Claims
- 1. A method for producing sharp-edged holes in electronic devices comprising the steps of:
- holding a specimen with an epitaxial layer thereon in position by a tab placed over a portion of the specimen and the epitaxial layer;
- directing an ion beam over the specimen and the epitaxial layer while shielding the portion of the epitaxial layer covered by the tab from the ion beam for machining exposed portions of the epitaxial layer and for thinning the epitaxial layer to a specified thickness;
- measuring the amount of exposed epitaxial layer portions against the shielded epitaxial portion by means for determining the depth of the specimen portions machined by said directing step;
- placing a mask substantially in contact on and with the thinned specimen, the mask having means therein for enabling subsequent production of the sharp-edged holes in the specimen; and
- directing an ion beam at the specimen and the mask and through the mask means for removing portions of the specimen unprotected by the mask means by ions from the beam and thereby for producing the sharp-edged holes in the specimen.
- 2. A method as in claim 1 wherein said ion beam directing step comprises the step of broadly processing the ion beam over the entire specimen and mask.
- 3. A method of thinning a specimen with a surface layer thereon to a specified thickness comprising the step of:
- holding the specimen with the surface layer in position by a tab placed over a portion of the surface layer;
- directing an ion beam over the surface layer for uniformly removing portions thereof while shielding the portion by the tab from the ion beam; and
- measuring the amount of the surface layer remaining after said ion beam directing step against the amount of the surface layer portion covered by the tab by means for determining the depth of the surface layer removed by said directing step.
Parent Case Info
This is a continuation of application Ser. No. 272,518 filed July 17, 1972, now abandoned.
Government Interests
The invention herein described was made in the course of or under a contract or subcontract thereunder, with the Department of The Air Force.
US Referenced Citations (9)
Foreign Referenced Citations (1)
Number |
Date |
Country |
451,332 |
May 1968 |
CH |
Continuations (1)
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Number |
Date |
Country |
Parent |
272518 |
Jul 1972 |
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