Patent Grant
7923653
1. Technical Field
The present invention relates to a key switch sheet and a key switch module. Specifically, the present invention relates to a key switch module substrate used in a key switch used by being incorporated in a mobile telephone, or the like; a key switch module having a key top arranged on the key switch module substrate; and a key switch sheet for fixing a contact spring of the key switch module substrate.
2. Related Art
In mobile telephones and the like, a key switch having a structure in which a key is pushed with a finger thereby deforming a contact spring underneath, conducting electrode portions by the contact spring and turning ON the switch is used. In such a key switch, a raised dome-shaped contact spring is arranged on a second contact portion formed to surround a first contact portion, the first contact portion is covered by the contact spring while being spaced apart from the first contact portion, and the front surface side of the contact spring is covered with a contact spring fixing sheet. In the key switch, the contact spring deforms when the key is pushed with the finger thereby contacting the first contact portion, so that the first contact portion and the second contact portion are electrically conducted by way of the contact spring thereby turning ON the relevant switch. When the finger is released from the key, the contact spring elastically returns to be spaced apart from the first contact portion, and the switch returns to a OFF state.
In such a key switch, the click feeling of when the key is pushed with the finger becomes an important issue since the stroke of the key is short, and various methods for improving the click feeling have been proposed.
For instance, in a key switch module disclosed in FIG. 1 of Japanese Unexamined Patent Publication No. 2004-55389 (Patent Document 1), an apex portion of the contact spring is fixed to the back surface of a fixing sheet, and a resin material is stacked and solidified in one layer or a plurality of layers at the front surface of the fixing sheet at a position corresponding to the apex portion of the contact spring to thereby form a resin dimple (projecting portion) at the front surface of the fixing sheet (see claim 3 of Patent Document 1). A satisfactory click feeling is obtained by pushing such a resin dimple with a pushing portion (pusher) arranged on the key, and deforming the contact spring with the resin dimple.
However, in the structure of Patent Document 1, the resin dimple is formed by adding the resin material to the front surface of the fixing sheet fixed with the contact spring, and thus processing of the fixing sheet is difficult. The cost of the fixing sheet greatly rises even if the resin dimple is processed in the fixing sheet. Furthermore, although such a key switch module desirably has a thin thickness so as to be incorporated in the mobile telephone, or the like, the thickness of the key switch increases by the thickness of the resin dimple compared to the conventional thickness since the resin dimple is arranged. Moreover, in the key switch module fabricated in such a manner, a problem in that the resin dimple may drop arises, where the cost further increases if measures are taken to prevent the resin dimple from dropping.
In some key switch modules, a flexible light guide sheet is sandwiched between the fixing sheet and the key, and the light of the light source is introduced into the light guide sheet. In such a key switch module, the light guided through a light guide plate exits from the front surface of the light guide plate by being diffused with a diffusion pattern on the back surface of the light guide plate, where the entire arrayed keys are illuminated from the rear surface side by the light leaked out from the front surface of the light guide plate. However, in the key switch module as disclosed in Patent Document 1, if a light guide sheet made from soft resin is sandwiched between the fixing sheet and the key, the resin dimple is buried in the light guide sheet when the key is pushed, and consequently, the stroke of the key becomes long and the effect of improving the click feeling significantly lowers.
Another key switch module is as disclosed in FIG. 3 of Japanese Unexamined Patent Publication No. 2007-287347 (Patent Document 2). In such a key switch module, the projecting surface side of the contact spring is covered with the fixing sheet and the apex portion of the contact spring is made to adhere to the back surface of the fixing sheet, a projection made from a flexible elastic body is arranged on the front surface of the fixing sheet so as to face the apex portion of the contact spring, and a sheet-like operation member is arranged on the front surface side of the fixing sheet with the projection in between.
The key switch module described in Patent Document 2 satisfies both absorption of manufacturing error in positional relationship between the operation member and the contact spring in a operating direction of the contact spring and thinning in the operating direction of the contact spring by arranging the elastic body between the fixing sheet and the sheet-like operation member, but is not aimed to improve the click feeling.
Even if the elastic body of Patent Document 2 has an effect of improving the click feeling, the elastic body is in the same arrangement as the resin dimple of Patent Document 1 in being arranged at the front surface of the fixing sheet on the side opposite to the contact spring by way of the fixing sheet. Therefore, the key switch module can be thinned compared to when a clearance is formed between the fixing sheet and the operation member as described in Patent Document 2, but the thickness of the key switch module is increased compared to when the elastic body and the clearance are not provided. Furthermore, the cost of the key switch module becomes high since an extra member, that is the elastic body, is required.
In the key switch module of Patent Document 2 as well, the click feeling greatly lowers if the light guide sheet is sandwiched between the fixing sheet and the operation member, similar to Patent Document 1
The present invention has been devised to solve the problems described above, and an object thereof is to improve the click feeling of the key switch without adding a new component or a new mechanism, so that the click feeling of the key switch is improved while enhancing thinning and manufacturing property of the key switch and lowering the cost.
In accordance with one aspect of the present invention, a first key switch sheet according to the present invention relates to a key switch sheet having a pressure sensitive adhesive layer for holding a contact spring by adhering to an apex portion of a dome-shaped contact spring at a back surface of a base material sheet; wherein a thickness of the pressure sensitive adhesive layer at a region to be made to adhere to the apex portion of the contact spring is thicker than a thickness of the pressure sensitive adhesive layer at a peripheral region.
In the first key switch sheet of the present invention, the thickness of the pressure sensitive adhesive layer at the region to be made to adhere to the apex portion of the contact spring is thicker than the thickness of the pressure sensitive adhesive at the peripheral region, and thus the pressure sensitive adhesive layer projects out in a projected-form and serves as a projecting portion in the region to be made to adhere to the apex portion of the contact spring. The first key switch sheet has the apex portion of the contact spring adhered to the portion (pressure sensitive adhesive layer) projected out in a projected-form at the back surface, and is superimposed and arranged on the substrate formed with the fixed contact forming a pair, thereby forming the key switch module substrate, or the like. When the contact spring is pushed from above in this state, the contact spring is pushed at the apex portion by the projecting portion (hereinafter simply referred to as a projecting portion) formed by the pressure sensitive adhesive layer, whereby the click feeling in time of switch operation improves. Furthermore, since the projecting portion is on the back surface side of the base material sheet and directly contacts the contact spring, the force the projecting portion pushes the contact spring is less likely to be buffered by the elasticity of the base material sheet as when the projecting portion is formed on the front surface side of the base material sheet, and satisfactory click feeling can be obtained.
Even if the light guide sheet for illuminating the key top is superimposed and arranged on the front surface side of the first key switch sheet, the projecting portion will not be buried in the light guide sheet as when the projecting portion is arranged on the front surface side of the base material sheet, and thus the effect of improving the click feeling does not lower even if the light guide sheet is superimposed.
According to the first key switch sheet of the present invention, the projecting portion for pushing the contact spring is formed using the pressure sensitive adhesive layer (or part of the pressure sensitive adhesive) formed at the back surface of the base material sheet from the prior art, and thus an additional component is not required to improve the click feeling in time of switch operation. As a result, the thickness of the key switch module substrate and the key switch module does not become thicker even if the click feeling is improved, the key switch module substrate and the key switch module can be thinned, the manufacturing step of the key switch module substrate, and the like does not increase, and the cost does not rise. In addition, the projecting portion barely has the possibility of dropping since the projecting portion is a pressure sensitive adhesive layer.
In one embodiment of the first key switch sheet according to the present invention, the apex portion of the contact spring is made to adhere to the pressure sensitive adhesive layer for holding the contact spring to hold the contact spring. According to such an embodiment, the key switch module substrate is easy to handle in assembly since the contact spring is attached to the key switch sheet in advance. In particular, when a plurality of contact springs are used, the task of attaching the contact spring to the pressure sensitive adhesive layer one by one is omitted, and the assembly of the key switch module substrate is facilitated.
In another embodiment of the first key switch sheet according to the present invention, the pressure sensitive adhesive layer does not exit at the peripheral region. According to such an embodiment, the outer peripheral portion of the apex portion of the contact spring does not adhere to the base material sheet by the pressure sensitive adhesive, and thus the outer peripheral portion of the contact spring does not stick to the base material sheet thereby inhibiting deformation, and the click feeling in time of switch operation becomes more satisfactory.
In still another embodiment of the first key switch sheet according to the present invention, the pressure sensitive adhesive layer thicker than the thickness of the pressure sensitive adhesive layer at the peripheral region is formed at a region further on the outer side than the peripheral region. According to such an embodiment, the first key switch sheet can be made to adhere to the substrate arranged with the fixed contact by the pressure sensitive adhesive layer formed at the region on the outer side of the peripheral region.
In another embodiment of the first key switch sheet according to the present invention, the pressure sensitive adhesive layer does not exist at the peripheral region. According to such an embodiment, the outer peripheral portion of the apex portion of the contact spring does not adhere to the base material sheet by the pressure sensitive adhesive, and thus the outer peripheral portion of the contact spring does not stick to the base material sheet thereby inhibiting deformation, and the click feeling in time of switch operation becomes more satisfactory.
In yet another embodiment of the first key switch sheet according to the present invention, the pressure sensitive adhesive layer formed at the back surface of the base material sheet is formed by applying a pressure sensitive adhesive to the back surface of the base material sheet using screen printing method, gravure printing method, or roll coater method. According to such an embodiment, the pressure sensitive adhesive layer can be formed easily and inexpensively by applying the pressure sensitive adhesive through a general printing method.
In yet another embodiment of the first key switch sheet according to the present invention, the thickness of the pressure sensitive adhesive layer formed at the region to be made to adhere to the apex portion of the contact spring is preferably greater than or equal to 0.1 mm and smaller than or equal to 0.2 mm. The click feeling degrades if the thickness of the pressure sensitive adhesive layer is thinner than 0.1 mm, and the thinning of the key switch module substrate, and the like is inhibited if thicker than 0.2 mm.
In yet another embodiment of the first key switch sheet according to the present invention, a diameter of the region to be made to adhere to the apex portion of the contact spring is preferably smaller than or equal to 0.5 times a diameter of the contact spring. The click feeling degrades if the diameter of the region to be made to adhere to the apex portion of the contact spring is greater than 0.5 times the diameter of the contact spring.
In accordance with another aspect of the present invention, a key switch module substrate according to the present invention relates to a key switch module substrate in which an apex portion of a dome-shaped contact spring is made to adhere to a back surface of a base material sheet by a pressure sensitive adhesive or an adhesive, the back surface of the base material sheet is made to adhere to a substrate formed with a first fixed contact and a second fixed contact, which are switched to a conduction state or an insulation state by the contact spring, by pressure sensitive adhesive or adhesive, and the contact spring is faced to the first fixed contact and the second fixed contact; wherein a thickness of the layer of the pressure sensitive adhesive or the adhesive at a region where the apex portion of the contact spring is made to adhere to the base material sheet is thicker than a thickness of the layer of the pressure sensitive adhesive or the adhesive at a peripheral region; and a thickness of the layer of the pressure sensitive adhesive or the adhesive at a region where the base material sheet is made to adhere to the substrate is thicker than a thickness of the layer of the pressure sensitive adhesive or the adhesive at the peripheral region.
In the key switch module substrate of the present invention, the thickness of the layer of the pressure sensitive adhesive or the adhesive at the region where the apex portion of the contact spring is made to adhere is thicker than the thickness of the layer of the pressure sensitive adhesive or the adhesive at the peripheral region, and thus the layer of the pressure sensitive adhesive or the adhesive projects out in a projected-form and serves as a projecting portion in the region where the apex portion of the contact spring is made to adhere. Therefore, when the portion of the contact spring is pushed from above, the contact spring is pushed by the projecting portion (hereinafter simply referred to as a projecting portion) formed by the layer of the pressure sensitive adhesive or the adhesive, whereby the click feeling in time of switch operation improves. Furthermore, since the projecting portion is arranged on the back surface side of the base material sheet and directly contacts the contact spring, the force the projecting portion pushes the contact spring is less likely to be buffered by the elasticity of the base material sheet as when the projecting portion is formed on the front surface side of the base material sheet, and satisfactory click feeling can be obtained.
Even if the light guide sheet for illuminating the key top is superimposed and arranged on the front surface side of the key switch module substrate, the projecting portion will not be buried in the light guide sheet as when the projecting portion is arranged on the front surface side of the base material sheet, and thus the effect of improving the click feeling does not lower even if the light guide sheet is superimposed.
Furthermore, according to the key switch module substrate of the present invention, the projecting portion for pushing the contact spring is formed using the pressure sensitive adhesive layer (or adhesive layer) formed at the back surface of the base material sheet from the prior art, and thus an additional component is not required to improve the click feeling in time of switch operation. As a result, the thickness of the key switch module substrate does not become thicker even if the click feeling is improved, the key switch module substrate can be thinned, the manufacturing step of the key switch module substrate does not increase, and the cost does not rise. In addition, the projecting portion barely has the possibility of dropping since the projecting portion is a layer of pressure sensitive adhesive or adhesive.
In one embodiment of the key switch module substrate according to the present invention, part of the pressure sensitive adhesive or the adhesive applied to the outer side of the peripheral region is made to adhere to an outer peripheral portion of the contact spring, and some or all of the remaining portions are made to adhere to the substrate. According to such an embodiment, part of the pressure sensitive adhesive or the adhesive adhered to the substrate is made to adhere to the outer peripheral portion of the contact spring, and thus the contact spring is less likely to shift and move or is less likely to rise, and the position of the contact spring stabilizes.
In another embodiment of the key switch module substrate according to the present invention, a key switch sheet is fabricated in which the contact spring is fixed to the base material sheet by making the apex portion of the contact spring to adhere to the back surface of the base material sheet by the pressure sensitive adhesive or the adhesive, and a back surface of the key switch sheet is made to adhere to the substrate by the pressure sensitive adhesive or the adhesive to sandwich the contact spring between the substrate and the base material sheet. According to such an embodiment, the contact spring can be easily installed on the substrate by sandwiching the contact spring between the substrate and the base material sheet by attaching the key switch sheet attached with the contact spring in advance to the substrate.
In still another embodiment of the key switch module substrate according to the present invention, the thickness of the pressure sensitive adhesive or the adhesive formed at the region to be made to adhere to the apex portion of the contact spring is preferably greater than or equal to 0.1 mm and smaller than or equal to 0.2 mm. The click feeling degrades if the thickness of the pressure sensitive adhesive layer is thinner than 0.1 mm, and the thinning of the key switch module substrate, and the like is inhibited if thicker than 0.2 mm.
In yet another embodiment of the key switch module substrate according to the present invention, a diameter of the region to be made to adhere to the apex portion of the contact spring is preferably smaller than or equal to 0.5 times a diameter of the contact spring. The click feeling degrades if the diameter of the region to be made to adhere to the apex portion of the contact spring is greater than 0.5 times the diameter of the contact spring.
In accordance with still another aspect of the present invention, a second key switch sheet according to the present invention relates to a key switch sheet having a pressure sensitive adhesive layer for holding a contact spring by adhering to an apex portion of the dome-shaped contact spring at a back surface of a base material sheet; wherein a region in which the pressure sensitive adhesive layer does not exist is formed at the periphery of the pressure sensitive adhesive layer formed at the region to be made to adhere to the apex portion of the contact spring, and the pressure sensitive adhesive layer is formed at a region further on the outer side of the region in which the pressure sensitive adhesive does not exist; and the pressure sensitive adhesive layer formed at the region to be made to adhere to the apex portion of the contact spring and the pressure sensitive adhesive layer formed at the region on the outer side of the region in which the pressure sensitive adhesive layer does not exist are of same material.
The second key switch sheet of the present invention has the same configuration as the first key switch sheet of the present invention, and thus has effects similar to the first key switch. In other words, according to the second key switch, the contact spring can be pushed with the projecting portion formed by the pressure sensitive adhesive layer, and satisfactory click feeling can be obtained in time of switch operation. Furthermore, the effect of improving the click feeling is less likely to lower even if the light guide sheet is superimposed on the front surface side of the second key switch sheet. Moreover, an additional component is not required to improve the click feeling in time of switch operation, and thus the thickness of the key switch module substrate and the key switch module does not become thicker, the key switch module substrate and the key switch module can be thinned, the manufacturing step of the key switch module substrate, and the like does not increase, and the cost does not rise. In addition, the projecting portion barely has the possibility of dropping since the projecting portion is a pressure sensitive adhesive layer.
In addition, the pressure sensitive adhesive layer does not exist at the periphery of the projecting portion in the second key switch sheet of the present invention, and thus the outer peripheral portion of the apex portion of the contact spring does not adhere to the base material sheet, the outer peripheral portion of the contact spring does not stick to the base material sheet thereby inhibiting deformation, and the click feeling in time of switch operation becomes more satisfactory. Furthermore, since the pressure sensitive adhesive is formed in the region further on the outer side of the region in which the pressure sensitive adhesive layer does not exist, the second key switch sheet can be made to adhere to the substrate arranged with the fixed contact by such a pressure sensitive adhesive layer. The pressure sensitive adhesive formed in the region to be made to adhere to the apex portion of the contact spring and the pressure sensitive adhesive formed in the region on the outer side of the region in which the pressure sensitive adhesive does not exist are of the same material, and thus the cost of the pressure sensitive adhesive layer is inexpensive, and the pressure sensitive adhesive layer on the inner side and the pressure sensitive adhesive layer on the outer side of the region in which the pressure sensitive adhesive layer does not exist can be formed in one step.
In one embodiment of the second key switch sheet according to the present invention, the apex portion of the contact spring is made to adhere to the pressure sensitive adhesive layer for holding the contact spring to hold the contact spring. According to such an embodiment, the key switch module substrate is easy to handle in assembly since the contact spring is attached to the key switch sheet in advance. In particular, when the plurality of contact springs are used, the task of attaching the contact spring to the pressure sensitive adhesive layer one by one is omitted, and the assembly of the key switch module substrate is facilitated.
In another embodiment of the second key switch sheet according to the present invention, the pressure sensitive adhesive layer formed at the back surface of the base material sheet has an even thickness regardless of the formed position. According to such an embodiment, the base material sheet lies along the front surface of the contact spring when the base material sheet is attached to the substrate from above the contact spring, and thus the key switch sheet holding the contact spring can be attached to the substrate more easily, and the contact spring can be more easily pushed.
In still another embodiment of the second key switch according to the present invention, a thickness of the pressure sensitive adhesive layer formed at the region to be made to adhere to the apex portion of the contact spring is thicker than a thickness of the pressure sensitive adhesive layer formed at the region on the outer side of the region in which the pressure sensitive adhesive does not exist. According to such an embodiment, the contact spring is more easily made to adhere since the projecting length of the pressure sensitive adhesive layer formed at the region to be made to adhere to the apex portion of the contact spring becomes long.
In the second key switch sheet according to the present invention, the thickness of the pressure sensitive adhesive layer formed at the region to be made to adhere to the apex portion of the contact spring is preferably greater than or equal to 0.1 mm and smaller than or equal to 0.2 mm. The click feeling degrades if the thickness of the pressure sensitive adhesive layer is thinner than 0.1 mm, and the thinning of the key switch module substrate, and the like is inhibited if thicker than 0.2 mm.
In the second key switch sheet according to the present invention, a diameter of the region to be made to adhere to the apex portion of the contact spring is preferably smaller than or equal to 0.5 times a diameter of the contact spring. The click feeling degrades if the diameter of the region to be made to adhere to the apex portion of the contact spring is greater than 0.5 times the diameter of the contact spring.
In yet another embodiment of the second key switch sheet according to the present invention, the pressure sensitive adhesive layer formed at the back surface of the base material sheet is a two-sided pressure sensitive adhesive tape having one pressure sensitive adhering surface adhered to the base material sheet. According to such an embodiment, the pressure sensitive adhesive layer can be easily formed by making one surface of the two-sided pressure sensitive adhesive tape to adhere to the base material sheet.
In yet another embodiment of the second key switch sheet according to the present invention, the base material sheet is a reflecting sheet having a surface reflectivity of greater than or equal to 70%. According to such an embodiment, if the light guide sheet is arranged on the front surface side of the key switch sheet, the light leaked from the back surface side of the light guide sheet is reflected by the base material sheet to re-enter the light guide sheet, thereby enhancing the usage efficiency of the light in the light guide sheet. The surface reflectivity of the base material sheet is preferably greater than or equal to 70% as the re-usage efficiency of the light leaked from the light guide sheet lowers if smaller than 70%.
In yet another embodiment of the second key switch sheet according to the present invention, the base material sheet is a light guide sheet for illuminating a key top. According to such an embodiment, the key top can be illuminated from the back surface side by introducing light to the base material sheet (light guide sheet). Furthermore, the key switch module can be thinned and the cost can be reduced compared to when the light guide sheet is separately arranged.
In accordance with yet another aspect of the present invention, a key switch module according to the present invention relates to a key switch module including the key switch module substrate of the present invention; and a key top arranged on a front surface side of the key switch module substrate; wherein the key top is arranged with, in correspondence to the position of the contact spring, a push-button for switch operating by pushing down the contact spring from the outside.
The key switch module according to the present invention has effects of the key switch module substrate of the present invention, and in particular, obtains satisfactory click feeling. Furthermore, the switch operation can be performed by pushing a push-button since the push-button of the key top is arranged on the front surface, and thus the key switch module excels in operability.
In one embodiment of the key switch module according to the present invention, a light guide sheet for illuminating the key top from a back surface side is arranged between the key top and the key switch module substrate. According to such an embodiment, the key top can be illuminated from the back surface side, and thus the push-button will not be mistakenly operated even when used in dark places. Moreover, the projecting portion will not be buried in the light guide sheet as when the projecting portion is arranged on the front surface side of the base material sheet, and thus the effect of improving the click feeling is less likely to lower even if the light guide sheet is superimposed.
In another embodiment of the key switch module according to the present invention, a pusher made of a pressure sensitive adhesive is arranged at a back surface of the push-button so as to project from the back surface, the pusher being adhered to a member facing a rear surface of the key top at a position corresponding to the apex portion of the contact spring. According to such an embodiment, the click feeling of the key switch module improves since the pusher is arranged on the push-button. The pusher for pushing the contact spring and the pressure adhesive layer for fixing the push-button are configured by the same member since the pusher is formed by the pressure sensitive adhesive, and thus the key switch module can be further thinned and the cost can be lowered.
The means for solving the problems in the present invention have features appropriately combining the above-described components, where the present invention encompasses great number of variations that can be contrived from the combination of such components.
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
A key switch module substrate according to a first embodiment of the present invention will be described below with reference to
The key switch module substrate 11 according to the first embodiment includes a printed wiring substrate 13 (substrate) including a flexible print substrate, a contact spring 14, and the fixing sheet 12. As shown in
The contact spring 14 is formed to a raised dome-shape from a metal material having conductivity and elasticity, in particular, from a stainless material, where the back surface side is depressed to a bowl shape. The diameter of the contact spring 14 is larger than the inner diameter of the second contact portion 15b and smaller than the outer diameter of the second contact portion 15b.
The fixing sheet 12 is a pressure sensitive adhesive layer formed by applying a pressure sensitive adhesive to an even thickness on the back surface of a base material sheet 17 made from a thin and flexible resin sheet. As shown in
As shown in
In the key switch module substrate 11 having the structure of
In the key switch module substrate 11, the projecting portion 18a has a function of positioning and fixing the contact spring 14 by adhering to the apex portion of the contact spring 14, and a function serving as a projecting portion of pushing the contact spring 14. That is, in the key switch module substrate 11, the contact spring 14 can be pushed by the projecting portion 18a arranged on the fixing sheet 12, and thus a click feeling when the key switch module substrate 11 is operated becomes satisfactory. Furthermore, the base material sheet 17 is not sandwiched between the projecting portion that pushes the contact spring 14 and the contact spring 14 as in Patent Document 1, and the projecting portion 18a directly contacts the apex portion of the contact spring 14, and thus the click feeling when pushed becomes satisfactory.
A manufacturing method of the key switch module substrate 11 will now be described.
The pressure sensitive adhesive 21 may be transferred only at the transfer portion 24 by forming bumps on the surface of the transfer roller 22 through a gravure printing method, a relief printing method, and the like.
As a method of fabricating the fixing sheet 12 by applying the pressure sensitive adhesive on the base material sheet 17, methods such as knife coater, die coater, gravure printing, relief printing, and the like may be used other than the above. The projecting portion 18a and the substrate pressure sensitive adhesive layer 18b are desirably made from the same material since the projecting portion 18a and the substrate pressure sensitive adhesive layer 18b can be formed with one application step if the pressure sensitive adhesive of the projecting portion 18a and the pressure sensitive adhesive of the substrate pressure sensitive adhesive layer 18b are of the same material.
After the fixing sheet 12 is fabricated through one of the above methods, the apex portion of the contact spring 14 is first made to adhere to each projecting portion 18a of the fixing sheet 12 to fix the contact spring 14 to the fixing sheet 12, as shown in
The fixing sheet 12 is then superimposed on the printed wiring substrate 13 while aligning each contact spring 14 above each second contact portion 15b, and the substrate pressure sensitive adhesive layer 18b is made to adhere to the front surface of the printed wiring substrate 13 to integrate the fixing sheet 12 and the printed wiring substrate 13, thereby obtaining the key switch module substrate 11 as shown in
In the key switch module substrate 11 according to the present embodiment, the pressure sensitive adhesive layer adhered to the apex portion of the contact spring 14 configures the projecting portion 18a, and thus the contact spring 14 is pushed by the projecting portion 18a when the portion of the contact spring 14 is pushed from above the fixing sheet 12, whereby the click feeling in time of switch operation improves. In other words, since the contact spring 14 is pushed with the projecting portion 18a smaller than the contact spring 14, the force of pushing the contact spring 14 is concentrated at the apex portion of the contact spring 14, whereby the contact spring 14 easily deforms and the click feeling improves. Furthermore, a more satisfactory click feeling can be obtained since the projecting portion 18a is arranged on the back surface side of the fixing sheet 12 and directly contacts the contact spring 14. That is, if a projecting portion 33 is arranged on the front surface side of the fixing sheet 12 as in
When a flexible light guide sheet 32 for key top illumination is superimposed and arranged on the front surface side of the fixing sheet 12 (see fourth embodiment), the front surface of the light guide sheet 32 may elastically deform by the projecting portion 33 or the projecting portion 33 may be buried in the light guide sheet 32 if the projecting portion 33 is arranged on the front surface side of the fixing sheet 12 as in
Furthermore, according to the key switch module substrate 11 of the present embodiment, the projecting portion 18a is formed using the pressure sensitive adhesive layer formed at the back surface of the base material sheet 17 from the prior art, and thus an additional component is not required to improve the click feeling in time of switch operation. Therefore, the thickness of the key switch module substrate 11 does not become thicker even if the click feeling is improved, and the key switch module substrate 11 can be thinned. Moreover, the manufacturing step of the key switch module substrate 11 does not increase, and increase in cost is less likely to occur. In addition, an advantage in that the projecting portion barely has the possibility of dropping is obtained since the projecting portion 18a is a pressure sensitive adhesive layer.
As a method of differing the thickness of the projecting portion 18a and the thickness of the substrate pressure sensitive adhesive layer 18b, for example, the height of the ridge or the depth of the valley is differed between the surface for applying the projecting portion 18a and the surface for applying the substrate pressure sensitive adhesive layer 18b when forming bumps on the transfer roller 22 with the roll coater method as shown in
When using the transfer roller 22 with bumps through the roll coater method, the pressure sensitive adhesive may also attach to the non-adhering surface 19 thereby forming a pressure sensitive adhesive layer 18c, as shown partially enlarged in
In the key switch module substrate 34 of the second embodiment, the thickness of the projecting portion 18a is thicker than the thickness of the substrate pressure sensitive adhesive layer 18b, and thus the apex portion of the contact spring 14 is more easily pushed by the projecting portion 18a, and the contact spring 14 is easily made to adhere in time of assembly.
The result of measuring the click rate using the samples of the key switch module substrate 34 of the second embodiment and the comparative example (prior art example) will now be described.
The click rate was measured in the following manner. A large load was gradually applied to the location immediately above the contact spring 14 in each sample, and the displacement of the apex portion of the contact spring 14 then was measured, where an F-S curve shown in
Click rate[%]=100×(F1−F2)/F1
The feeling in time of clicking becomes more satisfactory the larger the value of the click rate.
The click rate (actual usage reference) at which practicality as the key switch module is accepted is slightly over 30%, and thus practicality is barely accepted at the click rate of 32% in the sample of
The diameter of the projecting portion 18a and the thicknesses of the projecting portion 18a and the substrate pressure sensitive adhesive layer 18b were variously changed in the key switch module substrate 34 in the second embodiment, and the relationship between the thickness of the pressure sensitive adhesive layer and the click rate was reviewed. Tables 1 to 3 show the measurement results.
The common conditions of the samples used in the measurement are that the base material sheet 17 made from a reflecting sheet having a thickness of 38 μm and the contact spring 14 having a diameter of 4 mm are used, and the projecting portion 18a and the substrate pressure sensitive adhesive layer 18b are formed using the two-sided pressure sensitive adhesive tape. The diameter of the projecting portion 18a, the thickness of the projecting portion 18a (T1), and the thickness of the substrate pressure sensitive adhesive layer 18b (T2) were changed, and the click rate was measured by a load cell. The load cell used is the load cell manufactured by Aikoh Engineering Co., Ltd.
Table 1 shows a case in which the diameter of the projecting portion 18a is 1 mm, where the column of T1 in Table 1 shows the thickness [mm] of the projecting portion 18a, T2 shows the thickness [mm] of the substrate pressure sensitive adhesive layer 18b, and the value [%] of the click rate shows a case when the light guide sheet is not present and a case when the light guide sheet is superimposed on the front surface.
According to Table 1, if the thickness of the projecting portion 18a is thinner than the thickness of the substrate pressure sensitive adhesive layer 18b, the click rate is 34.0% when the light guide sheet is not present, which is a value close to the click rate (32%) of the prior art example. The click rate becomes 11.2% when the light guide sheet is superimposed, which is worse than the click rate (25%) of the prior art example. If the thickness of the projecting portion 18a is greater than the thickness of the substrate pressure sensitive adhesive layer 18b, on the other hand, the click rate is 49.0% when the light guide sheet is not present and 44.8% when the light guide sheet is superimposed, and thus highest click rate is obtained in either case. Furthermore, satisfactory click rate was obtained irrespective of the presence of the light guide sheet even if the thickness of the projecting portion 18a is equal to the thickness of the substrate pressure sensitive adhesive layer 18b.
Table 2 shows a case in which the diameter of the projecting portion 18a is 2 mm.
Comparing Table 2 and Table 1, the click rate is slightly lower when the diameter of the projecting portion 18a is 2 mm than when the diameter is 1 mm. This is because enhancement of the click rate of the contact spring 14 depends on how to push “only the apex portion” of the contacting spring 14. However, in the case of Table 2 as well, satisfactory click rate is obtained for when the light guide sheet is not present and for when the light guide sheet is superimposed except when the thickness of the projecting portion 18a is thinner than the thickness of the substrate pressure sensitive adhesive layer 18b.
Table 3 shows a case in which the diameter of the projecting portion 18a is 3 mm.
According to Table 3, the click rate is greatly lowered in all cases, and thus does not have superiority compared to the prior art example. The click rate is more satisfactory than the prior art example only when the thicknesses of the projecting portion 18a and the substrate pressure sensitive adhesive layer 18b are both 0.1 mm, and the light guide sheet is present.
It is apparent that the diameter of the projecting portion 18a is preferably smaller than or equal to 0.5 times (=2 mm/4 mm) the diameter of the contact spring 14 from the results of Table 1 to Table 3, but the diameter of the projecting portion 18a is desirably as small as possible within an extent of holding the contact spring 14. The click rate lowers when the thickness of the projecting portion 18a is thinner than the substrate pressure sensitive adhesive layer 18b, and thus the thickness of the projecting portion 18a needs to be equal to the thickness of the substrate pressure sensitive adhesive layer 18b, or the thickness of the projecting portion 18a needs to be thicker than the thickness of the substrate pressure sensitive adhesive layer 18b. The thickness of the projecting portion 18a is preferably greater than or equal to 0.1 mm and smaller than or equal to 0.2 mm.
According to this embodiment, the contact spring 14 is less likely to shift and move when pushed down, or the contact spring 14 is less likely to rise since the inner peripheral portion of the substrate pressure sensitive adhesive layer 18b adhered to the printed wiring substrate 13 is made to adhere to the bottom portion of the contact spring 14.
When the light source 47 is caused to emit light, the light exited from the light source 47 enters the light guide sheet 32 from the opposing side surface, and is guided through the light guide sheet 32. The light guided through the light guide sheet 32 is diffusely reflected by the diffusion pattern in the middle, where one part exits from the front surface of the light guide sheet 32 thereby causing the front surface of the light guide sheet 32 to emit light. In the diffusion pattern, the number (pattern density) per unit area of the microscopic pattern of recessed-form or projected-form increases as the distance from the light source 47 becomes larger so that the entire front surface of the light guide sheet 32 is caused to emit light at substantially uniform luminance. The entire key top 43 is illuminated from the rear surface side by the light guide sheet 32, so that the key operation will not be mistaken even when used in dark places.
The reflecting sheet 42 has a function of reflecting the light leaked from the back surface of the light guide sheet 32 to re-enter the light guide sheet 32 from the back surface, thereby enhancing the usage efficiency of the light in the light guide sheet 32 and brightening the illumination.
In this case, if the area of the pusher 46 is greater than the area of the projecting portion 18a, the area of the pusher 46 directly contacting the light guide sheet 32 is increased, and the area of the projecting portion 18a not directly contacting the light guide sheet 32 but directly contacting the contact spring 14 is reduced. Thus, the pusher 46 is less likely to bend the front surface of the light guide sheet 32 and be buried in the light guide sheet 32, and furthermore, the apex portion of the contact spring 14 can be pushed with the force of pushing the key 44 concentrated at the small projecting portion 18a, whereby the click feeling becomes satisfactory.
A reflecting sheet having a surface reflectivity of greater than or equal to 70% is used for the base material sheet 17 since the reflecting sheet 42 is omitted. The reflecting sheet may be a white sheet for diffusely reflecting the light, or may be a mirror sheet for mirror reflecting the light. The reflecting sheet of too high reflectivity leads to high cost, and thus the reflecting sheet having a reflectivity of slightly higher than 70% is desirable. Since the base material sheet 17 has high reflectivity, the light leaked from the back surface of the light guide sheet 32 is reflected by the fixing sheet 12 to re-enter the light guide sheet 32. That is, the light usage efficiency of the light guide sheet 32 does not lower even if the reflecting sheet 42 is omitted.
In such key switch module 61, the light guide sheet 32 is used for the base material sheet 17 of the fixing sheet 12, and the light source 47 is arranged facing the side surface of the fixing sheet 12 (the fixing sheet 12 may be omitted, and the projecting portion 18a and the substrate pressure sensitive adhesive layer 18b may be arranged on the back surface of the light guide sheet 32). Thus, the key 44 can be illuminated from the back surface side by the base material sheet 17 in the key switch module 61.
Although not shown, a figure of the key may be drawn on the front surface of the key sheet 45 instead of arranging the key 44, as another further variant.
In each embodiment described above, the fixing sheet is made to adhere to the contact spring or the printed wiring substrate by an adhesive (pressure sensitive adhesive), but problems will not arise even if an adhesive is used instead of the pressure sensitive adhesive. For instance, ultraviolet curing adhesive may be applied to the back surface of the transparent base material sheet 17 to form the projecting portion 18a and the substrate pressure sensitive adhesive (adhesive layer) 18b, and thereafter, the substrate may be irradiated with ultraviolet ray to cure the adhesive after superimposing the contact spring and the fixing sheet 12 on the substrate. Soft adhesive is desirably used when using adhesive with respect to the flexible printed wiring substrate 13. However, manufacturing is easier if the pressure sensitive adhesive is used since the pressure sensitive adhesive does not need to be cured as with the adhesive.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2008-085763 | Mar 2008 | JP | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 6593537 | Teruyama et al. | Jul 2003 | B2 |
| 6595653 | Saito et al. | Jul 2003 | B2 |
| 7399937 | Nishimura | Jul 2008 | B2 |
| Number | Date | Country |
|---|---|---|
| 2004-055389 | Feb 2004 | JP |
| 2007-287347 | Nov 2007 | JP |
| Number | Date | Country | |
|---|---|---|---|
| 20090242374 A1 | Oct 2009 | US |
