This application claims the priority benefit of Chinese Patent Application Serial Number CN202010307333.4, filed on Apr. 17, 2020, the full disclosure of which is incorporated herein by reference.
The present disclosure relates to the technical field of keyboard and keyboard manufacturing, particularly to a keyboard and a method for assembling the keyboard.
Conventional computer keyboards are mostly assembled by hot-melting, screwing, or riveting in which the screw assembling often brings problems such as poor screwing, stripping, and short circuit caused by loosening screws which fall into computer since the method requires a large number of well-built screws, and precise operated assembling tools with well trained personnel.
The embodiments of the present disclosure provide a keyboard assembling method to solve the problems from screwing keyboard parts by connecting materials and parts without a screw.
Firstly, the present disclosure provides a method for assembling keyboard, comprising: disposing a keyboard frame on a keyswitch module, wherein a plurality of keyswitches passes through the plurality of keyswitch holes correspondingly; forming a plurality of connecting parts respectively in the corresponding connecting holes, wherein the connecting part bonds to a surface of the keyboard frame close to a circuit board through a through hole.
Secondly, the present disclosure provides a keyboard comprising a keyswitch module, a keyboard frame, and a plurality of connecting parts. The keyswitch module comprises a baseplate, a circuit board, and a plurality of keyswitch groups. The circuit board is disposed on the baseplate. The plurality of the keyswitch groups is disposed on the circuit board. The baseplate comprises a plurality of connecting holes. The circuit board comprises a plurality of through holes. The plurality of connecting holes respectively corresponds to the plurality of through holes. The keyboard frame is disposed on the keyswitch module, comprising a plurality of keyswitch holes. The plurality of the keyswitch groups is respectively disposed in the corresponding keyswitch holes. The plurality of connecting parts is respectively filled in the corresponding connecting holes, connecting to a surface of the keyboard frame close to the circuit board through the corresponding through holes.
In the embodiments of the present disclosure, the baseplate and the covering plate can be easily assembled by bonding materials without screwing, thus the assembling problems such as poor screwing, stripping, and short circuit caused by loosening screws falling into the computer can be avoided.
It should be understood, however, that this summary may not contain all aspects and embodiments of the present disclosure, that this summary is not meant to be limiting or restrictive in any manner, and that the disclosure as disclosed herein will be understood by one of ordinary skill in the art to encompass obvious improvements and modifications thereto.
The features of the exemplary embodiments believed to be novel and the elements and/or the steps characteristic of the exemplary embodiments are set forth with particularity in the appended claims. The Figures are for illustration purposes only and are not drawn to scale. The exemplary embodiments, both as to organization and method of operation, may best be understood by reference to the detailed description which follows taken in conjunction with the accompanying drawings in which:
The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the disclosure are shown. This present disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.
Certain terms are used throughout the description and following claims to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This document does not intend to distinguish between components that differ in name but function. In the following description and in the claims, the terms “include/including” and “comprise/comprising” are used in an open-ended fashion, and thus should be interpreted as “including but not limited to”. “Substantial/substantially” means, within an acceptable error range, the person skilled in the art may solve the technical problem in a certain error range to achieve the basic technical effect.
The following description is of the best-contemplated mode of carrying out the disclosure. This description is made for the purpose of illustration of the general principles of the disclosure and should not be taken in a limiting sense. The scope of the disclosure is best determined by reference to the appended claims.
Moreover, the terms “include”, “contain”, and any variation thereof are intended to cover a non-exclusive inclusion. Therefore, a process, method, object, or device that includes a series of elements not only includes these elements, but also includes other elements not specified expressly, or may include inherent elements of the process, method, object, or device. If no more limitations are made, an element limited by “include a/an” does not exclude other same elements existing in the process, the method, the article, or the device which includes the element.
In the following embodiment, the same reference numerals are used to refer to the same or similar elements throughout the disclosure.
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In this embodiment, the step of filling the bonding colloid M into the connecting hole 11 and the following attaching to the keyboard frame 40 comprises the continuous filling the bonding colloid M followed by exposing the bonding colloid M out of the surface of the baseplate 10. The diameter of a part of the bonding colloid M exposed on the surface of the baseplate 10 is greater than the diameter of the connecting hole 11. In this way, after the bonding colloid M is hardened, it forms an enlarged head part outside the connecting hole 11 and is gluing attached to the surface of the baseplate 10.
In this embodiment, at specific positions on two opposite surfaces of the baseplate 10 corresponding to the connecting holes 11, a separating bump 12 is formed on one surface, and a positioning groove 13 is formed on the other surface. In this embodiment, the separating bump 12 is circular, and each connecting hole 11 is circular. The center of each connecting hole 11 coincides with the center of each separating bump 12. The diameter of the through hole 31 of the circuit board 30 is larger than the diameter of the separating bump 12 of the baseplate 10 so that the through hole 31 of the circuit board 30 can be sleeved on the separating bump 12 of the baseplate 10 to play a role of positioning when the circuit board 30 is disposed on the baseplate 10. On the other hand, when filling the bonding colloid M to the first surface 42 of the keyboard frame 40 from the connecting hole 11 of the baseplate 10, the separating bump 12 could separate the bonding colloid M to prevent the bonding colloid M from adhering to the circuit board 30. The separating bump 12 abuts against the first surface 42 of the keyboard frame 40. When the bonding colloid M is filled into the connecting hole 11, the positioning groove 13 on the other surface of the baseplate 10 can also be filled with the bonding colloid M so that the connecting part C formed by curing the bonding colloid M can also be filled into the positioning groove 13. The diameter of the positioning groove 13 is greater than the diameter of the connecting hole 11 so that the bonding colloid M can form an enlarged head part as mentioned above at the outer end of the connecting hole 11 after being hardened.
The diameter of the connecting groove 44 could be identical to, larger, or smaller than the diameter of the connecting hole 11. The depth of the connecting groove 44 can be configured appropriately so that the bonding colloid M filled in the connecting groove 44 could harden to generate sufficient bonding force.
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In summary, embodiments of the present disclosure provide a keyboard assembling method in which the baseplate and the covering plate can be easily assembled by bonding materials without screwing, thus the assembling problems such as poor screwing, stripping, and short circuit caused by loosening screws falling into the computer can be avoided. By filling the connecting groove of the keyboard frame and the accommodating space between the keyboard frame and the baseplate with bonding colloid, and by the forming of the enlarged head part on the outside of the baseplate, the bonding force between the baseplate and the keyboard frame can be increased to perform a solid joint effect which is equal to or better than screwing joint.
It is to be understood that the term “comprises”, “comprising”, or any other variants thereof, is intended to encompass a non-exclusive inclusion, such that a process, method, article, or device of a series of elements not only comprise those elements but also comprises other elements that are not explicitly listed, or elements that are inherent to such a process, method, article, or device. An element defined by the phrase “comprising a . . . ” does not exclude the presence of the same element in the process, method, article, or device that comprises the element.
Although the present disclosure has been explained in relation to its preferred embodiment, it does not intend to limit the present disclosure. It will be apparent to those skilled in the art having regard to this present disclosure that other modifications of the exemplary embodiments beyond those embodiments specifically described here may be made without departing from the spirit of the disclosure. Accordingly, such modifications are considered within the scope of the disclosure as limited solely by the appended claims.
Number | Name | Date | Kind |
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20140218890 | Wang | Aug 2014 | A1 |