with built-in components

Industry

CPC
H05K7/1092

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/1092with built-in components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly including cable modules
- Patent number 12,089,357
- Issue date Sep 10, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket connector having array of socket contacts
- Patent number 11,777,244
- Issue date Oct 3, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Brian Patrick Costello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket alignment and retention system
- Patent number 11,503,732
- Issue date Nov 15, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- Brian Patrick Costello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including cable modules
- Patent number 11,477,904
- Issue date Oct 18, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for mounting a DUT on a test board without use...
- Patent number 11,350,525
- Issue date May 31, 2022
- Nuvoton Technology Corporation
- Simon Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery module for an electronic package
- Patent number 11,129,290
- Issue date Sep 21, 2021
- TE CONNECTIVITY SERVICES GMBH
- Brian Patrick Costello
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ethernet connector with electromagnetic filtering
- Patent number 10,581,208
- Issue date Mar 3, 2020
- EQUIPEMENT ELECTROLINE INC.
- Martin Dupuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First socket nested in a second socket
- Patent number 10,440,849
- Issue date Oct 8, 2019
- Hewlett Packard Enterprise Development LP
- Kevin B. Leigh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat spreader for an electrical connector assembly
- Patent number 10,178,804
- Issue date Jan 8, 2019
- TE Connectivity Corporation
- Alex Michael Sharf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-stage power delivery architecture
- Patent number 10,039,188
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket with routed contacts
- Patent number 9,768,536
- Issue date Sep 19, 2017
- Hewlett Packard Enterprise Development LP
- Kevin Leigh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly with holding member
- Patent number 9,730,351
- Issue date Aug 8, 2017
- FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Shuo-Hsiu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-array bottom-side connector using spring bias
- Patent number 9,490,560
- Issue date Nov 8, 2016
- Intel Corporation
- Gaurav Chawla
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Socket package including integrataed capacitors
- Patent number 9,426,918
- Issue date Aug 23, 2016
- Oracle America, Inc.
- Ashur S. Bet-Shliemoun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket with routed contacts
- Patent number 9,306,302
- Issue date Apr 5, 2016
- Hewlett Packard Enterprise Development LP
- Kevin B. Leigh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices mounted on multiple substrates
- Patent number 9,204,548
- Issue date Dec 1, 2015
- Cisco Technology, Inc.
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance surface mount electrical interconnect with externa...
- Patent number 9,196,980
- Issue date Nov 24, 2015
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-stage power delivery architecture
- Patent number 9,101,068
- Issue date Aug 4, 2015
- QUALCOMM Incorporated
- Changhan Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package to support high-frequency processors
- Patent number 8,982,563
- Issue date Mar 17, 2015
- Oracle International Corporation
- Kannan Raj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple-board power converter
- Patent number 8,749,990
- Issue date Jun 10, 2014
- TDK-Lambda Corporation
- Sun-Wen Cyrus Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector assembly having independent loading mechanism...
- Patent number 8,708,729
- Issue date Apr 29, 2014
- Hon Hai Precision Industry Co., Ltd.
- Alex Lon An
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant conductive nano-particle electrical interconnect
- Patent number 8,704,377
- Issue date Apr 22, 2014
- HSIO Technologies, LLC
- James Rathburn
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Compliant conductive nano-particle electrical interconnect
- Patent number 8,525,346
- Issue date Sep 3, 2013
- HSIO Technologies, LLC
- James Rathburn
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Variable mount voltage regulator
- Patent number 8,498,117
- Issue date Jul 30, 2013
- Advanced Micro Devices, Inc.
- Anthony Andric
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Point of load (POL) power supply systems with replacement module
- Patent number 8,279,619
- Issue date Oct 2, 2012
- Hewlett-Packard Development Company, L.P.
- Howard Leverenz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Re-programmable modular power management circuit
- Patent number 8,161,450
- Issue date Apr 17, 2012
- Active-Semi, Inc.
- Steven Huynh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket connector assembly with compressive contacts
- Patent number 8,079,849
- Issue date Dec 20, 2011
- Tyco Electronics Corporation
- Alan Robert MacDougall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for enhanced packaging for PC security
- Patent number 8,000,108
- Issue date Aug 16, 2011
- Microsoft Corporation
- Shon Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for processor power delivery and thermal management
- Patent number 7,881,072
- Issue date Feb 1, 2011
- Molex Incorporated
- Joseph Ted Dibene, II
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power converter package and thermal management
- Patent number 7,799,615
- Issue date Sep 21, 2010
- VLT, Inc.
- Patrizio Vinciarelli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REVERSE CLAMPING COMPRESSION DEVICE FOR CPO OR NPO
- Publication number 20240061196
- Publication date Feb 22, 2024
- Celestica Technology Consultancy (Shanghai) Co. Ltd.
- Chao SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER MODULE APPARATUS FOR RETROFIT IN CONTROL CABINETS AND METHO...
- Publication number 20230320017
- Publication date Oct 5, 2023
- ABB Schweiz AG
- David Mielnik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND STRUCTURE WITH ELECTRONIC COMPONENT
- Publication number 20230247756
- Publication date Aug 3, 2023
- Murata Manufacturing Co., Ltd.
- Kazunori TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES
- Publication number 20230025397
- Publication date Jan 26, 2023
- TE Connectivity Solutions GMBH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET ALIGNMENT AND RETENTION SYSTEM
- Publication number 20220354013
- Publication date Nov 3, 2022
- TE Connectivity Services GmbH
- Brian Patrick Costello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET CONNECTOR HAVING ARRAY OF SOCKET CONTACTS
- Publication number 20220271465
- Publication date Aug 25, 2022
- TE Connectivity Services GmbH
- Brian Patrick Costello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARDS FOR ELECTRONIC DEVICES
- Publication number 20220217870
- Publication date Jul 7, 2022
- Hewlett-Packard Development Company, L.P.
- Owen P. Columbus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR MOUNTING A DUT ON A TEST BOARD WITHOUT USE...
- Publication number 20210360787
- Publication date Nov 18, 2021
- Nuvoton Technology Corporation
- Simon Wilson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES
- Publication number 20210274673
- Publication date Sep 2, 2021
- TE CONNECTIVITY CORPORATION
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY MODULE FOR AN ELECTRONIC PACKAGE
- Publication number 20200375053
- Publication date Nov 26, 2020
- TE Connectivity Corporation
- Brian Patrick Costello
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ETHERNET CONNECTOR WITH ELECTROMAGNETIC FILTERING
- Publication number 20190115699
- Publication date Apr 18, 2019
- EQUIPEMENT ELECTROLINE INC.
- Martin DUPUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR AN ELECTRICAL CONNECTOR ASSEMBLY
- Publication number 20180310435
- Publication date Oct 25, 2018
- TE Connectivity Corporation
- Alex Michael Sharf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIRST SOCKET NESTED IN A SECOND SOCKET
- Publication number 20180177065
- Publication date Jun 21, 2018
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Kevin B. Leigh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Insertable Power Unit with Mounting Contacts for Plugging into a Mo...
- Publication number 20160105983
- Publication date Apr 14, 2016
- International Rectifier Corporation
- Eung San Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Unit with Conductive Slats
- Publication number 20160105984
- Publication date Apr 14, 2016
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STAGE POWER DELIVERY ARCHITECTURE
- Publication number 20140268615
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY HAVING INDEPENDENT LOADING MECHANISM...
- Publication number 20130337664
- Publication date Dec 19, 2013
- HON HAI PRECISION INDUSTRY CO., LTD.
- ALEX LON AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT CONDUCTIVE NANO-PARTICLE ELECTRICAL INTERCONNECT
- Publication number 20130330942
- Publication date Dec 12, 2013
- James RATHBURN
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICES MOUNTED ON MULTIPLE SUBSTRATES
- Publication number 20130242496
- Publication date Sep 19, 2013
- Cisco Technology, Inc.
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE TO SUPPORT HIGH-FREQUENCY PROCESSORS
- Publication number 20130003310
- Publication date Jan 3, 2013
- ORACLE INTERNATIONAL CORPORATION
- Kannan Raj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT WITH EXTERNA...
- Publication number 20120244728
- Publication date Sep 27, 2012
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT CONDUCTIVE NANO-PARTICLE ELECTRICAL INTERCONNECT
- Publication number 20120202364
- Publication date Aug 9, 2012
- HSIO TECHNOLOGIES, LLC
- James RATHBURN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET CONNECTOR ASSEMBLY WITH COMPRESSIVE CONTACTS
- Publication number 20110281445
- Publication date Nov 17, 2011
- Tyco Electronics Corporation
- Alan Robert MacDougall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POINT OF LOAD (POL) POWER SUPPLY SYSTEMS WITH REPLACEMENT MODULE
- Publication number 20110235294
- Publication date Sep 29, 2011
- HOWARD LEVERENZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System And Method For Processor Power Delivery And Thermal Management
- Publication number 20100325882
- Publication date Dec 30, 2010
- Molex Incorporated
- Joseph Ted DiBene, II
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOCKET PACKAGE INCLUDING INTEGRATAED CAPACITORS
- Publication number 20100197151
- Publication date Aug 5, 2010
- SUN MICROSYSTEMS, INC.
- Ashur S. Bet-Shliemoun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT
- Publication number 20100136840
- Publication date Jun 3, 2010
- David A. Johnson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Re-programmable modular power management circuit
- Publication number 20090284238
- Publication date Nov 19, 2009
- Active-Semi, Inc.
- Steven Huynh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enhanced packaging for PC security
- Publication number 20080310127
- Publication date Dec 18, 2008
- Microsoft Corporation
- Shon Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT
- Publication number 20080268666
- Publication date Oct 30, 2008
- JohnsTech International Corporation
- David A. Johnson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

with built-in components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic assembly including cable modules

Socket connector having array of socket contacts

Socket alignment and retention system

Electronic assembly including cable modules

Method and apparatus for mounting a DUT on a test board without use...

Power delivery module for an electronic package

Ethernet connector with electromagnetic filtering

First socket nested in a second socket

Heat spreader for an electrical connector assembly

Two-stage power delivery architecture

Socket with routed contacts

Electrical connector assembly with holding member

Multi-array bottom-side connector using spring bias

Socket package including integrataed capacitors

Socket with routed contacts

Electronic devices mounted on multiple substrates

High performance surface mount electrical interconnect with externa...

Two-stage power delivery architecture

Chip package to support high-frequency processors

Multiple-board power converter

Electrical connector assembly having independent loading mechanism...

Compliant conductive nano-particle electrical interconnect

Compliant conductive nano-particle electrical interconnect

Variable mount voltage regulator

Point of load (POL) power supply systems with replacement module

Re-programmable modular power management circuit

Socket connector assembly with compressive contacts

Method and apparatus for enhanced packaging for PC security

System and method for processor power delivery and thermal management

Power converter package and thermal management

Patents Applicationslast 30 patents

REVERSE CLAMPING COMPRESSION DEVICE FOR CPO OR NPO

CARRIER MODULE APPARATUS FOR RETROFIT IN CONTROL CABINETS AND METHO...

STRUCTURE AND STRUCTURE WITH ELECTRONIC COMPONENT

ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES

SOCKET ALIGNMENT AND RETENTION SYSTEM

SOCKET CONNECTOR HAVING ARRAY OF SOCKET CONTACTS

CIRCUIT BOARDS FOR ELECTRONIC DEVICES

METHOD AND APPARATUS FOR MOUNTING A DUT ON A TEST BOARD WITHOUT USE...

ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES

POWER DELIVERY MODULE FOR AN ELECTRONIC PACKAGE

ETHERNET CONNECTOR WITH ELECTROMAGNETIC FILTERING

HEAT SPREADER FOR AN ELECTRICAL CONNECTOR ASSEMBLY

FIRST SOCKET NESTED IN A SECOND SOCKET

Insertable Power Unit with Mounting Contacts for Plugging into a Mo...

Power Unit with Conductive Slats

TWO-STAGE POWER DELIVERY ARCHITECTURE

ELECTRICAL CONNECTOR ASSEMBLY HAVING INDEPENDENT LOADING MECHANISM...

COMPLIANT CONDUCTIVE NANO-PARTICLE ELECTRICAL INTERCONNECT

ELECTRONIC DEVICES MOUNTED ON MULTIPLE SUBSTRATES

CHIP PACKAGE TO SUPPORT HIGH-FREQUENCY PROCESSORS

HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT WITH EXTERNA...

COMPLIANT CONDUCTIVE NANO-PARTICLE ELECTRICAL INTERCONNECT

SOCKET CONNECTOR ASSEMBLY WITH COMPRESSIVE CONTACTS

POINT OF LOAD (POL) POWER SUPPLY SYSTEMS WITH REPLACEMENT MODULE

System And Method For Processor Power Delivery And Thermal Management

SOCKET PACKAGE INCLUDING INTEGRATAED CAPACITORS

APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT

Re-programmable modular power management circuit

Enhanced packaging for PC security

APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT