BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view showing the structure of a conventional isothermal plate;
FIG. 2 is an exploded perspective view of a first embodiment of the present invention;
FIG. 3 is an assembled view of the first embodiment of the present invention;
FIG. 4 is a perspective side view of the first embodiment of the present invention;
FIG. 5 is a plan view of a second embodiment of the present invention;
FIG. 6 is a schematic view showing the operating state of the second embodiment of the present invention adhering to a heat source;
FIG. 7 is a plan view of a third embodiment of the present invention; and
FIG. 8 is a perspective side view of the third embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
In order to make the Examiner better understand the characteristics and the technical contents of the present invention, a detailed description relating to this will be made with reference to the accompanying drawings. However, it should be understood that the drawings are illustrative but not used to limit the scope of the present invention.
With reference to FIG. 2, it is an exploded perspective view showing the isothermal plate module of a first embodiment of the present invention. The isothermal plate module 1 is constituted of an isothermal plate body 10 and a plurality of heat pipes 12. The isothermal plate body 10 has first recesses 102 extending along a first direction and second recesses 104 extending along a second direction. In this figure, the first or second recesses 102, 104 are parallel to one another to form a space between any parallel first or second recess. The first recesses 102 and the second recesses 104 are staggered and overlapped with one another, so that the end face 14 of the isothermal plate body 10 is formed into a mesh-like arrangement. Each first recess 102 is formed into a deeper recess, so that the heat pipes 12a having the same orientation can be completely disposed in the isothermal plate body 10. Each second recess 104 has a level difference with respect to the first recess 102, so that the heat pipes 12b disposed in the second recesses 104 will be located above heat pipes 12a disposed in the first recesses 102. Therefore, the staggered heat pipes 12a, 12b will not interference with one another. In addition, each heat pipe 12a, 12b can abut against one another, thereby to increase the heat-conducting efficiency. Since the working fluid and capillary structure provided within the heat pipes 12a, 12b are conventional, the description thereof is omitted.
With reference to FIG. 3 and FIG. 4, they are an assembled view and a perspective side view of the present invention, respectively. The heat pipes 12a are disposed in the first recesses 102. The heat pipes 12b are staggered with respect to the heat pipes 12a and is disposed in the second recesses 104. The peripheries of the heat pipes 12a within the first recesses 102 and those of the heat pipes 12b within the second recesses 104 partially adhere to the isothermal plate body 10. A portion of the peripheries is exposed to the outside. The working fluid within the heat pipes 12a, 12b is heated by the portion thereof contacting with the isothermal plate body 10 and thus generates vapor. The thus-generated vapor moves toward the lower-pressure exposed portion (condensed end) to form a vapor flow. The vapor is cooled down at the exposed portion (condensed end) to release the latent heat thereof.
Since the other end face opposite to the recessing surface of the isothermal plate is a flat surface 16. The flat surface is used to tightly adhere to the heat source, and there is no gap therebetween to affect the heat-absorbing effect of the isothermal plate. Therefore, the isothermal plate module of the present invention has an absolute effect on the heat source absorbed thereto. Further, in the present invention, since the heat pipes are staggered on the isothermal plate, the heat dissipation can be carried out to the entire heat source, further improving the heat-dissipating efficiency.
With reference to FIG. 5 and FIG. 6, a second embodiment of the present invention will be described. In the present embodiment, it aims to produce a heat source device having a large area. As shown in the previous embodiment, the recesses 102, 104 of the present invention can be achieved by processing on the end face 14 of the isothermal plate body 10. Therefore, no matter the area of the isothermal plate is large or not, the same processing procedure can be applied. Therefore, in the present embodiment, it is not difficult to form the first recesses 102′ along the first direction and second recesses 104′ along the second direction on the isothermal plate body 10′ having a large area. Further, the heat pipes 12a′, 12b′ can be made to have a length identical to the length or width of the isothermal plate.
The present invention can be applied to the electronic apparatuses having a high density of heat generation. FIG. 6 shows the isothermal plate module 1′ of the second embodiment, in which a simulation of heat dissipation is made with respect to a heat source Q. The isothermal plate module 1′ utilizes a flat surface 16′ to tightly adhere to the heat source Q, so that the heat generated by the heat source Q can be conducted to each heat pipe 12a′, 12b′ from the flat surface 16′ of the isothermal plate module 1′ via the isothermal plate body 10′. Similarly, the working fluid within the heat pipes 12a′, 12b′ is heated by its portion contacting with the isothermal plate and thus generates vapor. The thus-generated vapor moves toward the low-pressure exposed portion (condensed end) to form a vapor flow. The vapor is cooled down at the exposed portion (condensed end) to release the latent heat thereof. With the latent heat between the liquid and vapor phases of the working fluid, the considerable amount of heat to be removed far exceeds the heat removed by means of single-phase heat dissipation (such as fan, heat dissipating fins).
With reference to FIG. 7 and FIG. 8, a third embodiment of the present invention is shown. The reference numerals used in this embodiment are the same as those used in the first embodiment. In the present embodiment, to avoid the first recesses 102 and the second recesses 104, the end face of the isothermal plate body 10 is provided with third recesses 106 along a third direction. Each third recess 106 can be a through hole or a blind hole. The heat pipe 12c can be inserted with an angle of the third direction. Since each third recess 106 of the present embodiment is not long in distance, it is easy to accomplish the drilling operation. To provide the third recesses 106 along the third direction is to increase the heat-conducting and heat-dissipating efficiency. In the drawing, a portion of the heat pipes 12c within the third recesses 106 is tangential to the heat pipes 12a or 12b within the first recesses 102 and the second recesses 104 or tangential to both of them. In this way, these heat pipes contact with one another. In comparison with this, a portion of the third recesses 106 is independent. It can be anticipated that the structure of this embodiment can be used to obtain a better heat-conducting efficiency. However, the third recesses 106 are not limited to the above embodiment. Any recess 106 provided in the third direction at any positions on the end face 14 of the isothermal plate body 10 should be embraced in the above description.
FIG. 8 is a cross-sectional side view of the third embodiment shown in FIG. 7. It is well known that the heat pipe 12c includes a sealing end 122 (exemplified by the designated heat pipe 12c). The wall face formed by the sealing end 122 shrinks to form a thickness and thus is not a flat end. Therefore, if each third recess 106 provided in the third direction is a blind hole, the sealing end 122 of the heat pipe 12c can be ground in advance, so that the wall face can be formed into a substantially flat surface. In this way, a larger contacting area can be formed between the sealing end 122 of the heat pipe 12c and the bottom of the recess 106. If each third recess 106 is a through hole, in addition to the above grinding process, all the heat pipes 12c can be firstly disposed on the third recess 106. Then, all the sealing ends 122 exposed from the through hole are ground in one time. The thus-ground heat pipes 12c and the end surface are coated with a heat-conducting glue, thereby to achieve the same effect.
According to the above, the present invention indeed achieves the desired effects and solves the drawbacks of prior art by using the above-mentioned structure. Further, the present invention involves the novelty and inventive steps, and thus conforms to the requirements for a utility model patent.
Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still be occurred to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
Patent Application
20080035310
