Claims
- 1. A socket comprising:
a conductive power panel; a conductive ground panel; a thin non-conductive layer interposed between the power panel and ground panel; a socket body encompassing the power panel, ground panel, and non-conductive layer; a plurality of conductive fingers extending from the power panel; and a plurality of conductive fingers extending from the ground panel, the conductive fingers of the ground panel extending in the same direction as the conductive fingers of the power panel to engage segments of a power bar on an integrated circuit package.
- 2. The socket of claim 1, wherein the non-conductive layer comprises a polymer based non-conductive adhesive.
- 3. The socket of claim 2, wherein the non-conductive layer is 2-4 mils thick.
- 4. The socket of claim 2, wherein the power panel and ground panel are bound together by the polymer based non-conductive adhesive.
- 5. The socket of claim 1, wherein the power panel and ground panel are parallel.
- 6. The socket of claim 1, wherein the fingers of the power panel pass over and between the fingers of the ground panel.
- 7. The socket of claim 1, wherein the fingers of the ground panel pass over and between the fingers of the power panel.
- 8. The socket of claim 1, further comprising a plurality of conductive pin receptacles in the socket body.
- 9. A socket comprising:
a conductive power panel; a conductive ground panel; a thin non-conductive layer interposed between the power panel and the ground panel; a socket body encompassing the power panel, ground panel, and non-conductive layer; and a conductive finger extending from each of the power panel and the ground panel in the same direction and positioned to engage side terminals on an integrated circuit package each successive side terminal alternately to conduct power and ground.
- 10. The socket of claim 9, wherein the non-conductive layer comprises a polymer based non-conductive adhesive.
- 11. The socket of claim 10, wherein the non-conductive layer is 2-4 mils thick.
- 12. The socket of claim 10, wherein the power panel and the ground panel are bound together by the polymer based non-conductive adhesive.
- 13. The socket of claim 9, further comprising a plurality of conductive pin receptacles in the socket body.
- 14. An apparatus comprising:
a printed circuit board; and a socket mounted on the printed circuit board, the socket comprising a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel, a socket body encompassing the power panel, ground panel, and non-conductive layer, a plurality of conductive fingers extending from the power panel, and a plurality of conductive fingers extending from the ground panel, the conductive fingers of the ground panel extending in the same direction as the conductive fingers of the power panel to engage segments of a power bar on an integrated circuit package.
- 15. The apparatus of claim 14, wherein the non-conductive layer comprises a polymer based non-conductive adhesive.
- 16. The apparatus of claim 15, wherein the non-conductive layer is 2-4 mils thick.
- 17. The apparatus of claim 15, wherein the power panel and ground panel are bound together by the polymer based non-conductive adhesive.
- 18. The apparatus of claim 14, wherein the power panel and the ground panel are parallel.
- 19. The apparatus of claim 14, wherein the finger of the power panel pass over the ground panel and between the fingers of the ground panel.
- 20. The apparatus of claim 14, wherein the fingers of the ground panel pass over the power panel and between the fingers of the power panel.
- 21. The apparatus of claim 14, further comprising a plurality of conductive pin receptacles in the socket body.
- 22. An apparatus comprising:
a printed circuit board; and a socket mounted on the printed circuit board, the socket comprising a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and the ground panel, a socket body encompassing the power panel, ground panel, and non-conductive layer, and a conductive finger extending from each of the power panel and the ground panel in the same direction and positioned to engage side terminals on an integrated circuit package each successive side terminal alternately to conduct power and ground.
- 23. The apparatus of claim 22, wherein the non-conductive material comprises a polymer based non-conductive adhesive.
- 24. The apparatus of claim 23, wherein the non-conductive material is 2-4 mils thick.
- 25. The apparatus of claim 23, wherein the power panel and ground panel are bound together by the polymer based non-conductive adhesive.
- 26. The apparatus of claim 22, further comprising a plurality of conductive pin receptacles in the socket body.
RELATED APPLICATIONS
[0001] This divisional patent application claims priority to non-provisional patent application Ser. No. 10/082,881 entitled Laminated Socket Contacts, filed on Feb. 26, 2002.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10082881 |
Feb 2002 |
US |
Child |
10325213 |
Dec 2002 |
US |