designed for working plane surfaces

Industry

CPC
B24B37/04

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/04designed for working plane surfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High throughput polishing modules and modular polishing systems
- Patent number 12,308,272
- Issue date May 20, 2025
- Applied Materials, Inc.
- Jagan Rangarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing solution, polishing apparatus, and polishing method
- Patent number 12,300,499
- Issue date May 13, 2025
- Kioxia Corporation
- Mikiya Sakashita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods for thinning substrates for semiconductor devices
- Patent number 12,290,900
- Issue date May 6, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer surface chemical distribution sensing system and methods for...
- Patent number 12,285,837
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Shota Yatsuzuka
- B24 - GRINDING POLISHING
Information Patent Grant
Adhesive for processing a microelectronic substrate, and related me...
- Patent number 12,288,575
- Issue date Apr 29, 2025
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
End point detection method, polishing apparatus, and polishing method
- Patent number 12,285,836
- Issue date Apr 29, 2025
- Ebara Corporation
- Taro Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer edge asymmetry correction using groove in polishing pad
- Patent number 12,285,838
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus, substrate polishing system including...
- Patent number 12,280,466
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Jaehyug Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and methods for susceptor deposition material removal
- Patent number 12,280,465
- Issue date Apr 22, 2025
- Applied Materials, Inc.
- Vijayabhaskara Venkatagiriyappa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated machine for automatic cutting, polishing, stacking and u...
- Patent number 12,275,083
- Issue date Apr 15, 2025
- SOUTHWEST PETROLEUM UNIVERSITY
- Yang Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing composition and method with high selectivity for silicon...
- Patent number 12,269,969
- Issue date Apr 8, 2025
- CMC MATERIALS LLC
- Benjamin Petro
- B24 - GRINDING POLISHING
Information Patent Grant
Mounting press, grinding and/or polishing device, and production li...
- Patent number 12,263,548
- Issue date Apr 1, 2025
- ATM Qness GmbH
- Robert Höll
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding method for workpiece and grinding apparatus
- Patent number 12,263,553
- Issue date Apr 1, 2025
- Disco Corporation
- Keisuke Yamamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,251,789
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head with local wafer pressure
- Patent number 12,251,788
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Andrew Nagengast
- B24 - GRINDING POLISHING
Information Patent Grant
Filter apparatus for semiconductor device fabrication process
- Patent number 12,251,786
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chwen Yu
- B24 - GRINDING POLISHING
Information Patent Grant
Planarization strategy in nano-sized fabrication
- Patent number 12,254,906
- Issue date Mar 18, 2025
- Seagate Technology LLC
- Cheng Bi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system with capacitive shear sensor
- Patent number 12,233,505
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate holding apparatus, substrate suction determination method...
- Patent number 12,230,529
- Issue date Feb 18, 2025
- Ebara Corporation
- Osamu Nabeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controlled substrate carrier and polishing components
- Patent number 12,217,979
- Issue date Feb 4, 2025
- Axus Technology, LLC
- Daniel Ray Trojan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,208,487
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing liquid
- Patent number 12,203,007
- Issue date Jan 21, 2025
- Hoya Corporation
- Hiroki Nakagawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Roller for location-specific wafer polishing
- Patent number 12,194,591
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Grant
Atmospheric plasma in wafer processing system optimization
- Patent number 12,198,935
- Issue date Jan 14, 2025
- Axus Technology, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing, processing system, and method of polishing
- Patent number 12,179,312
- Issue date Dec 31, 2024
- Ebara Corporation
- Takuya Moriura
- B24 - GRINDING POLISHING
Information Patent Grant
Method of transferring semiconductor wafer to polishing apparatus a...
- Patent number 12,179,308
- Issue date Dec 31, 2024
- Sumco Corporation
- Ryoya Terakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry and polishing method
- Patent number 12,173,219
- Issue date Dec 24, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Polishing agent for synthetic quartz glass substrate and method for...
- Patent number 12,173,193
- Issue date Dec 24, 2024
- Shin-Etsu Chemical Co., Ltd.
- Mitsuhito Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chemical mechanical planarization tool
- Patent number 12,172,263
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Michael Yen
- B24 - GRINDING POLISHING
Information Patent Grant
Composition and method for polysilicon CMP
- Patent number 12,157,834
- Issue date Dec 3, 2024
- CMC MATERIALS LLC
- Sarah Brosnan
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE SUPPORT DEVICE, CLEANING DEVICE, DEVICE AND METHOD FOR CA...
- Publication number 20250164977
- Publication date May 22, 2025
- EBARA CORPORATION
- Michiaki MATSUDA
- G05 - CONTROLLING REGULATING
Information Patent Application
POLISHING PAD WITH IMPROVED SLURRY FLOWABILITY AND PROCESS FOR PREP...
- Publication number 20250144764
- Publication date May 8, 2025
- SK enpulse Co., Ltd.
- Yujin SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD, METHOD FOR PRODUCING POLISHING PAD, AND METHOD FOR P...
- Publication number 20250144765
- Publication date May 8, 2025
- FUJIBO HOLDINGS, INC.
- Yoshihide KAWAMURA
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY COMPOSITION FOR POLISHING METAL FILM
- Publication number 20250145858
- Publication date May 8, 2025
- KCTECH CO., LTD.
- Jin Sook HWANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND METHOD OF MANUF...
- Publication number 20250136842
- Publication date May 1, 2025
- SK enpulse Co., Ltd.
- Han Teo PARK
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...
- Publication number 20250140594
- Publication date May 1, 2025
- EBARA CORPORATION
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20250129279
- Publication date Apr 24, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20250125196
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLI...
- Publication number 20250115785
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Wonki HUR
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHO...
- Publication number 20250115787
- Publication date Apr 10, 2025
- SK enpulse Co., Ltd.
- Deok Su HAN
- B24 - GRINDING POLISHING
Information Patent Application
HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE
- Publication number 20250114902
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Avyay Panchapakesan
- B24 - GRINDING POLISHING
Information Patent Application
EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL PO...
- Publication number 20250114897
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL P...
- Publication number 20250114901
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING-RING-LESS CMP PROCESS
- Publication number 20250114903
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Chen-Wei Chang
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20250118604
- Publication date Apr 10, 2025
- EBARA CORPORATION
- Akira FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL
- Publication number 20250108473
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Andrew J. Nagengast
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURI...
- Publication number 20250109319
- Publication date Apr 3, 2025
- FUJIMI INCORPORATED
- Masashi ABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF POLISHING USING CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20250100100
- Publication date Mar 27, 2025
- DuPont Electronic Materials Holding, Inc.
- Fengji YEH
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION AND SURFACE TREATMENT METHOD
- Publication number 20250092284
- Publication date Mar 20, 2025
- FUJIMI INCORPORATED
- Toshio SHINODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20250084294
- Publication date Mar 13, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
CHEMICAL MECHANICAL POLISHING PROCESS USING STEAM FOR POLISHING FLU...
- Publication number 20250083282
- Publication date Mar 13, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Yohei YAMADA
- B24 - GRINDING POLISHING
Information Patent Application
FREE JOINT STRUCTURE, PUSH-PULL DEVICE, AND SUBSTRATE PROCESSING MO...
- Publication number 20250073851
- Publication date Mar 6, 2025
- EBARA CORPORATION
- MATSUTARO MIYAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
INTEGRATED MACHINE FOR AUTOMATIC CUTTING, POLISHING, STACKING AND U...
- Publication number 20250073808
- Publication date Mar 6, 2025
- SOUTHWEST PETROLEUM UNIVERSITY
- Yang TANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTAINMENT AND EXHAUST SYSTEM FOR SUBSTRATE POLISHING COMPONENTS
- Publication number 20250065473
- Publication date Feb 27, 2025
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Application
AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING METHODS
- Publication number 20250062148
- Publication date Feb 20, 2025
- GLOBALWAFERS CO., LTD.
- ShinBae Park
- B08 - CLEANING
Information Patent Application
APPARATUS FOR POLISHING, PROCESSING SYSTEM, AND METHOD OF POLISHING
- Publication number 20250058431
- Publication date Feb 20, 2025
- EBARA CORPORATION
- Takuya MORIURA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICON...
- Publication number 20250033160
- Publication date Jan 30, 2025
- SK enpulse Co., Ltd.
- Yujin SHIN
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS
- Publication number 20250025982
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Donghoon Kwon
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITION, MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT, AND CL...
- Publication number 20250017209
- Publication date Jan 16, 2025
- FUJIFILM CORPORATION
- Tadashi INABA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING DIAMOND CRYSTAL, AND DIAMOND CRYSTAL
- Publication number 20250018524
- Publication date Jan 16, 2025
- ORBRAY CO., LTD.
- Seongwoo KIM
- B24 - GRINDING POLISHING

designed for working plane surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High throughput polishing modules and modular polishing systems

Polishing solution, polishing apparatus, and polishing method

Methods for thinning substrates for semiconductor devices

Wafer surface chemical distribution sensing system and methods for...

Adhesive for processing a microelectronic substrate, and related me...

End point detection method, polishing apparatus, and polishing method

Wafer edge asymmetry correction using groove in polishing pad

Substrate polishing apparatus, substrate polishing system including...

Apparatus and methods for susceptor deposition material removal

Integrated machine for automatic cutting, polishing, stacking and u...

Polishing composition and method with high selectivity for silicon...

Mounting press, grinding and/or polishing device, and production li...

Grinding method for workpiece and grinding apparatus

Chemical mechanical polishing apparatus and method

Polishing head with local wafer pressure

Filter apparatus for semiconductor device fabrication process

Planarization strategy in nano-sized fabrication

Polishing system with capacitive shear sensor

Substrate holding apparatus, substrate suction determination method...

Temperature controlled substrate carrier and polishing components

Chemical mechanical polishing apparatus and method

Polishing liquid

Roller for location-specific wafer polishing

Atmospheric plasma in wafer processing system optimization

Apparatus for polishing, processing system, and method of polishing

Method of transferring semiconductor wafer to polishing apparatus a...

Slurry and polishing method

Polishing agent for synthetic quartz glass substrate and method for...

Chemical mechanical planarization tool

Composition and method for polysilicon CMP

Patents Applicationslast 30 patents

SUBSTRATE SUPPORT DEVICE, CLEANING DEVICE, DEVICE AND METHOD FOR CA...

POLISHING PAD WITH IMPROVED SLURRY FLOWABILITY AND PROCESS FOR PREP...

POLISHING PAD, METHOD FOR PRODUCING POLISHING PAD, AND METHOD FOR P...

SLURRY COMPOSITION FOR POLISHING METAL FILM

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND METHOD OF MANUF...

SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...

SLURRY, SCREENING METHOD, AND POLISHING METHOD

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLI...

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHO...

HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE

EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL PO...

GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL P...

RETAINING-RING-LESS CMP PROCESS

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL

POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURI...

METHOD OF POLISHING USING CHEMICAL MECHANICAL POLISHING PAD

POLISHING COMPOSITION AND SURFACE TREATMENT METHOD

SLURRY AND POLISHING METHOD

CHEMICAL MECHANICAL POLISHING PROCESS USING STEAM FOR POLISHING FLU...

FREE JOINT STRUCTURE, PUSH-PULL DEVICE, AND SUBSTRATE PROCESSING MO...

INTEGRATED MACHINE FOR AUTOMATIC CUTTING, POLISHING, STACKING AND U...

CONTAINMENT AND EXHAUST SYSTEM FOR SUBSTRATE POLISHING COMPONENTS

AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING METHODS

APPARATUS FOR POLISHING, PROCESSING SYSTEM, AND METHOD OF POLISHING

POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICON...

CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS

COMPOSITION, MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT, AND CL...

METHOD FOR POLISHING DIAMOND CRYSTAL, AND DIAMOND CRYSTAL