Patent Application
20120287632
The present invention relates to a lamp light source using a semiconductor light-emitting element, and particularly relates to miniaturization of a case containing a circuit unit in such a lamp light source.
In recent years, light bulb-type lamp light sources using a semiconductor light-emitting element such as an LED (Light Emitting Diode) have become a widespread replacement for incandescent light bulbs.
Such lamp light sources typically feature a number of LEDs mounted on a single mounting substrate while a circuit unit for lighting the LEDs is held in the internal space of a case between the back of the mounting substrate and a base. The light produced by the LEDs radiates outward through a globe (see Patent Literature 1).
Also, the case is formed of a metal having thermoconductive properties and thus transmits heat produced by the LEDs to the base. The case is typically made so as not to accumulate heat (see page 12 of Non-Patent Literature 1)
[Patent Literature 1]
[Non-Patent Literature]
[Non-Patent Literature 1]
“2010 Lamp Catalogue”, Publisher: Panasonic Corporation Lighting Company et al.
Conventionally, a lamp light source using a semiconductor light-emitting element requires the case to be large enough to accommodate a circuit unit therein.
The size and dimensions of the lamp thus differ from those of an incandescent light bulb, and as such, the lamp is not always appropriate for mounting in a conventional light fixture intended for an incandescent bulb.
Therefore, demand is growing for a semiconductor light-emitting element-using lamp light source that more closely approximates the size and dimensions of a conventional incandescent bulb be developed by making the case smaller.
However, miniaturizing the case implies a decrease in distance between the semiconductor light-emitting module, i.e., the heat source, and the circuit unit. As a result, the circuit unit is easily affected by the heat from the semiconductor light-emitting module, and the heat produced by the circuit unit itself is not easily dissipated. This leads to a problem in that the heat load imposed on the circuit unit is increased. The electronic components making up the circuit unit include components having a useable life that is dramatically influenced by heat. Therefore, there is a need to constrain increases to the heat load imposed on the circuit unit in order to guarantee a long useable life therefor.
Therefore, the present invention aims to provide a lamp light source configured such that the circuit unit and the semiconductor light-emitting module are in proximity but the heat transmitted to the circuit unit from the semiconductor light-emitting module is constrained.
In order to achieve the above-stated aim, one aspect of the present invention provides a lamp light source, comprising: a light-emitting unit having a plurality of semiconductor light-emitting elements arranged as a ring on a front face of a mount so as to principally emit light in a frontal direction; a circuit unit converting externally-supplied electrical power to cause the semiconductor light-emitting elements to emit the light; a globe that is diffusive and transmittant, disposed so as to cover a front side of the light-emitting unit; an envelope that includes a base receiving the externally-supplied electrical power for causing the semiconductor light-emitting elements to emit the light; and a support member arranged at a distance from the light-emitting unit and supporting the circuit unit in relation to the envelope, wherein a through-hole passes vertically through the light-emitting unit at a point inside the ring of semiconductor light-emitting elements, the circuit unit is at least partly arranged within the through-hole, a space is provided between the circuit unit and the light-emitting unit, and the support member forms at least part of a heat transmission pathway from the circuit unit to the base, the support member thermally connecting the circuit unit and the base.
The lamp light source pertaining to one aspect of the present invention has the circuit unit disposed at least partly in the through-hole within the light-emitting unit. This enables miniaturization of the case and, through the accompanying provision of a space between the light-emitting unit and the circuit unit, constrains heat transmission from the light-emitting unit to the circuit holder while constraining increases to the heat load imposed on the circuit unit in order to guarantee a long useable life therefor.
A light source for a lamp pertaining to the present invention is described below, with reference to the accompanying drawings.
The scale-sized components in the drawings do not conform to reality. In the Embodiments described below, the materials, values, and so on are described by means of examples, and no limitations are intended thereby. Further, appropriate modifications may be made to the present invention provided that these do not deviate from the technical concept of the present invention Further still, combination with elements of other Embodiments is possible, provided that no contradictions arise.
As shown in
(Component Configuration)
The mounting substrate 11 is made up of an element mounting portion 15, which is annular and has a substantially circular hole 14 in the middle, and a tongue portion 16, which extends from one part of the inner edge of the element mounting portion 15 toward the middle of the hole 14. A connector 17 is provided on the top face of the tongue portion 16, and is connected to a wire 41 of the circuit unit 40. The semiconductor light-emitting module 10 and the circuit unit 40 are electrically connected through the connection of the wire 41 to the connector 17. While
The element mounting portion 15 has, for example, 32 semiconductor light-emitting elements 12 mounted thereon, arranged as a ring on the surface. Specifically, the semiconductor light-emitting elements 12 are combined into pairs, each pair being aligned radially with respect to the element mounting portion 15, and the 16 pairs being arranged along the circumferential direction of the element mounting portion 15 at equal intervals so as to form a ring. The aforementioned ring is not necessarily limited to a circular ring, but is also intended to include other polygons, such as triangular, rectangular, or pentagonal shapes. Accordingly, the semiconductor light-emitting elements 12 may be mounted in a ring that is an oval or polygonal loop.
Each pair of the semiconductor light-emitting elements 12 is sealed by one of the sealers 13, each of which is substantially rectangular. Accordingly, there are 16 sealers 13 in total. The longitudinal direction of each sealer 13 coincides with a radial direction of the element mounting portion 15. When viewed from the front and aligned with the lamp axis J, the sealers appear to be radiating out from lamp axis J.
The sealers 13 are primarily made of a translucent material. However, when the wavelength of the light emitted by the semiconductor light-emitting element 12 is to be converted to a predetermined wavelength, the translucent material may be made to include wavelength converting material performing such a conversion. Silicone resin or the like may be used as the translucent material, while fluorescent particles or the like may be used as the wavelength converting material.
In the present Embodiment, semiconductor light-emitting elements 12 emitting blue light are used in combination with sealers 13 made of a translucent material having fluorescent particles mixed therein that convert blue light into yellow light. Thus, the blue light emitted by the semiconductor light-emitting elements 12 is partly converted into yellow light by the sealers 13, such that the semiconductor light-emitting module 10 emits white light generated by the combination of unconverted blue light with converted yellow light.
Furthermore, the semiconductor light-emitting module 10 may, for example, use semiconductor light-emitting elements producing ultraviolet light in combination with fluorescent particles converting the light produced thereby into three colours (e.g., red, green, and blue). Further still, the wavelength converting material may be any material, such as a semiconductor, a metal compound, an organic dye, or a pigment, capable of absorbing light of a particular wavelength and emitting light of a different wavelength.
The semiconductor light-emitting elements 12 are arranged such that the principal direction of light emission is forward, i.e., along the lamp axis J.
Again, as shown in
The front face 22 is not limited to being substantially annular, but may have any shape. Similarly, the front face 22 need not necessarily be completely flat, provided that the semiconductor light-emitting elements can be arranged flatly thereon. The same applies to the back face 23.
The mount 20 is, for example, made of a metallic material. The metal in question may be Al, Ag, Au, Ni, Rh, Pd, an alloy combining two or more of these metals, or an alloy of Cu and Ag. Such a metallic material has advantageous thermal conductivity, and is thus able to effectively conduct the heat produced by the semiconductor light-emitting module 10 to the case 60.
The through-hole 21 enables miniaturization, which is achieved by arranging part of the circuit unit 40 in the through-hole 21 and in the globe 30, passing through the through-hole 21. In addition, the through-hole 21 provided in the mount 20 serves to reduce the weight of the lamp light source 1.
Again, as shown in
The globe 30 has an inner face 32 that diffuses the light emitted by the semiconductor light-emitting module 10. For example, the inner face 32 may be treated with silica or with a white pigment so as to achieve light diffusion. Light incident on the inner face 32 of the globe 30 passes through the globe 30 and reaches the outside atmosphere.
The circuit unit 40 lights the semiconductor light-emitting element 12, and includes a circuit substrate 42 having electronic components 43, 44, and 47 mounted thereon. The drawings show only a subset of electronic components with reference signs. The circuit unit 40 is held in the circuit holder 50 and affixed thereto by, for example, the use of screws, adhesive, engagement, and so on.
The circuit substrate 42 is oriented such that a principal surface thereof is substantially perpendicular to lamp axis J and affixed to an inner bottom surface of a lid 58 of the later-described circuit holder 50 by adhesive or similar. Accordingly, the circuit unit 40 is compactly held in the circuit holder 50. Also, the circuit unit 40 is arranged such that heat-sensitive electronic components 43 is positioned far from the semiconductor light-emitting module 10 while heat-resistive electronic component 44 is positioned close to the semiconductor light-emitting module 10. Accordingly, heat-sensitive electronic component 43 is less susceptible to heat damage from the heat produced by the semiconductor light-emitting module 10.
The circuit unit 40 and the base 70 are electrically connected through electric wires 45 and 46. Electric wire 45 passes a through-hole 51 provided in the circuit holder 50 and is connected to a shell portion 71 of the base 70. Similarly, the electric wire 46 passes through a rear opening 54 of the circuit holder 50 and is connected to an eyelet portion 73 of the base 70.
The circuit unit 40 is partly arranged in the through-hole 21 of the mount 20 and in the globe 30. Accordingly, less space is required to accommodate the circuit unit 40, which is farther back than the mount 20. Thus, the distance between the mount 20 and the base 70 is decreased, enabling a reduction in the diameter of the case 60, which is advantageous for miniaturizing the lamp light source 1. The portion of the circuit unit 40 may be held only in the through-hole 21 without reaching the interior of the globe 30. In such circumstances, the space for accommodating the circuit unit 40 behind the mount 20 may be correspondingly reduced.
The circuit holder 50 is made up of a large-diameter portion 52, a small-diameter portion 53, and the lid 58. The large-diameter portion 52 and the small-diameter portion 53 are, for example, substantially cylindrical with an opening at each end, connected and oriented so as to have a common axis that coincides with the lamp axis J to form a single unit. The large-diameter portion 52 is positioned toward the front and contains a large part of the circuit unit 40. In contrast, the small-diameter portion 53 is positioned toward the back and has the base 70 fit thereon, thus closing the rear opening 54 of the circuit holder 50.
The lid 58 is, for example, shaped as a bottomed cylinder or as a cap, is held by the large-diameter portion 52, via the beam splitter 80, such that a bottom of the lid is oriented toward the front of the large-diameter portion 52, and thereby closes the openings of the large-diameter portion 52 and of the beam splitter 80.
The circuit holder 50 has a through-hole 56 provided at a position corresponding to that of the tongue portion 16 of the semiconductor light-emitting module 10. The front edge of the tongue portion 16 is inserted into the circuit holder 50 through the through-hole 56, such that the connector 17 provided on the tongue portion 16 comes to be positioned in the circuit holder 50.
The circuit holder 50 may be formed of resin or of a similar insulating material. Also, the lid 58 is not limited to being shaped as a bottomed cylinder or cap. The lid 58 may, for example, be a cone, polygonal prism or pyramid, or any desired shape provided that the light from the semiconductor light-emitting module 10 is not obstructed thereby upon passing through the beam splitter 80.
The case 60 is, for example, shaped as a round tube open at both ends, having a diameter that decreases toward the back, or is shaped as a bowl with an opening at the bottom thereof. As shown in
The outer circumferential surface of a rear edge portion of the mount 20 is tapered to match the inner circumferential of the case 60. Thus, a tapered face 25 is in surface contact with an inner face 64 of the case 60 and transmits heat from the semiconductor light-emitting module 10 to the mount 20. This also causes heat to be more easily transmitted to the case 60. The heat produced by the semiconductor light-emitting elements 12 is mainly transmitted through the mount 20 and the case 60 to the small-diameter portion 53 of the circuit holder 50 to reach the base 70, before being dissipated by the base 70 to a non-diagrammed light fixture.
The tapered face 25 completely matches the inner face 64 of the case 60. As such, the tapered face 25 and the inner face 64 of the case 60 are combined in cohesive, gapless contact. Accordingly, the light from the semiconductor light-emitting module 10 does not escape into a gap 61. Alternatively, the tapered face 25 and the inner face 64 of the case 60 may be joined by a non-transparent adhesive or the like, so as to secure the cohesiveness between the two components.
The case 60 is, for example, made of a metallic material. The metal in question may be Al, Ag, Au, Ni, Rh, Pd, an alloy combining two or more of these metals, or an alloy of Cu and Ag. Given that such a metallic material is suited to thermal conduction, the heat transmitted by the case 60 is effectively transmitted toward the base 70.
When the lamp light source 1 is affixed to a light fixture and lit, the base 70 serves to receive electric power from a socket of the light fixture. In the present Embodiment, an E26 Edison screw base is used. However, no limitation is intended regarding the type of base 70 employed. The base 70 is substantially cylindrical and includes a shell portion 71 formed as a male screw along the outer circumferential surface of the base 70 as well as an eyelet portion 73 mounted to the shell portion 71 through an insulating member 72. An insulating member 74 is introduced between the shell portion 71 and the case 60.
A back face 83 of the attaching portion 82 has a recess 84 that is substantially cylindrical and engages with a forward edge portion 57 of the large-diameter portion 52. Fitting the forward edge portion 57 into the recess 84 positions the beam splitter 80 with respect to the large-diameter portion 52. The beam splitter 80 is fixed to the large-diameter portion 52 in this position, through the use of an adhesive or similar. Shaping the forward edge portion 57 of the large-diameter portion 52 to match the recess 84 enables the beam splitter 80 to be appropriately positioned with respect to the semiconductor light-emitting elements 12 through the simple action of fitting the forward edge portion 57 in the recess 84.
Similarly, the front face 85 of the attaching portion 82 is provided with a recess 86 that is substantially cylindrical and engages with a rear edge portion 59 of the lid 58 of the circuit holder 50. The cap-shaped lid 58 is attached to the beam splitter 80 by fitting and fixing the rear edge portion 59 in the recess 86.
The attaching portion 82 has a substantially round hole 87 provided at the approximate centre thereof. The gap in the circuit holder 50 and the gap in the lid 58 are in communication through the hole 87. Accordingly, the part of the circuit unit 40 accommodated within the large-diameter portion 52 and the small-diameter portion 53 of the circuit holder 50 is also accommodated within the hole 87 and the lid 58. Also, providing the hole 87 prevents the beam splitter 80 from interfering with the accommodation of the circuit unit 40.
The beam splitter 80 is made of a translucent material. The translucent material is, for example, a polycarbonate or similar resin, glass, or ceramic. In addition, reflective processing is applied to an outer circumferential surface 88 of the main body 81. The reflective processing may applied to the outer circumferential surface 88 using, for example, a reflective membrane such as a metallic thin-film or dielectric multilayer shaped using thermal evaporative deposition, electron beam evaporation deposition, sputtering, plating, or similar methods.
As shown in
The light emitted from the semiconductor light-emitting module 10 and incident on the outer circumferential surface 88 of the main body 81 is partly reflected obliquely backward by the outer circumferential surface 88 so as to avoid the front face 22 of the mount 20. The direction is indicated by optical path L1 in
The main body 81 is provided so as to reflect a part of the light emitted by the semiconductor light-emitting element 12 obliquely backward, avoiding the front face 22 of the mount 20. Thus, the lamp light source 1 exhibits advantageous light distribution characteristics despite the narrow lighting angle of individual semiconductor light-emitting elements 12. Further, given that the semiconductor light-emitting elements 12 are arranged in a ring and that the outer circumferential surface 88 is correspondingly annular, the light reflected obliquely backward and avoiding the front face 22 of the mount 20 spreads over the entire exterior of the mount 20. Accordingly, the light distribution characteristics are advantageous across the entire circumference centered on lamp axis J.
Further still, the main body 81 not only reflects a part of the light but also allows another part of the light to pass. The beam splitter 80 is thus highly unlikely to produce a shadow, which leads to an advantage in terms of design when the lit lamp light source 1 is viewed head-on.
As such, the provision of the beam splitter 80 allows the outgoing light from the semiconductor light-emitting module 10 to be diffused and, given that the light is unlikely to be obstructed by the lid 58, allows the circuit unit 40 to be arranged farther ahead than the semiconductor light-emitting module 10. This enables miniaturization of the case 60, which accommodates these components.
In the present Embodiment, a reflective processing is applied to the outer circumferential surface 88 such that the beam splitter 80 has reflectivity on the order of 50% (for the outer circumferential surface 88), and transmittance on the order of 50% (for the outer circumferential surface 88). The reflectivity is desirably 50% or higher in order to maintain advantageous light distribution for the lamp light source 1. Similarly, the transmittance is desirably 40% or higher in order to maintain an advantageous design for the lamp light source 1. In brief, assuming 0% absorptance, the main body 81 desirably exhibits reflectivity ranging from 50% to 60% inclusive, and transmittance ranging from 40% to 50% inclusive.
The reflectivity and transmittance need not be uniform across the entirety of the outer circumferential surface 88, but may be made to vary in different regions. For example, when less light is to be reflected toward the back and more light is to be reflected toward the sides, the reflectivity of the outer circumferential surface 88 may be increased at the back and decreased at the front. Conversely, when more light is to be reflected toward the back and less light is to be reflected toward the sides, the reflectivity of the outer circumferential surface 88 may be decreased at the back and increased at the front.
As shown in
The outer circumferential surface 88 of the main body 81 is shaped as a concave plane, having an inward concavity facing the tubular axis of the main body 81. Specifically, as shown in
(Circuit Unit Heat Load Suppression)
As shown in
The semiconductor light-emitting module 10 is not in contact with the large-diameter portion 52 of the circuit holder 50. Gap (space) 27b is provided between the mounting substrate 11 of the semiconductor light-emitting module 10 and the large-diameter portion 52 of the circuit holder 50. In other words, gap 27b is provided between the exterior 55 of the large-diameter portion 52 of the circuit holder 50 and the inner face 18 of the mounting substrate 11. Width W2 of gap 27b is given as measured perpendicularly with respect to lamp axis J, and is substantially uniform along the entirety of the large-diameter portion 52 of the circuit holder 50, with the exception of the tongue portion 16. Accordingly, the semiconductor light-emitting module 10 is less likely to transmit heat to the circuit holder 50, the circuit holder 50 is less likely to reach high temperatures, and the circuit unit 40 is less likely to suffer heat damage. In order to suppress the transmission of heat from the semiconductor light-emitting module 10 to the circuit holder 50, W2 should desirably be from 0.3 mm to 1 mm, inclusive.
In the present Embodiment, the front face 22 of the mount 20 and the back face of the element mounting portion 15 have substantially identical shapes. Also, the semiconductor light-emitting module 10 is positioned such that the front face 22 of the mount 20 and the back face of the element mounting portion 15 fit. As such, W1 and W2 are substantially equal. The gaps 27a and 27b form a single, undivided gap (space) 27. Given that the front face 22 of the mount 20 and the back face of the element mounting portion 15 have substantially identical shapes, the semiconductor light-emitting module 10 is easy to position with respect to the mount 20, and W2 can be made uniform along the entire circumference of the circuit holder 50.
As described above, gap 27a is provided between the circuit holder 50 and the mount 20 while gap 27b is provided between the circuit holder 50 and the semiconductor light-emitting module 10. That is, gap 27 is provided between the circuit holder 50 and the light-emitting unit 90. As such, transmission of heat produced in the semiconductor light-emitting module 10 to the circuit holder 50 is suppressed, and the heat load on the circuit unit 40 is prevented from increasing.
Also, the heat produced by the electronic components making up the circuit unit 40, i.e., the heat produced by the circuit unit 40 itself, is transmitted from the circuit substrate 42 to the lid 58 and the beam splitter 80, then further transmitted to the large-diameter portion 52, the small-diameter portion 53, and the base 70, to be ultimately dissipated by the base 70 to the lighting fixture in which the lamp light source 1 is installed, and to the wall, pillar, or other structure carrying the fixture.
Furthermore, as described above, gap 27 is provided between the circuit holder 50 and the light-emitting unit 90. Thus, air easily circulates within the envelope formed by the globe 30, the case 60, and the base 70. That is, space 33 in the globe 30 and space 61 behind the mount 20 in the case 60 allow air to circulate therethrough, thus making high local temperatures less likely to arise within the envelope.
Furthermore, given that the circuit unit 40 and the semiconductor light-emitting module 10 are arranged close together, the length of the wire 41 used to supply electric power from the circuit unit 40 to the semiconductor light-emitting module 10 can be reduced, thus effectuating reductions in material consumption and in production costs.
Embodiment 1 describes gap 27, provided between the light-emitting unit 90 and the circuit holder 50 to suppress the transmission of heat produced in the semiconductor light-emitting module 10 to the circuit holder 50 and reduce the heat load on the circuit unit 40.
However, the heat load imposed on the circuit unit 40 involves not only heat from the semiconductor light-emitting module 10 but also heat produced by the circuit unit 40 itself. In Embodiment 1, the heat produced by the circuit unit 40 is transmitted from the circuit substrate 42 to the lid 58, the beam splitter 80, the large-diameter portion 52, the small-diameter portion 53, and the base 70, to be ultimately dissipated by the base 70 to the light fixture in which the lamp light source 1 is installed and to the wall, pillar, or similar supporting the fixture. Given that the circuit holder 50 forms part of the heat transmission pathway, the temperature of the circuit holder 50 may rise, in turn causing the air in the circuit holder 50 to rise in temperature and potentially causing an increase in the heat load imposed on the circuit unit 40. Additionally, although the through-hole 56 enables the air inside and outside the circuit holder 50 to remain in communication, the through-hole 56 is only as large as needed for the tongue portion 16 to be inserted. Thus, the inside of the circuit holder 50 is almost hermetic and little air circulates between the inside and outside thereof. Therefore, air tends to stagnate within the circuit holder 50. As a result, high local temperatures arise and may lead to an increased heat load being imposed on the circuit unit 40.
The present Embodiment describes a configuration in which such high local temperatures within the circuit holder 50 are suppressed, thus constraining the heat load imposed on the circuit unit 40.
In order to avoid redundant explanation, portions identical to Embodiment 1 are omitted or abbreviated below. Also, identical components use the same reference signs.
A support base 76 formed of insulating resin material or the like is provided in the recess formed by the insulating member 72 and the eyelet portion 73 of the base 70 and fixed therein. The support base 76 supports two columnar support members 91, which extend substantially parallel to lamp axis J. The circuit substrate 42 of the circuit unit 40 is fixed to the end of the support members 91 opposite the end supported by the support base 76 by means of an adhesive made of insulating material, such as resin.
The support members 91 are, for example, made of a metallic material. The metal in question may be Al, Ag, Au, Ni, Rh, Pd, an alloy combining two or more of these metals, or an alloy of Cu and Ag. The heat transmission characteristics of such metals enable the heat generated by the circuit unit 40 to be more efficiently transmitted to the base 70.
Although the present Embodiment describes two support members 91, no limitation is intended. A single support member may also be used, as may three or more support members.
In Embodiment 1, the large-diameter portion 52 and the small-diameter portion 53 of the circuit holder 50 (see
Also, when, for example, the lid 58 is not included, the circuit holder main body may be formed from the large-diameter portion 502 alone.
Furthermore, gap 65b is provided between the large-diameter portion 502 and the case 60. Gap 65 is formed by the communicating gaps 65a and 65b. Accordingly, the circuit holder main body (i.e., the large-diameter portion 502 and the lid 58) and the circuit unit 40 are supported by the support members 91 as a single whole, and are not connected to any components other than the wire 41 and the connector 17. Therefore, not only is the direct transmission of heat from the semiconductor light-emitting module 10 to the circuit holder main body constrained, but so is the transmission of heat from the semiconductor light-emitting module 10 to the case 60 and the base 70 and on to the circuit holder main body.
The heat produced by the circuit unit 40 is then transmitted from the circuit substrate 42 through the support members 91 and the support base 76 to the base 70, to be dissipated by the base 70 to a light fixture in which the lamp light source 100 is installed, and to the wall, pillar, or other structure carrying the fixture.
Also, the space in the circuit holder main body and the space in the tubular portion 503 are in communication with space 61 through gap 65 (see
As described above, in the present Embodiment, gap 27 is provided between the light-emitting unit 90 and the circuit holder main body to suppress transmission of heat produced by the semiconductor light-emitting module 10 to the circuit holder main body, and the transmission of heat produced by the circuit unit 40 through the support members 91 to the base 70 is enabled. Also, the space in the circuit holder main body and the tubular portion 503 and space 33 in the globe 30 are in communication via gap 65, space 61, and gap 27, thus encouraging air circulation. Thus, high local temperatures are prevented from arising in the space within the circuit holder main body and the tubular portion 503, and an effective constraint is placed on the heat load imposed on the circuit unit 40.
(Variations)
The following variations are also possible. In order to avoid redundant explanation, portions identical to Embodiments 1 and 2 are omitted or abbreviated below. Also, identical components use the same reference signs.
(1) Embodiment 1 describes circuit substrate 42 as being fixed to the lid 58. However, no limitation is intended. As shown in
Further, heat-sensitive electronic components 43 may be arranged on the back face of the circuit substrate 42, i.e., on the principal surface thereof farther from the semiconductor light-emitting module 10. This constrains the effect of the heat produced by the semiconductor light-emitting module 10 on the electronic components 43.
(2) When, for example, in the first variation described above, the base 70 has a small diameter and the small-diameter portion 53 is not easily able to accommodate the electronic components 43, then as shown in
Also, the electronic components 43 may be arranged so as to be accommodated within the lid 58. As such, the electronic components 43 are arranged as far away as possible from the semiconductor light-emitting module 10, suppressing the effect of heat produced by the semiconductor light-emitting module 10 on the electronic components 43.
(3) In the Embodiments and variations described above, the circuit substrate 42 is oriented such that the principal surface thereof is substantially orthogonal to lamp axis J. However, no limitation is intended. For example, as shown in
(4) In Embodiment 1 as described above, the heat produced by the circuit unit 40 is transmitted from the circuit substrate 42 through the circuit holder 50 and the beam splitter 80 to the base 70. As such, the temperature of the circuit holder 50 and the space within increases, potentially leading to an increase in the heat load imposed on the circuit unit 40 contained in the circuit holder 50. However, as shown in
According to this variation, the heat produced by the circuit unit 40 is transferred in part as described in Embodiment 1, i.e., through the circuit holder 50 and the beam splitter 80 to the base 70, while another part of the heat is instead transferred through the highly thermoconductive support members 91 to the base 70. Therefore, temperature increases in the circuit holder 50 and in the space within are suppressed. This effectively prevents the heat load imposed on the circuit unit 40 from increasing.
In such circumstances, the gap 27 is still provided between the circuit holder 50 and the light-emitting unit 90. Thus, the transmission of heat from the light-emitting unit 90 to the circuit holder 50 is suppressed and the heat load on the circuit unit 40 is prevented from increasing.
(5) A further heat transmission pathway may be provided between the base 70 and electronic component 47, which is the electronic component producing the most heat among those making up the circuit unit 40, so as to transmit the heat produced by electronic component 47 directly to the base 70. The electronic component 47 producing the most heat is, for example, a switching element or a transistor.
For example, as shown in in
In such circumstances, gap 27 is still provided between the circuit holder 50 and the light-emitting unit 90. Thus, the transmission of heat from the light-emitting unit 90 to the circuit holder 50 is suppressed and the heat load on the circuit unit 40 is prevented from increasing.
(6) As shown in
In such circumstances, in order to prevent damage to the electronic components of the circuit unit 40 during the filling and hardening of the insulating thermoconductive filling member 78, the insulating thermoconductive filling member 78 solidly fills a space defined by the back face of the circuit substrate 42, the inner face of the small-diameter portion 53, the inner face of the insulating member 72, and the eyelet portion 73, formed when, as shown, the circuit substrate 42 is fixed to the bottom face of the large-diameter portion 52 and to the front end of the small-diameter portion 53 and the electronic components are arranged on the front face of the circuit substrate 42.
In this variation, gap 27 is still provided between the circuit holder 50 and the light-emitting unit 90. Thus, the transmission of heat from the light-emitting unit 90 to the circuit holder 50 is suppressed, heat produced by the circuit unit 40 is transmitted through the insulating thermoconductive filling member 78 to the base 70, and the heat load on the circuit unit 40 is prevented from increasing.
(7) Embodiment 2 describes circuit substrate 42 as fixed to the lid 58. However, as shown in
In such circumstances, gap 27 is still provided between the circuit holder 50 and the light-emitting unit 90. Thus, the transmission of heat from the light-emitting unit 90 to the circuit holder 50 is suppressed, and the heat produced by the circuit unit 40 is transmitted through the support members 91 to the base 70. Also, the space in the circuit holder main body and the tubular portion 503 and space 33 in the globe 30 are in communication via gap 65, space 61, and gap 27, thus encouraging air circulation. Thus, high local temperatures are prevented from arising in the space within the circuit holder main body and the tubular portion 503, and an effective constraint is placed on the heat load imposed on the circuit unit 40.
Furthermore, heat-sensitive electronic component 43 may be arranged on the back face of the circuit substrate 42, i.e., on the principal surface thereof farther from the semiconductor light-emitting module 10. This constrains the effect of the heat produced by the semiconductor light-emitting module 10 on electronic component 43.
(8) When, for example, in the seventh variation described above, the base 70 has a small diameter and the small-diameter portion 53 is not easily able to accommodate electronic component 43, then as shown in
In such circumstances, gap 27 is still provided between the circuit holder 50 and the light-emitting unit 90. Thus, the transmission of heat from the light-emitting unit 90 to the circuit holder 50 is suppressed, and the heat produced by the circuit unit 40 is transmitted through the support members 91 to the base 70. Also, the space in the circuit holder main body and the tubular portion 503 and space 33 in the globe 30 are in communication via gap 65, space 61, and gap 27, thus encouraging air circulation. Thus, high local temperatures are prevented from arising in the space within the circuit holder main body and the tubular portion 503, and an effective constraint is placed on the heat load imposed on the circuit unit 40.
Also, electronic component 43 may be arranged so as to be contained within the lid 58. As such, electronic component 43 is arranged as far away as possible from the semiconductor light-emitting module 10, suppressing the effect of heat produced by the semiconductor light-emitting module 10 thereon.
(9) In Embodiment 2, the circuit unit 40 is supported in relation to the base 70 by support members 91, which form a heat transmission pathway from the circuit unit 40 to the base 70 and transmit the heat produced by the circuit unit 40 to the base 70 to be dissipated. However, as shown in
In such circumstances, gap 27 is still provided between the circuit holder 50 and the light-emitting unit 90. Thus, the transmission of heat from the light-emitting unit 90 to the circuit holder 50 is suppressed, and the heat produced by the circuit unit 40 is transmitted through the support members 91 to the base 70. Also, the space in the circuit holder main body and the tubular portion 503 and space 33 in the globe 30 are in communication via gap 65, space 61, and gap 27, thus encouraging air circulation. Thus, high local temperatures are prevented from arising in the space within the circuit holder main body and the tubular portion 503, and an effective constraint is placed on the heat load imposed on the circuit unit 40.
Accordingly, by providing the heat conducting member 92, most of the large amount of heat produced by electronic component 47 is transmitted through the heat conducting member 92 to the base 70. This enables suppression of heat transmission from electronic component 47 to the circuit substrate 42 and, as described in the eighth variation above, temperature increases in the circuit holder 50 and in the space within are suppressed. This effectively prevents the heat load imposed on the circuit unit 40 from increasing.
(10) In the Embodiments and variations described above, the beam splitter 80 is sandwiched between the large-diameter portion 52 (502) of the circuit holder 50 (501) and the lid 58. However, no limitation is intended. For example, as shown in
Accordingly, the heat received by a light-receiving surface (outer circumferential surface) 188 of the beam splitter 180 from the semiconductor light-emitting module 110 is not transmitted to the circuit holder 150. Thus, the heat load imposed on the circuit unit 40 is suppressed.
Also,
(11) Further still, as shown in
Also,
The globe 230 is made up of a front member 231 and a rear member 232, divided along a virtual plane that is orthogonal to lamp axis J and divides the globe 230. The front member 231 and the rear member 232 are combined to form a lamp light source shaped so as to resemble a typical Japanese type A light bulb. A rear edge portion 233 of the rear member 232 is accommodated in the forward edge portion 62 of the case 60. The case 60, the mount 20, and the rear member 232 are fixed so as to form a single whole by introducing adhesive or similar. The front end of the rear member 232 is attached to the front member 231.
The beam splitter 280 is, for example, shaped like the beam splitter 80 pertaining to Embodiment 1 but modified so as to be substantially tubular, with the forward edge portion of the main body 81 extending away from lamp axis J, and as described in Embodiment 2, is not fixed to the mounting substrate 111 but rather has a forward edge portion 289 fixed to the rear member 232 of the globe 230. Specifically, an engagement groove 235 is provided in the forward edge portion 234 of the rear member 232 for engaging with the forward edge portion 289 of the main body 281. The engagement groove engages with the forward edge portion 289 to achieve fixing. When the forward edge portion 289 is engaged with the engagement groove 235, adhesive or similar may be used to form an adhesive bond between a forward edge portion 234 and another forward edge portion 289. The globe 230 also has an inner face that diffuses the light emitted by the semiconductor light-emitting module 10. For example, the inner face may be treated with silica or with a white pigment so as to achieve light diffusion.
According to this variation as described above, the beam splitter 280 is not in contact with the semiconductor light-emitting module 110 or with the circuit holder 150. Accordingly, the heat produced by the semiconductor light-emitting module 110 is unlikely to be transmitted to the beam splitter 280 and even less likely to be transmitted through the beam splitter 280 to the circuit holder 150. Thus, the heat load imposed on the circuit unit 40 is effectively suppressed.
(12) In the above-described Embodiments and variations, the semiconductor light-emitting elements 12 are arranged in pairs, each sealed by a substantially rectangular sealer 13, the longitudinal direction of each sealer 13 coincides with a radial direction of the element mounting portion 15, and the sealers appear to be radiating from the central lamp axis J when viewed from the front along lamp axis J. However, no limitation is intended.
For example, as indicated by a semiconductor light-emitting module 510 shown in
(13) Also, as indicated by semiconductor light-emitting module 610 shown in
(14) Further, as indicated by semiconductor light-emitting module 710 shown in
(15) Also, as indicated by semiconductor light-emitting module 810 shown in
(16) Alternatively, the circuit holder may be omitted in whole or in part from the configuration, provided that sufficient space is provided between the circuit unit 40 and the light-emitting unit 90, the case 60, and so on, and that insulation is maintained for the circuit unit 40. For example, as indicated by lamp light source 1300 shown in
(17) In addition, as illustrated by lamp light source 1400 shown in
(18) Further, as indicated by lamp light source 1500 shown in
(19) Although the above Embodiments and variations (those shown in
The beam splitter 1580 may be fixed to the top face of the mounting substrate 1511 the using an adhesive or the like, or the beam splitter 1580 and the mounting substrate 1511 may be fixed by screws 93 to form a single whole with the mount 1520.
In addition, a piece of the positioning portion 1582b is cut away to allow the tongue portion 916 to fit in this cutaway potion.
Although
(20) In the above-described Embodiments and variations, the inner face of the globe is treated so as to diffuse the light emitted by the semiconductor light-emitting module. For example, the inner face may be treated with silica or with a white pigment so as to achieve light diffusion. However, the inner face of the globe in the vicinity of the opening thereof may also be provided with a treated portion (light-diffusing portion) 1534 in a region illuminated by the portion of light emitted from the semiconductor light-emitting module and reflected by the beam splitter so as to further enhance the diffusing effect.
As shown in
Accordingly, each tiny dimple so formed has a uniform series of yet smaller simples formed therein. This doubly-dimpled structure provides the treated portion 1534 with improved light dispersion characteristics in comparison to similar but singly-dimpled structures.
The treated portion 1534 is formed in a region of the globe 1530 that is exposed from the case 60, a region where the light reflected by the outer circumferential surface 1588 of the beam splitter 1580 arrives being beneficial. This results in the light reflected backward by the outer circumferential surface 1588 being diffused by the (treated portion 1534 of the) globe 1530, expanding the light dispersion range backward, and improving the contrast provided by the globe 1530 when the lamp light source 1500 is lit.
The radius of each primary dimple 1535 is desirably such that R=20 μm to 40 μm, inclusive, and the radius of each secondary dimple 1536 is desirably such that r=2 μm to 9 μm, inclusive.
Also, the semiconductor light-emitting elements 12 need not necessarily be arranged so as to emit light forward, i.e., along lamp axis J. The semiconductor light-emitting elements 12 may be, in whole or in part, arranged so as to be slanted with respect to lamp axis J. Accordingly, control of the light distribution is improved and desired light distribution is achievable.
(21) The support members 91 used in
In such circumstances, gap 65a between the large-diameter portion 502 and the tubular portion 503 is filled by the insulating thermoconductive filling member 78 and eliminated thereby. Gap 65b between the large-diameter portion 502 and the case 60 is likewise partly filled by the insulating thermoconductive filling member 78 and thereby eliminated. However, the space within the tubular portion 503 is also filled by the insulating thermoconductive filling member 78. Thus, the heat produced by the circuit unit 40 is transmitted through the insulating thermoconductive filling member 78 to the base 70 to be dissipated thereby, thus constraining heat accumulation in the space.
(22) Also,
(23) The configuration shown in
(24) In the above-described Embodiments and variations, the mount 20 is accommodated within the forward edge portion 62 of the case 60 and the globe 30 is installed by inserting the open edge 31 of the globe 30 in space 63 (i.e., the installation groove), which is a gap between the mount 20 and the case 60. Here, for example, an adhesive or similar may be applied to space 63 before the open edge 31 is inserted. The adhesive thus serves to fix the open edge 31 after insertion and fix the mount 20, the globe 30, and the case 60 as a single whole.
As shown in
As shown, when the open edge 31 is inserted into space 63, some of the adhesive applied to space 63 is displaced by the open edge 31 and infiltrates through-hole 34 through a minute gap formed between the outer circumferential surface of the open edge 31 and the inner face 64 of the case 60 and through another minute gap formed between the inner face of the open edge 31 and the outer circumferential surface of the mount 20. Some of the adhesive further infiltrates through-hole 34 beyond the minute gaps. After solidifying, the adhesive is subdividable into adhesive 95 located behind the open edge 31 in space 63, adhesive 96 located within through-hole 34, adhesive 98 forming a thin film in the minute gap between the outer circumferential surface of the open edge 31 and the inner face 64 of the case 60, and adhesive 99 forming a thin film in the minute gap between the inner face of the open edge 31 and the outer circumferential surface of the mount 20. These form a stretch of adhesive working as a whole to keep the mount 20, the case 60, and the open edge 31 of the globe 30 fixed to one another.
The diameter of the through-hole 34 may be, for example, 0.5 mm to 2.5 mm, inclusive. However, no limitation is intended.
Given that adhesive 98 and adhesive 99 are thin films, these portions are represented by thick lines in the drawings for ease of comprehension. The thickness of the lines is not intended to suggest a particular thickness for adhesive 98 and adhesive 99. The same applies to the twenty-fifth variation described below.
Accordingly, the surface contact area between the open edge 31 and the adhesive is increased. This makes the adhesive less likely to easily peel away from the surface of the open edge 31, and in the unlikely case that adhesive 98 and adhesive 99 do peel away, the open edge 31 is prevented from separating from space 63 (i.e., the installation groove) by the anchoring effect of adhesive 96, which is connected to adhesive 95 through adhesive 98 and adhesive 99.
The above-described through-hole 34 is beneficial when provided in at least two locations. Here, through-holes 34 are ideally provided at substantially equal intervals along the circumferential direction of the open edge 31. Accordingly, the load on adhesive 26 is spread out, the risk of breakage is decreased at the junction between adhesive 96 and adhesive 98 or adhesive 99, and the open edge 31 is prevented from separating from space 63 (the installation groove), despite the adhesive peeling away from the open edge 31.
The adhesive applied inside space 63 before the open edge 31 is inserted therein should be provided in a quantity that does not cause the adhesive pressed out by the open edge 31 to surpass either the leading edge of the forward edge portion 62 of the case 60 or the front face 22 of the mount 20. This is beneficial for cost reduction as well as aesthetics. The adhesive may also be applied so as to not surpass the front face of the mounting substrate 11, rather than the front face 22 of the mount 20. The same applies to the twenty-fifth variation, described below.
(25) The configuration described above in the twenty-fourth variation may replace the through-holes in the thickness direction with a dimpled recess in the same direction.
As shown, the outer circumferential surface of the open edge 31 has a dimpled recess 35 formed therein in the thickness direction. As described in the twenty-fourth Embodiment, when the open edge 31 is inserted into space 63, some of the adhesive applied to space 63 is displaced by the open edge 31 and infiltrates the recess 35 through a minute gap formed between the outer circumferential surface of the open edge 31 and the inner face 64 of the case 60. The adhesive then spreads through the minute gap formed between the outer circumferential surface of the open edge 31 and the inner face 64 of the case 60 and through another minute gap formed between the inner face of the open edge 31 and the outer circumferential surface of the mount 20. After solidifying, the adhesive is subdividable into adhesive 95, adhesive 97, adhesive 98, and adhesive 99.
Accordingly, the surface contact area between the open edge 31 and the adhesive is increased. This makes the adhesive less likely to easily peel away from the surface of the open edge 31, and in the unlikely case that adhesive 98 and adhesive 99 do peel away, the open edge 31 is prevented from separating from space 63 (i.e., the installation groove) by the anchoring effect of adhesive 97, which is connected to adhesive 95 through adhesive 98.
The diameter of the dimpled recess 35 may be, for example, 0.5 mm to 2.5 mm inclusive. However, no limitation is intended. The depth of the dimpled recess 35 is dependent on the thickness of the open edge 31. When the open edge 31 is 1 mm thick, then the recess 35 is, for example, 0.8 mm. However, no limitation is intended.
Like the through-holes 34 described in the twenty-fourth variation, the above-described dimpled recess 35 is beneficial when provided in at least two locations. Here, the dimpled recesses 35 are ideally provided at substantially equal intervals along the circumferential direction of the open edge 31. Accordingly, the load on adhesive 97 is spread out, the risk of breakage is decreased at the junction between adhesive 97 and adhesive 98, and the open edge 31 is prevented from separating from space 63 (i.e., the installation groove), despite the adhesive peeling away from the open edge 31.
(26) In the Embodiments and variations described above, groove-like space 63 in which the open edge 31 is inserted is formed by the inner face 64 of the case 60 and the outer circumferential surface of the mount 20. However, no limitation is intended. For example, the exterior of the mount 20 may be provided with an annular member having a groove-like space serving as the installation groove, and the case 60 may be installed in this member. In such circumstances, the mount 20 may be pressed into the annular member or fixed thereto by adhesive or similar. Conversely, the annular member may be press into the case 60, or fixed thereto by adhesive or similar.
Furthermore, given a thin-walled case with a correspondingly thin forward edge portion, mechanical properties such as strength and rigidity can be provided through reinforcing members on the forward edge of the case. For instance, this may take the form of a reinforcing ring pressed into the case, such that the installation groove is formed between the reinforcing ring and the outer circumferential surface of the mount 20.
Furthermore, the installation groove may be formed in the mount 20, or provided on the case 60. For example, an installation groove provided on the case 60 may be realized by folding over an edge of the case 60, which is made of a metallic material.
(27) In the above-described Embodiments and variations, the open edge 31 is described as being continuous along the circumferential direction, and space 63 (i.e., the installation groove) for inserting the open edge 31 is correspondingly described as being a continuous groove in the circumferential direction. However, no limitation is intended. For example, a plurality of protruding open edges 31 may be formed and a groove of sufficient depth to accommodate the protrusions may be formed at a corresponding position in the circumferential direction. In such circumstances, the protruding open edges 31 are desirably substantially equidistant with respect to the circumferential direction. Accordingly, the force applied by the globe 30 on the case 60 is distributed equally with respect to the circumferential direction, and the globe 30 is more reliably secured.
Also, when the installation groove is formed using a separate member, grooves may be provided at positions corresponding to the protruding open edges 31. Further, rather than using a set of annular members, the plurality of members providing the installation groove may be arranged at positions corresponding to the protruding open edge 31.
(28) In the above-described Embodiments and variations, space is provided throughout the entire area between the circuit unit (or the circuit holder) and the light-emitting unit. However, no limitation is intended. For example, the area between the circuit unit (or the circuit holder) and the light-emitting unit may be filled in whole or in part by adiabatic material formed from an insulating member. In such circumstances, the propagation of heat from the light-emitting unit to the circuit unit is suppressed, in turn suppressing temperature increases in the circuit unit.
(29) Further, the space between the circuit unit (or the circuit holder) and the light-emitting unit may be partially filled by an insulating member. In such circumstances, the insulating member need not be adiabatic, as an adiabatic effect is provided by the air in the space between the circuit unit (or the circuit holder) and the light-emitting unit that is not filled by the insulating member. Thus, the propagation of heat from the light-emitting unit to the circuit unit is suppressed to a certain degree.
The individual components of the lamp light sources pertaining to Embodiments 1 and 2, as well as the configurations described in the variations, may be freely combined as appropriate into a given lamp light source. In addition, the materials and dimensions described in the above Embodiments and variations are given as examples, and no limitation is intended thereby. Further, the dimensions and ratios of components indicated by the drawings are intended only as examples. No limitations is intended regarding the dimensions of an actual lamp light source. Further still, appropriate modifications may be made to the lamp light source provided that these do not deviate from the technical concept of the present invention.
The present disclosure is applicable to miniaturizing an LED lamp while preserving the useable life of the circuit unit.
1, 100 Lamp light source
12, 512, 612, 712, 812 Semiconductor light-emitting element
20 Mount
21 Through-hole
27 Gap
30 Globe
40 Circuit unit
42 Circuit substrate
50, 501 Circuit holder
58 Lid
60 Case
65 Gap
70 Base
80, 180, 280, 380 Beam splitter
90 Light-emitting unit
91 Support member
| Number | Date | Country | Kind |
|---|---|---|---|
| 2011-013104 | Jan 2011 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP11/04784 | 8/29/2011 | WO | 00 | 5/21/2012 |
