Land grid array (LGA) interposers, by way of example, provide an array of interconnections between a printed wiring board (PWB) and a chip module, such as a multichip module (MCM), among other kinds of electrical or electronic devices. LGA interposers allow connections to be made in a way which is reversible and do not require soldering as, for instance, with ball grid arrays or column grid arrays. Ball grid arrays are deemed to be somewhat unreliable on larger areas because the lateral thermal coefficients of expansion-driven stresses that develop can exceed the ball grid array strength. Column grid arrays hold together despite the stresses, but are still soldered solutions, and thus, do not allow for field replaceability, which can be significant since replaceability could potentially save a customer costs in the maintenance and upgrading of high-end computers for which LGAs are typically used.
Various types of LGA interposer structures have been developed, but generally include, for instance, rigid, semi-rigid, or flexible substrate structures having arrays of electrical contacts formed by, for example, spring structures, metal-elastomer composites, wadded wire, etc. State of the art LGA techniques enable MCM-to-board interconnections with I/O interconnect densities/counts and electrical/mechanical properties that are desirable for high-performance CPU module designs. Moreover, LGA provides electrical and mechanical interconnect techniques that allow MCM chip modules to be readily removable from wiring or circuit boards, which is advantageous for high-end modules such as CPU packages which may require repeated re-work during production or are designed to be field-upgradable.
In one aspect, provided herein is an electrical interconnect which includes an electrically-conductive, compressible conductor. The electrically-conductive, compressible conductor includes a first conductor end portion and a second conductor end portion. The first conductor end portion and the second conductor end portion physically contact in slidable relation to each other with compression of the electrically-conductive, compressible conductor to, at least in part, facilitate inhibiting rotation of the electrically-conductive, compressible conductor with compression thereof.
In another aspect, an electrical apparatus is provided which includes an interposer, and a plurality of electrically-conductive, compressible conductors disposed within the interposer. At least one electrically-conductive, compressible conductor of the plurality of electrically-conductive, compressible conductors comprises a first conductor end portion and a second conductor end portion, wherein the first conductor end portion and the second conductor end portion physically contact in slidable relation to each other with compression of the at least one electrically-conductive, compressible conductor to, at least in part, facilitate inhibiting rotation of the at least one electrically-conductive, compressible conductor with compression thereof.
In a further aspect, a method of fabricating an electrical interconnect is provided, which includes: providing an interposer; providing an electrically-conductive, compressible conductor; and disposing the electrically-conductive, compressible conductor within the interposer, wherein in uncompressed state, the electrically-conductive, compressible conductor extends beyond a first surface and a second surface of the interposer, the first and second surfaces being opposite main surfaces of the interposer. The electrically-conductive, compressible conductor includes a first conductor end portion and a second conductor end portion, wherein the first conductor end portion and the second conductor end portion physically contact in slidable relation to each other with compression of the at least one electrically-conductive, compressible conductor to facilitate inhibiting rotation of the at least one electrically-conductive, compressible conductor with compression thereof.
Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.
One or more aspects of the present invention are particularly pointed out and distinctly claimed as examples in the claims at the conclusion of the specification. The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
Reference is made below to the drawings (which are not drawn to scale to facilitate understanding of the invention), wherein the same reference numbers used throughout different figures designate the same or similar components.
One widely commercially available LGA uses button contacts, each comprising siloxane rubber filled with silver particles. This structure is intended to provide a contact which possesses a rubber-like elasticity with the provision of electrical conductivity. While siloxane itself has very desirable properties for this type of application, incorporating both a low-elastic modulus and high elasticity, the particle-filled siloxane rubber system loses a significant proportion of these desirable properties under the loadings which are required for electrical conductivity. Although the modulus increases, it remains low overall, and requires only about 30-80 grams per contact to ensure good electrical reliability; however, the loss of elasticity results in creep deformation under constant load and stress relaxation under constant strain. These tendencies render electrically-conductive elastomer LGAs unreliable for high-end products which require an extraordinary stability over a lengthy period of time. Indeed, modern high-end server CPUs demand LGA failure rates at ppb levels on a per contract basis because of a total system dependence on individual signal contacts.
Because of the adverse extent of creep and stress relaxation (which has been demonstrated by the filled electrically-conductive elastomer LGAs), the industry favors the use of LGA arrays which are fabricated from random coil springs, such as for instance, a product called the Cinch Connector, which is made by the Synapse Company, of Seattle, Wash., USA. These springs have a much higher spring constant that the electrically-conductive, elastomer-type connector, but typically require greater pressure per contact in order to ensure reliable electrical connection across the array.
There is a strong technical motivating factor for using LGAs instead of rigid, direct-solder attachments between module and printed wiring board (PWB). The lateral stresses that occur due to thermal coefficient of expansion (TCE) mismatches between ceramic modules and organic PWBs are large, and direct, ball-grid-array-type connections often tend to fail. Systems are accordingly advantageous which have some built-in lateral compliance. As noted, one direct-attach solution to address this problem is a so-called “column grid array”, or CGA. The CGA is a permanent, solder-type interconnection that deforms without failing in order to accommodate the lateral stresses imposed.
There is also a strong economic motivating factor for using LGA interposers over direct-attach solutions. This is because repairs and upgrades to chip sets cannot be carried out in the field with direct-attach solutions. Pressure-mounted LGAs can be replaced in the field, thereby saving the customer significant costs in disassembly, shipping and rework down-time.
Thus, there are both technological and economic advantages to a pressure-type LGA interposer approach.
In
Note that, in the embodiment of
Generally stated, disclosed herein is a novel electrical interconnect, such as, for example, a land grid array interposer structure. The electrical interconnect comprises an electrically-conductive, compressible conductor which includes a first conductor end portion and a second conductor end portion that extend, in one example, from a C-shaped portion. The first conductor end portion and the second conductor end portion physically contact in slidable relation to each other with compression of the electrically-conductive, compressible conductor to, at least in part, facilitate inhibiting rotation of the electrically-conductive, compressible conductor with compression thereof. In one embodiment, the first conductor end portion includes at least one first leg and the second conductor end portion includes at least two second legs, and the at least one first leg and the at least two second legs are interdigitated. Further, the first conductor end portion and second conductor end portion each physically contact in slidable relation an inner-facing surface of the electrically-conductive, compressible conductor, such as an inner-facing surface of the C-shaped portion of the electrically-conductive, compressible conductor.
Advantageously, the electrically-conductive, compressible conductor includes multiple current paths therethrough when operatively disposed in a compressed (or loaded) state between two electrically conducting contacts. At least one of these current paths passes through at least one of the first conductor end portion or the second conductor end portion. In one embodiment, both the first conductor end portion and the second conductor end portion form respective parts of separate electrical current paths through the electrically-conductive, compressible conductor. As one characterization, the electrically conductive-compressible conductor is a partially C-shaped structure, with a figure “8” defined therein via the first and second conductor end portions of the conductor. More particularly, and as explained further below, the electrically-conductive, compressible conductor disclosed herein is advantageously designed to: inhibit rotation of the conductor (or button) with compressing thereof, which avoids loss of contact force; provide good retention of the conductor within the interposer, resulting in low probability of the conductor falling out of the interposer; provide three redundant paths for current to flow, thus reducing the contact resistance; and provide a small footprint conductor, leading to low cross-talk between conductors and allowing for a high-performance connection between, for example, the module substrate and the wiring board.
The land grid array interposer structure 220, and in particular, the plurality of electrically-conductive, compressible conductors 225 arrayed therein, provide electrical interconnection between the first and second arrays of contacts when the interposer structure is operatively disposed between substrate module 200 and wiring board 210. Compressive loading can be applied to the compressible conductors via any conventional means, such as one or more adjustable securing mechanisms (not shown), that force the module substrate and wiring board together, and thereby compress the plurality of electrically-conductive, compressible conductors 225. This compression (or loading) of the conductors creates a normal force between the conductors and the respective first and second contacts, to ensure good electrical connection therebetween.
As illustrated in
The compressible conductors 225 may be formed of any compressible, electrically-conducting material. For example, the conductors might comprise beryllium copper, which has a high yield strength, and good electrical conductivity. The interposer material (from which the interposer layer is formed) may comprise, for example, a thermo-set plastic, which has a total height less than the height of the compressible conductors, as illustrated in
In one embodiment, the compressible conductors 225 disclosed herein can be formed via stamping and bending a continuous, elongate conductor, such as a metal conductor having the desired yield strength to provide the needed compressibility that will facilitate the electrical interconnect functionality described herein, such as, for example, for a land grid array interposer structure. One embodiment of the compressible conductor (or contact button) is illustrated, by way of example, in greater detail in
As noted,
Note that advantageously, there are multiple current paths through the compressive conductors when operationally disposed under compression between two electrically-conducting contacts of the first and second arrays of contacts. These current paths include (in the depicted configuration) a first current path 400 through the C-shaped portion of the compressible conductor, a second current 401 path extending, at least partially, through the first conductor end portion 330 of the compressible conductor, and a third current path 402 extending at least partially through the second conductor end portion 340 of the compressible conductor. Note that, in operation, the multiple current paths through the compressible conductor advantageously reduce resistance of the conductor.
Those skilled in the art will note from the description provided herein, that the compressible conductors (or contact buttons) disclosed can be readily, selectively replaced within an interposer structure, that is, if found to be defective. Further, the compressible conductors disclosed are free of any features that would make them prone to being caught within the interposer material, or bent due to handling. Additionally, electrical connection resistance is less, for example, half or less that of other connectors (such as the above-described, spring-type connectors of
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprise” (and any form of comprise, such as “comprises” and “comprising”), “have” (and any form of have, such as “has” and “having”), “include” (and any form of include, such as “includes” and “including”), and “contain” (and any form contain, such as “contains” and “containing”) are open-ended linking verbs. As a result, a method or device that “comprises”, “has”, “includes” or “contains” one or more steps or elements possesses those one or more steps or elements, but is not limited to possessing only those one or more steps or elements. Likewise, a step of a method or an element of a device that “comprises”, “has”, “includes” or “contains” one or more features possesses those one or more features, but is not limited to possessing only those one or more features. Furthermore, a device or structure that is configured in a certain way is configured in at least that way, but may also be configured in ways that are not listed.
The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below, if any, are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention.
Number | Name | Date | Kind |
---|---|---|---|
3873173 | Anhalt | Mar 1975 | A |
4505529 | Barkus | Mar 1985 | A |
4647124 | Kandybowski | Mar 1987 | A |
5015191 | Grabbe et al. | May 1991 | A |
5092783 | Suarez et al. | Mar 1992 | A |
5139427 | Boyd et al. | Aug 1992 | A |
5259769 | Cruise et al. | Nov 1993 | A |
5299939 | Walker et al. | Apr 1994 | A |
5380210 | Grabbe et al. | Jan 1995 | A |
5395252 | White | Mar 1995 | A |
5427535 | Sinclair | Jun 1995 | A |
5655913 | Castaneda et al. | Aug 1997 | A |
5820389 | Hashiguchi | Oct 1998 | A |
5957703 | Arai et al. | Sep 1999 | A |
5984693 | McHugh et al. | Nov 1999 | A |
6241531 | Roath et al. | Jun 2001 | B1 |
6280254 | Wu et al. | Aug 2001 | B1 |
6290507 | Neidich et al. | Sep 2001 | B1 |
6315576 | Neidich | Nov 2001 | B1 |
6328573 | Sakata et al. | Dec 2001 | B1 |
6345987 | Mori et al. | Feb 2002 | B1 |
6398559 | Tanaka | Jun 2002 | B2 |
6532654 | Guerin et al. | Mar 2003 | B2 |
6730134 | Neidich | May 2004 | B2 |
6731516 | Ma | May 2004 | B1 |
6821163 | McHugh et al. | Nov 2004 | B2 |
6881070 | Chiang | Apr 2005 | B2 |
6905343 | Neidich | Jun 2005 | B1 |
6974332 | Ma | Dec 2005 | B2 |
6981880 | Brodsky et al. | Jan 2006 | B1 |
7040902 | Li | May 2006 | B2 |
7048549 | Swain | May 2006 | B1 |
7052284 | Liao et al. | May 2006 | B2 |
7094066 | Mendenhall et al. | Aug 2006 | B2 |
7118385 | Bodenweber et al. | Oct 2006 | B1 |
7167379 | DiBene et al. | Jan 2007 | B2 |
7196907 | Zheng | Mar 2007 | B2 |
7255574 | Ju | Aug 2007 | B1 |
7284992 | Becker et al. | Oct 2007 | B2 |
7338294 | Polnyi | Mar 2008 | B2 |
7378742 | Muthukumar et al. | May 2008 | B2 |
7402049 | Polnyi | Jul 2008 | B2 |
7427203 | Liao | Sep 2008 | B2 |
7467951 | Hougham et al. | Dec 2008 | B2 |
7479014 | Hougham et al. | Jan 2009 | B2 |
7503770 | Fan | Mar 2009 | B2 |
7520753 | Mulligan et al. | Apr 2009 | B1 |
7559811 | Polnyi | Jul 2009 | B1 |
7607952 | Tai | Oct 2009 | B2 |
7614883 | Mendenhall et al. | Nov 2009 | B2 |
7621755 | Kubo et al. | Nov 2009 | B2 |
7625216 | Mendenhall et al. | Dec 2009 | B2 |
7665999 | Hougham et al. | Feb 2010 | B2 |
7736152 | Hougham et al. | Jun 2010 | B2 |
7775804 | Neidich et al. | Aug 2010 | B2 |
7832095 | Hougham et al. | Nov 2010 | B2 |
7841078 | Lam et al. | Nov 2010 | B2 |
7905730 | Sakamoto et al. | Mar 2011 | B2 |
7950928 | Szu | May 2011 | B2 |
7972149 | Ihara | Jul 2011 | B2 |
8037600 | Hougham et al. | Oct 2011 | B2 |
8118604 | Ma | Feb 2012 | B2 |
8162673 | Chen | Apr 2012 | B2 |
8460011 | Adachi | Jun 2013 | B2 |
20030234451 | Razon | Dec 2003 | A1 |
20070052111 | Long et al. | Mar 2007 | A1 |
20090119916 | Hougham et al. | May 2009 | A1 |
20110111647 | Hougham et al. | May 2011 | A1 |
Number | Date | Country |
---|---|---|
2010-125428 | Jun 2010 | JP |
2010072643 | Jun 2011 | WO |
Entry |
---|
Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration, issued for PCT Application No. PCT/IB2013/050082, filed Jan. 4, 2013, dated Mar. 30, 2013 (12 pages). |
Number | Date | Country | |
---|---|---|---|
20130183872 A1 | Jul 2013 | US |