The present invention relates to an ion driven, fluid flow-generating microscale pump device and method for creating a flow of a gaseous fluid (e.g. air) for the purpose of cooling solid objects.
Rapidly decreasing feature sizes and increasing power density in microelectronic devices has necessitated development of cooling strategies to achieve very high heat removal rates from these devices. For example, heat removal rates in excess of 40 W/cm2 have been projected for the next generation of personal computing devices. Microchannel heat sinks have the potential to achieve these heat removal rates and therefore have been studied for over two decades as described, for example, by Tuckerman and Pease in “High performance heat sinking for VLSI”, IEEE Electron Device Letters, Vol. EDL-2, pp. 126-129, 1981, and by Garimella and Sobhan in “Transport in microchannels-A critical review”, Annual Review of Heat Transfer, Vol. 14, 2003. However, the high pressure drops encountered in microchannels have largely precluded their use in practical applications thus far. In particular, such microchannel heat sinks require an external pump to drive the fluid through the microchannels. The need for an external pump is disadvantageous in that relatively large amounts of electrical power and space would be needed for the pump.
An embodiment of the invention provides a microscale pump device and method for creating a flow of a gaseous fluid wherein the pump device includes an ion generating region including one or more electron-emitting cathode electrodes for generating unipolar ions in the gaseous fluid and further includes a pumping region disposed downstream of the ion generating region and including pumping electrodes for generating an electric field in a manner that imparts motion to the unipolar ions and thus the fluid in a selected direction.
In an illustrative embodiment of the invention, the ion generating region comprises one or more low-voltage, electron-emitting cold cathode electrodes. The one or more electron-emitting cathode electrodes each emits a beam or stream of electrons that collide with neutral fluid molecules (e.g. air molecules) to generate unipolar ions at ambient temperature and at relatively low electrode voltage. The pumping region is disposed downstream (relative to fluid flow) of the ion generating region and comprises a series of pumping electrodes whose polarity is switched in a manner to generate a translating electric field that imparts motion to the unipolar ions and thus the fluid in a direction for removing heat from a heat-generating electronic component. Preferably, the pumping electrodes reside on one or more heat transfer surfaces (e.g. on a surface of one or more microchannels and/or on pin cooling fins). The invention converts electrical energy directly into motion of a heat transfer fluid.
A particular method embodiment of the invention involves removing heat from a heat-generating electronic component comprising the steps of emitting electrons from an electron-emitting cathode electrode to generate unipolar ions in a gaseous heat transfer fluid and establishing an electric field to impart motion to the ions and thus the heat transfer fluid relative to the heat-generating component.
Another embodiment of the invention provides an ion generator useful for generating unipolar ions in ambient air.
Still another embodiment of the invention provides a gaseous fluid pump comprising a series of pumping electrodes disposed along a fluid flow path for generating an electric field in a manner that imparts motion to unipolar ions present in the gaseous fluid and thus to the fluid in the direction of the flow path.
Features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the following drawings.
a is a schematic view showing a pair of pumping electrodes located in a microchannel of a pumping region of a fluid pump device pursuant to an illustrative embodiment of the invention.
b is a schematic view of a plurality of sets of pumping electrodes arranged in series along a microchannel of a heat sink of the pumping region pursuant to an illustrative embodiment of the invention.
The present invention provides a microscale ion driven air flow pump device 10 and method useful for, although not limited to, removing heat from a heat-generating electronic component, such as for purposes of illustration and not limitation, an IC chip (integrated circuit chip) of an electronic device such as cell phones, laptop computers, personal digital assistance devices, desktop computers, and the like. Although the microscale pump device is illustrated and described in connection with a microchannel cooling scheme, the invention is not so limited and can be used in connection with other cooling schemes such as cooling fins and other heat transfer surfaces that may be provided in thermal transfer relation with a heat-generating electronic component.
Referring to
In
The unipolar ions are created in the ion generating region 12 through a process of electron emission from the cathode electrodes 16 followed by a series of ionizing collisions with ambient air molecules when the gaseous fluid comprises ambient air. The electron-emitting cathode electrodes can comprise arrays of multiple cathode emitters 16a disposed on a cathode substrate 17 as illustrated schematically in
The electric field enhancement of cold-cathode electrodes 16 concentrates the applied electric field such that the process of electron emission occurs at a relatively low voltage such as, for example, from about 5 to about 400 V for purposes of illustration and not limitation since other voltages may be used in practice of the invention.
Unipolar positive ions are created by collisions between the electrons and the neutral charge air molecules when ambient air comprises the fluid. At sufficiently high electric field strengths, these collisions result in the liberation of an electron from the neutral air molecule. The reaction creates a positive ion and an additional free electron. The free electrons eventually reach the anodes 14 and are removed from the system.
Unipolar negative ions can be created in a similar manner to the unipolar positive ions described, but at lower field strengths. For example, free electrons, in the presence of a lower electric field, can collide and attach themselves to oxygen molecules in the air and create a stable unipolar negative ion.
The electron-emitting cathode electrodes 16 also can comprise arrays of multiple carbon nanotube emitter electrodes as illustrated, for example, schematically in
The pumping region 18 is disposed downstream (relative to fluid flow) of the ion generating region 12 and comprises multiple pairs of pumping electrodes 22 which are arranged in series along fluid flow paths P defined by individual microchannel heat sinks 20,
The microchannel heat sinks 20 can be formed integrally on the surface S of the chip 100 using silicon micromachining processes or other suitable fabrication processes, or the heat sinks 20 can be formed as a separate body that is joined to the chip surface S in a manner that provides heat transfer from the chip 100 to the heat sink body. For purposes of illustration and not limitation, the microchannels 20a defined between the heat sinks 20 each can have a cross-sectional area of 50,000 microns2 or less, such as a vertical channel depth normal to chip surface S in
Pumping of the gaseous fluid (e.g. air) through the microchannels 20a between the heat sinks 20 is achieved by employing a series of pairs of electrically insulated pumping electrodes 22 as depicted in
The electric field established by the pumping electrodes 22 will not be high enough to ionize air. Insulation (not shown) over the pumping electrodes 22 will prevent free electrons from being emitted from these surfaces. Thus, the only charges moving through the pumping region are the unipolar ions created in the ion generating region 12. These ions, by collisions with neutral molecules, will efficiently convert electric power into fluid motion. In particular, the ionized air molecules (unipolar ions) are accelerated by the electric field imposed by the pumping electrodes 22. The ions collide with neutral air molecules according to the mean free path length, which is approximately 60 nm for air at room temperature and pressure. It can be assumed that the ions lose all of their momentum to the neutral molecule after each collision. The transfer of momentum from the ions to the bulk fluid, therefore acts as a body force b given by: b=(Ep)/(density of fluid), where E is the electric field and p is the charge density. In a set of calculations, it was found that a body force of b=150,000 m/s2 is to be expected from pumping electrodes spaced apart by 100 microns at 100 volts. This compares to a body force for natural convection of only approximately 1 m/s2. Calculations predict that with a body force of only b=100,000 m/s2, air velocities approaching 80 m/s and average convection coefficients exceeding 150 W/m2 K can be achieved for flow over a flat surface in 40 mm length. With surface enhancement, the effective convection coefficient can be significantly increased.
The microscale proportions of the pumping electrodes 22 allow them to be integrated on a heat transfer surface of the microchannel heat sinks 20, keeping the air flow in intimate contact with the microscale heat sinks and thus dissipating large heat fluxes without the use of ducting. The invention produces microscale air flow integrated within micro-featured heat sinks 20. The micro-scale pump device 10 works without moving parts for use in a variety of small-scale electronics packaging applications. High performance heat removal technologies such as microchannels, which hitherto limited in their implementation because of large pumps required, can be viable since the flow is crated by a “pump” that is itself truly at the microscale. Much higher power densities can be dissipated right at the chip level without the need to resort to bulky pumping technologies.
For purposes of illustration and not limitation, the pumping electrodes 22 are shown in
As mentioned above, it is advantageous to scale down the spacing of the pumping electrodes 22 such that high electric fields are created with relatively low voltages (e.g. less than 100V ). With electrode spacing on the order of micrometers, air flow is established and controlled easily at microscale dimensions such that high electric fields and high flow rates can be created at low voltages by pumping electrodes 22 without creating unwanted additional ions or free electrons. The pumping electrode spacing, applied voltage, switching frequency, and on-current can be selected to provide a desired maximum fluid flow velocity, heat transfer rate, and electro-mechanical conversion efficiency for a given heat removal application.
Ion driven air flow pursuant to the invention is a novel method of pumping air or other gaseous fluid at microscale dimensions using ion drag. The method employs the series of micro-fabricated pumping electrodes 22 to generate strong electric fields that pump unipolar ions through air or other gaseous fluid. The ions collide repeatedly with neutral molecules thus generating bulk fluid motion. Meso-scale motion is obtained by changing the polarity of the pumping electrodes rapidly over time in such a manner as to create a continuous force on the ions. The invention can be used to generate airflow through microchannel heat sinks 20, or other micro-featured heat transfer surfaces to create compact, high flux heat sinks for electronic cooling.
Although the invention has been described with respect to certain embodiments thereof, those skilled in the art will that changes and modifications can be made thereto within the scope of the invention as set forth in the appended claims.
This application claims the benefits and priority of provisional application Ser. No. 60/439,568 filed Jan. 10, 2003.
This invention was supported by funding from the Federal Government through the National Science Foundation under Contract/Grant No. 0222553-CTS. The Government may have certain rights in the invention.
Number | Date | Country | |
---|---|---|---|
60439568 | Jan 2003 | US |