The present invention relates to a configuration, a material, and a manufacturing method of a keypad provided with pressing elements which constitutes a key unit for mobile equipment such as portable phones and personal digital assistants (PDA).
A key unit is one type of components constituting mobile equipment, and a multiplicity of keys (push buttons) for switch operation are assembled and arrayed on a surface of one sheet.
Each key comprises a keypad made of a piece of soft elastomer (e.g., silicone rubber), and a key top made of a piece of hard material (e.g., polycarbonate resin, hereinafter referred to as “PC resin”) attached on the surface of the keypad. On the back of the keypad which is not shown in
In the conventional key units, a pressing element is formed integrally of the same material as the keypad. In a key for a certain purpose (e.g., a multi-direction key, etc.), however, shortcomings including occurrence of keystroke loss or vague clicking feeling at the time of key-pressing due to the elastic deformation of the pressing elements have been pointed out.
Thus, for such specific keys, a method has been conceived of for forming only a pressing element of a hard resin (e.g., PC resin) separately from a keypad (hereinafter the hard resin is referred to as “resin chip 5”), and, by means of an insert molding method to be carried out by setting in advance the resin chip into a die for keypad-molding, implanting the pressing elements at a predetermined position of the keypad. For such a keypad configuration and a manufacturing method thereof, the applicant of the present application has previously filed a patent application (refer to Patent Literature 1). Patent Literature 1: Japanese Unexamined Patent Publication No. 2002-279860
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In addition to the above-mentioned problem, the keypad configuration and the manufacturing method thereof disclosed in Patent Literature 1 has the steps of: forming a resin chip; carrying out annealing and primer treatments before placing the resin chip in a die in order to securely adhere a silicone rubber to the resin chip; and setting the resin chip in the die one by one; and the like. Therefore, increase in the number of steps has been inevitable compared with such method for integrating a keypad with a pressing element with a silicone rubber.
An object of the invention is to find a new configuration, a material, and a manufacturing method of an elastomer keypad 2 provided with a pressing element 3 capable of pressing a switch element with less keystroke loss and clear clicking feeling, and, further, capable of simplifying processes more than in an insert molding method which uses the conventional resin chip.
The above-mentioned objects will be achieved by an elastomer keypad formed with a liquid thermosetting resin and provided with a pressing element for pressing a switch element, and a manufacturing method thereof.
For a liquid thermosetting resin to be adopted in the invention, a general thermosetting resin such as an epoxy resin or a phenol resin, or a silicone resin which is polyorganosiloxane containing in a molecule a trifunctional (unit T) or tetrafunctional (unit Q) siloxane unit would be appropriate. In the silicone resin, particularly a methylphenyl based straight silicone resin containing in a molecule a methyl group and a phenyl group, or various types of silicone modified organic resins (e.g., silicone modified epoxy resin) can be used.
Further, for an elastomer constituting a keypad main body, although a line of material varies depending on cases of employing a silicone resin or employing other thermosetting resins as a liquid thermosetting resin, it is preferable to employ a silicone rubber for the former, and to employ various thermoplastic elastomers (TPE) such as of polyester based, urethane based, and polyamide based, for the latter.
In the case of forming a main body of the keypad 2 with a silicone rubber and the pressing element 3 with a silicone resin, a catalyst is to be added onto a concave portion for forming the pressing element in a keypad-molding die (in a one-pack type), or a silicone resin mixed with liquid A and liquid B together with a catalyst is dropped onto the concave portion (in a two-pack type), and by heating the same to a predetermined temperature, a crosslink-hardening reaction is progressed, so that the silicone resin starts hardening, which leads to the formation of a silicone resin pressing element in the keypad-molding die, the pressing element becoming an insertion as it is in the insert molding method. Subsequently, when the silicone resin of the pressing element is in a semi-hardened state, a silicone rubber is supplied to the keypad-molding die, and molding is carried out by means of a compression molding method or a liquid injection molding method (LIM).
Moreover, in the case of forming the keypad main body with a thermoplastic elastomer and the pressing element with a thermosetting resin, a thermosetting resin is dropped onto a concave portion for forming a pressing element in a keypad-molding die, and by heating the same to a predetermined temperature, the thermosetting resin starts hardening, which leads to the formation of a thermosetting resin pressing element in the keypad-molding die, the pressing element becoming an insertion as it is in the insert molding method. Subsequently, when the thermosetting resin of the pressing element is in a semi-hardened state, by injecting the thermoplastic elastomer, a keypad is integrally formed with the keypad main body with the pressing element. It should be noted that, in this case, it is possible to form not only a pressing element but a key top simultaneously by means of a two-color molding method, for example.
(1) While the method described in Patent Literature 1 requires a resin chip molding process which is entirely different from the keypad molding process, the method according to the invention is directed to forming of the pressing element made of a liquid thermosetting resin and the keypad main body using the same die. Therefore, the method according to the invention is far more efficient.
(2) While the method according to Patent Literature 1 requires the molded resin chips to be set one by one in the die, the method according to the invention only requires the thermosetting resin to be dropped onto the concave portion in the die, which also realizes automation easily.
(3) In the case of forming the keypad main body with a silicone rubber using a silicone resin as the liquid thermosetting resin, due to siloxane bonding which is common to both of them, the bonding between the silicone resin pressing element and the silicone rubber is quite excellent, so that no special primer treatment or the like is required.
That allows a keypad manufacturing process to be considerably simplified.
(4) Further, since the silicone resin pressing element is softer than the PC resin pressing element and has moderate elasticity. Therefore, the clicking feeling thereof is softer than that of the PC resin, and further the silicone resin pressing element has the same clear clicking feeling.
Hereinafter, the best mode for carrying out the invention will be described by way of two embodiments.
As the silicone resin, a methylphenyl silicone resin which belongs to a straight silicone resin was used. The liquid A and liquid B were mixed at a ratio of 1:1. After deaeration, the mixture was dropped onto a bowl 71 from the injector 8 and left to stand for about 30 seconds. A silicone rubber substrate was placed on the surface of the die cavity 53 as the silicone resin started hardening, with the dies 51 and 52 being closed, and primary vulcanization was carried out at 170° C. for about 3 minutes, followed by secondary vulcanization at 200° C. for about one hour. It should be noted that while in the present embodiment, compression molding method using a silicone rubber substrate was used, it is also possible to employ what is called liquid injection molding (LIM) for injecting a liquid silicone rubber into the die.
The result of adhesion/peel strength evaluation test of the silicone resin and the silicone rubber in the keypad 2 made of the silicone rubber described in Embodiment 1 will be given below.
(1) When force applied to the adherend (without primer treatment) of the silicone resin and the silicone rubber after the primary vulcanization was 2.482 kgf in the first sample and was 2.549 kgf in the second sample, peeling was occurred on the surface of resin/rubber adhesion. The degree of peeling at this time was, respectively, 25% and 30%. When the adhesive strength of the surface of resin/rubber adhesion in the first and second samples are calculated from these results, the calculated adhesive strength are, respectively, 1.92 N/cm2 and 1.97 N/cm2.
(2) When force applied to the adherend (without primer treatment) of the silicone resin and the silicone rubber after the secondary vulcanization was 2.270 kgf in the first sample and was 2.158 kgf in the second sample, rupture was occurred at the rubber portion. When the adhesive strength of the surface of resin/rubber adhesion in the first and second samples are calculated from these results, the calculated adhesive strength are, respectively, 1.75 N/cm2 and 1.67 N/cm2.
(3) For comparison, when force applied to the conventional adherend (with primer treatment) of a chip made of a PC resin and a silicone rubber was 2.397 kgf in the first sample and was 1.954 kgf in the second sample, rupture was occurred at the rubber portion. When the adhesive strength of the surface of resin/rubber adhesion in the first and second samples are calculated from these results, the calculated adhesive strength are, respectively, 1.27 N/cm2 and 1.03 N/cm2.
As can be seen from the above, the adherend (without primer treatment) of the silicone resin and the silicone rubber after the secondary vulcanization exhibits better adhesive strength than that of the conventional adherend (with primer treatment) of the chip made of the PC resin and the silicone rubber.
The invention relates to mobile equipment such as portable phones, personal digital assistants (PDA), or the like which occupy a significant position in the information industry and the communication equipment manufacturer, and more particularly, an improved configuration, a material, and a manufacturing method of a keypad provided with a pressing element which constitutes a key unit for mobile equipment, so that the invention can contribute to development of these industries.
Number | Date | Country | Kind |
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2003-310960 | Sep 2003 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP04/12251 | 8/26/2004 | WO | 8/2/2006 |