LAMINATED CERAMIC ELECTRONIC COMPONENT

Abstract

A laminated ceramic electronic component has a plurality of conductive layers embedded in a ceramic substrate. The laminated ceramic electronic component includes: a functional area composed of the plurality of conductive layers and ceramic layers interposed therebetween; and a protective area formed around the functional area to have a ring-like cross section. The laminated ceramic electronic component satisfies the following condition:

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a laminated ceramic capacitor according to one embodiment of the present invention;

FIG. 2 is a sectional view taken along line II-II of FIG. 1;

FIG. 3 is a sectional view taken along line III-III of FIG. 1;

FIG. 4 is a schematic diagram showing a process of forming a ceramic green sheet to be used for a functional area; and

FIG. 5 is a schematic diagram showing a state where ceramic green sheets are stacked in a process of manufacturing a laminated ceramic capacitor according to one embodiment of the present invention.

Claims

1. A laminated ceramic electronic component having a plurality of conductive layers embedded in a ceramic substrate, comprising: a functional area composed of said plurality of conductive layers and ceramic layers interposed therebetween; anda protective area formed around said functional area to have a ring-like cross section, andsatisfying the following condition: 0<t/Wg≦0.80,where t represents a wall thickness of said protective area in a vertical direction, and Wg represents a wall thickness of said protective area in a transverse direction.

2. The laminated ceramic electronic component of claim 1, further satisfying the following condition: 0<t/Wg≦0.57.

3. The laminated ceramic electronic component of claim 1, further satisfying the following condition: 0.24≦(2Wg/W)≦0.6,where W represents an overall width of said protective area in said transverse direction.