation groove 110, and a vacuum pad 13 is disposed in the installation groove 110. The fixture 12 is disposed on the vacuum pad 13, and the fixture 12 is stuck to the base 11 by the vacuum pad 13. In a specific structure, an upper end surface of the fixture 12 is recessed to define a placement groove 120, the diamond 3 is disposed in the placement groove 120, and the diamond 3 is stuck in the placement groove 120 of the fixture 12 by adhesives. The fixture 12 uses an inch-level hard substrate as a substrate. The inch-level hard substrate is a silicon carbide substrate, a sapphire substrate, a silicon substrate, or a ceramic substrate. The adhesives are selected from one or more of yellow wax, AB adhesives, epoxy resin, ultraviolet (UV) adhesives, hot-melt adhesives, pressure sensitive adhesives, and latex. Furthermore, a length and a width of the placement groove 120 should be larger (e.g., slightly larger) than an actual size of the diamond 3 by 0.5-1.5 mm. A depth of the placement groove 120 is about ⅓-⅔ of a thickness of the diamond 3. A clearance between the diamond 3 and the placement groove 120 is filled with the adhesives, and a small amount of the adhesives can overflow from the clearance. A bottom center of the placement groove 120 is machined to form one or more through holes with diameters of 0.5-1.5 mm.
A machining method using the integrated machining device for grinding and polishing diamond comprises the following steps:
Referring to
The aforementioned embodiments are merely some embodiments of the present disclosure, and the scope of the disclosure is not limited thereto. Thus, it is intended that the present disclosure cover any modifications and variations provided they are made without departing from the appended claims and the specification of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202011609699.3 | Dec 2020 | CN | national |
This application is a continuation of International patent application PCT/CN2021/099947, filed on Jun. 15, 2021, which claims priority to Chinese patent application 202011609699.3, filed on Dec. 30, 2020. International patent application PCT/CN2021/099947 and Chinese patent application 202011609699.3 are incorporated herein by reference.
