designed for working plane surfaces

Industry

CPC
B24B37/04

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/04designed for working plane surfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cutting instrument with improved surface topography
- Patent number 12,357,341
- Issue date Jul 15, 2025
- PLANATOME, LLC
- Clifford Spiro
- B24 - GRINDING POLISHING
Information Patent Grant
Rubber membrane having first and second hardness for use in a polis...
- Patent number 12,358,096
- Issue date Jul 15, 2025
- Ebara Corporation
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad and method for preparing semiconductor device using t...
- Patent number 12,362,232
- Issue date Jul 15, 2025
- SK ENPULSE CO., LTD.
- Jong Wook Yun
- B24 - GRINDING POLISHING
Information Patent Grant
High-throughput, precise semiconductor slurry blending tool
- Patent number 12,343,841
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wei Chiu
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing a wafer and method for fabricating a semico...
- Patent number 12,341,015
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Dong Hoon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride inhibitors for high selectivity of TiN—SiN CMP applications
- Patent number 12,338,369
- Issue date Jun 24, 2025
- CMC MATERIALS LLC
- Chih-Hsien Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus with thickness measuring unit
- Patent number 12,330,266
- Issue date Jun 17, 2025
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 12,325,101
- Issue date Jun 10, 2025
- Ebara Corporation
- Masaki Kinoshita
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,325,102
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shich-Chang Suen
- B24 - GRINDING POLISHING
Information Patent Grant
Photoelectric fluid field cluster catalytic method for atomic-scale...
- Patent number 12,325,017
- Issue date Jun 10, 2025
- Zhejiang University
- Wule Zhu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate polishing apparatus and substrate polishing method
- Patent number 12,318,881
- Issue date Jun 3, 2025
- Ebara Corporation
- Takuya Fujimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Double-sided polishing method for optical lens
- Patent number 12,318,884
- Issue date Jun 3, 2025
- Dalian University of Technology
- Jiang Guo
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry composition for chemical mechanical polishing
- Patent number 12,319,841
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Inkwon Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resistivity-based adjustment of thresholds for in-situ monitoring
- Patent number 12,320,883
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Kun Xu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Monolithic platen
- Patent number 12,311,498
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Surface treatment method, method for producing semiconductor substr...
- Patent number 12,312,499
- Issue date May 27, 2025
- FUJIMI INCORPORATED
- Tsutomu Yoshino
- B24 - GRINDING POLISHING
Information Patent Grant
Method of double-side polishing work, method of producing work, and...
- Patent number 12,311,496
- Issue date May 27, 2025
- Sumco Corporation
- Kazushige Takaishi
- B24 - GRINDING POLISHING
Information Patent Grant
Pressure signals during motor torque monitoring to provide spatial...
- Patent number 12,311,494
- Issue date May 27, 2025
- Applied Materials, Inc.
- Thomas Li
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for removing debris during chemical mechanical pl...
- Patent number 12,311,501
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
High throughput polishing modules and modular polishing systems
- Patent number 12,308,272
- Issue date May 20, 2025
- Applied Materials, Inc.
- Jagan Rangarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing solution, polishing apparatus, and polishing method
- Patent number 12,300,499
- Issue date May 13, 2025
- Kioxia Corporation
- Mikiya Sakashita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods for thinning substrates for semiconductor devices
- Patent number 12,290,900
- Issue date May 6, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer surface chemical distribution sensing system and methods for...
- Patent number 12,285,837
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Shota Yatsuzuka
- B24 - GRINDING POLISHING
Information Patent Grant
End point detection method, polishing apparatus, and polishing method
- Patent number 12,285,836
- Issue date Apr 29, 2025
- Ebara Corporation
- Taro Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Adhesive for processing a microelectronic substrate, and related me...
- Patent number 12,288,575
- Issue date Apr 29, 2025
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer edge asymmetry correction using groove in polishing pad
- Patent number 12,285,838
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus, substrate polishing system including...
- Patent number 12,280,466
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Jaehyug Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and methods for susceptor deposition material removal
- Patent number 12,280,465
- Issue date Apr 22, 2025
- Applied Materials, Inc.
- Vijayabhaskara Venkatagiriyappa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated machine for automatic cutting, polishing, stacking and u...
- Patent number 12,275,083
- Issue date Apr 15, 2025
- SOUTHWEST PETROLEUM UNIVERSITY
- Yang Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing composition and method with high selectivity for silicon...
- Patent number 12,269,969
- Issue date Apr 8, 2025
- CMC MATERIALS LLC
- Benjamin Petro
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250229378
- Publication date Jul 17, 2025
- EBARA CORPORATION
- B24 - GRINDING POLISHING
Information Patent Application
SILICON POLISHING METHOD AND COMPOSITION FOR SILICON POLISHING
- Publication number 20250226230
- Publication date Jul 10, 2025
- Noritake Co., Limited
- Makoto SATO
- B24 - GRINDING POLISHING
Information Patent Application
HIGH FREQUENCY POLISHING OF CERAMICS
- Publication number 20250222558
- Publication date Jul 10, 2025
- HERAEUS COVANTICS NORTH AMERICA LLC
- Luke WALKER
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING MODULE, SUBSTRATE POLISHING DEVICE, AND SUBSTRA...
- Publication number 20250214195
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Jieun SEO
- B24 - GRINDING POLISHING
Information Patent Application
WAFER POLISHING SYSTEM, LOADING METHOD AND USING METHOD THEREOF
- Publication number 20250214196
- Publication date Jul 3, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Xiaoyu XU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20250205846
- Publication date Jun 26, 2025
- EBARA CORPORATION
- Kohei OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICES
- Publication number 20250205845
- Publication date Jun 26, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTE MEDIUM AND METHOD FOR ELECTROCHEMICAL POLISHING OF META...
- Publication number 20250207293
- Publication date Jun 26, 2025
- OTEC Praezisionsfinish GmbH
- Carlos Barbado FERNANDEZ
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Chemical Mechanical Planarization Using Amino-Polyorganosiloxane-Co...
- Publication number 20250197703
- Publication date Jun 19, 2025
- VERSUM MATERIALS US, LLC
- Gerhard Jonschker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING AGENT, ADDITIVE SOLUTION FOR POLISHING AGENT, AND POLISHI...
- Publication number 20250197676
- Publication date Jun 19, 2025
- AGC Inc.
- Hideki NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SOLUTION, POLISHING METHOD, COMPONENT MANUFACTURING METHO...
- Publication number 20250187137
- Publication date Jun 12, 2025
- Resonac Corporation
- Shogo ARATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHOD OF WAFER
- Publication number 20250191925
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Kai ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEV...
- Publication number 20250178153
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chwen YU
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
POLISHING PAD, POLISHING PAD MANUFACTURING METHOD, AND WAFER POLISH...
- Publication number 20250178154
- Publication date Jun 5, 2025
- NORITAKE CO., LIMITED
- Ryoma ITO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20250170688
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi HUANG
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE SUPPORT DEVICE, CLEANING DEVICE, DEVICE AND METHOD FOR CA...
- Publication number 20250164977
- Publication date May 22, 2025
- EBARA CORPORATION
- Michiaki MATSUDA
- G05 - CONTROLLING REGULATING
Information Patent Application
POLISHING PAD WITH IMPROVED SLURRY FLOWABILITY AND PROCESS FOR PREP...
- Publication number 20250144764
- Publication date May 8, 2025
- SK enpulse Co., Ltd.
- Yujin SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD, METHOD FOR PRODUCING POLISHING PAD, AND METHOD FOR P...
- Publication number 20250144765
- Publication date May 8, 2025
- FUJIBO HOLDINGS, INC.
- Yoshihide KAWAMURA
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY COMPOSITION FOR POLISHING METAL FILM
- Publication number 20250145858
- Publication date May 8, 2025
- KCTECH CO., LTD.
- Jin Sook HWANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND METHOD OF MANUF...
- Publication number 20250136842
- Publication date May 1, 2025
- SK enpulse Co., Ltd.
- Han Teo PARK
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...
- Publication number 20250140594
- Publication date May 1, 2025
- EBARA CORPORATION
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20250129279
- Publication date Apr 24, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20250125196
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLI...
- Publication number 20250115785
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Wonki HUR
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHO...
- Publication number 20250115787
- Publication date Apr 10, 2025
- SK enpulse Co., Ltd.
- Deok Su HAN
- B24 - GRINDING POLISHING
Information Patent Application
HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE
- Publication number 20250114902
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Avyay Panchapakesan
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20250118604
- Publication date Apr 10, 2025
- EBARA CORPORATION
- Akira FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL PO...
- Publication number 20250114897
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL P...
- Publication number 20250114901
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING-RING-LESS CMP PROCESS
- Publication number 20250114903
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Chen-Wei Chang
- B24 - GRINDING POLISHING

designed for working plane surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cutting instrument with improved surface topography

Rubber membrane having first and second hardness for use in a polis...

Polishing pad and method for preparing semiconductor device using t...

High-throughput, precise semiconductor slurry blending tool

Apparatus for polishing a wafer and method for fabricating a semico...

Nitride inhibitors for high selectivity of TiN—SiN CMP applications

Polishing apparatus with thickness measuring unit

Polishing apparatus and polishing method

Chemical mechanical polishing apparatus and method

Photoelectric fluid field cluster catalytic method for atomic-scale...

Substrate polishing apparatus and substrate polishing method

Double-sided polishing method for optical lens

Slurry composition for chemical mechanical polishing

Resistivity-based adjustment of thresholds for in-situ monitoring

Monolithic platen

Surface treatment method, method for producing semiconductor substr...

Method of double-side polishing work, method of producing work, and...

Pressure signals during motor torque monitoring to provide spatial...

System and method for removing debris during chemical mechanical pl...

High throughput polishing modules and modular polishing systems

Polishing solution, polishing apparatus, and polishing method

Methods for thinning substrates for semiconductor devices

Wafer surface chemical distribution sensing system and methods for...

End point detection method, polishing apparatus, and polishing method

Adhesive for processing a microelectronic substrate, and related me...

Wafer edge asymmetry correction using groove in polishing pad

Substrate polishing apparatus, substrate polishing system including...

Apparatus and methods for susceptor deposition material removal

Integrated machine for automatic cutting, polishing, stacking and u...

Polishing composition and method with high selectivity for silicon...

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS

SILICON POLISHING METHOD AND COMPOSITION FOR SILICON POLISHING

HIGH FREQUENCY POLISHING OF CERAMICS

SUBSTRATE POLISHING MODULE, SUBSTRATE POLISHING DEVICE, AND SUBSTRA...

WAFER POLISHING SYSTEM, LOADING METHOD AND USING METHOD THEREOF

POLISHING APPARATUS AND POLISHING METHOD

METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICES

ELECTROLYTE MEDIUM AND METHOD FOR ELECTROCHEMICAL POLISHING OF META...

Chemical Mechanical Planarization Using Amino-Polyorganosiloxane-Co...

POLISHING AGENT, ADDITIVE SOLUTION FOR POLISHING AGENT, AND POLISHI...

POLISHING SOLUTION, POLISHING METHOD, COMPONENT MANUFACTURING METHO...

PLANARIZATION METHOD OF WAFER

APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEV...

POLISHING PAD, POLISHING PAD MANUFACTURING METHOD, AND WAFER POLISH...

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

SUBSTRATE SUPPORT DEVICE, CLEANING DEVICE, DEVICE AND METHOD FOR CA...

POLISHING PAD WITH IMPROVED SLURRY FLOWABILITY AND PROCESS FOR PREP...

POLISHING PAD, METHOD FOR PRODUCING POLISHING PAD, AND METHOD FOR P...

SLURRY COMPOSITION FOR POLISHING METAL FILM

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND METHOD OF MANUF...

SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...

SLURRY, SCREENING METHOD, AND POLISHING METHOD

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLI...

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHO...

HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL PO...

GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL P...

RETAINING-RING-LESS CMP PROCESS