Claims
- 1. For a laser device capable of etching indicia on a workpiece, an improved indicia positioning apparatus, the improvement comprising:
a pair of opposing x-track members disposed along a first dimension:
a y-track member being movably mounted along a second dimension perpendicular to said x-track members, said y-track further being mounted between said x-track members and movable along said x-track members; a shuttle capable of having the laser device being mounted thereon, said shuttle being movably mounted on the y-track member, wherein the laser device is positionable along the y-track member, and the y-track member is positionable along the x-track member, according to a desired indicia location.
- 2. The indicia positioning apparatus of claim 1, further comprising:
an indicia location calculator capable of determining an optimal indicia location given the dimensions of the workpiece to which indicia is to be etched; and a controller capable of placing said laser device adjacent said optimal indicia location, said controller being further capable of instructing said laser device to operate.
- 3. The indicia positioning apparatus of claim 1, further comprising a workpiece conveyor adapted to move a workpiece linearly along on a plane, said conveyor disposed adjacent said x-track members, such that the laser device may be placed adjacent to and aimed perpendicularly to the plane of the workpiece conveyor.
- 4. The indicia positioning apparatus of claim 1, further comprising:
a first motor being in driving communication with said y-track member and capable of moving said y-track member along said first dimension; a second motor being in driving communication with said shuttle and being capable of moving said shuttle along said second dimension.
- 5. A computerized method of imparting etched indicia to a planar workpiece, comprising the steps of:
providing a laser beam etcher capable of etching an image in the planar workpiece; positioning said planar workpiece perpendicularly to the aim of said etcher; calculating an optimal indicia location according to established parameters; moving said laser beam etcher adjacent said optimal indicia location; determining an optimal orientation for said image; deriving orientation data from said optimal orientation; transmitting said image data and said orientation data to said laser beam etcher; and instructing said laser beam etcher to fire.
- 6. The computerized method of claim 5, wherein the orientation data and image data are transmitted to said laser beam etcher as separate data elements.
- 7. The computerized method of claim 5, wherein the orientation data is incorporated into said image data prior to transmission to said laser beam etcher.
- 8. A computerized method of imparting an indicia to a planar surface, comprising the steps of:
providing an etcher capable of etching an indicia in the planar workpiece media; providing a subject of the planar workpiece media having a first edge and a second edge; determining a desired indicia location on said workpiece, said location being at an intersection of a first and second inset line, the first and second inset lines being at an angle to each other, the first inset line being a specified distance from a first tangent line, said first tangent line being tangent to said first edge, said second inset line being a specified distance from a second tangent line, said second tangent line being tangent to said second edge, and said second tangent line being a specified distance from said second tangent line; determining a first offset distance from the first edge at which the intersection should be located; determining a second offset distance from the second edge at which the intersection should be located; positioning said planar workpiece adjacent said etcher; transmitting image data and orientation data to said etcher; finding the first edge of said planar workpiece; finding the second edge of said planar workpiece; positioning said etcher adjacent the intersection; imparting the indicia to the planar workpiece surface at the intersection.
- 9. The method of imparting an indicia of claim 8, where the step of positioning said etcher adjacent the intersection comprises the steps of:
positioning said etcher at a point along said first dimension, at a distance from the first edge equal to the first offset distance; positioning said etcher at a point along said second dimension, at a distance from the second edge equal to the second offset distance.
- 10. A computerized method of indicia placement on a planar surface, comprising the steps of:
providing a workpiece having a planar surface; providing an indicia image; obtaining the dimensions of the planar surface; inputting an approximate desired indicia location and a desired orientation; calculating an optimal indicia location on the planar surface according to the desired indicia location; effecting the movement of an indicia imparting device to the optimal indicia location on the planar surface relative; and imparting the indicia at the optimal indicia location on the planar surface.
- 11. The computerized method of claim 10, where the step of imparting the indicia comprises the steps of placing a laser emitting device to be adjacent the planar surface and aimed perpendicularly to said surface, and emitting light from the laser in a pattern to impart the indicia image.
- 12. The computerized method of claim 9, where the step of emitting light from the laser in a pattern to impart the indicia is effected by a picture-imparting laser.
- 13. The computerized method of claim 10, where the step of emitting light from the laser in a pattern is effected according to a computerized image file.
- 14. A computerized method of imparting etched indicia to a planar workpiece, comprising the steps of:
providing an etcher capable of etching an indicia in a planar workpiece media according to orientation data received from a controller; providing a subject of the planar workpiece media having a first edge and a second edge; determining a desired indicia location on the workpiece, the location being at an intersection of a first and second dimension, the first and second dimensions a specified distance from the first edge and the second edge; determining a first offset distance from the first edge at which the intersection should be located; determining a second offset distance from the second edge at which the intersection should be located; positioning the planar workpiece adjacent the etcher; transmitting to the etcher indicia image data; transmitting to the etcher indicia orientation data; detecting the first edge of the planar workpiece; detecting the second edge of the planar workpiece; positioning the etcher adjacent the intersection; and imparting the indicia to the planar workpiece surface at the intersection.
- 15. The method of claim 14, wherein the step of positioning the etcher adjacent the intersection comprises the steps of:
positioning the etcher at a point along the first dimension, at a distance from the first edge equal to the first offset distance; positioning the etcher at a point along the second dimension, at a distance from the second edge equal to the second offset distance.
- 16. A computerized method of indicia placement on a planar surface, comprising the steps of:
providing a workpiece having a planar surface; providing an indicia image; obtaining the dimensions of the planar surface; inputting an approximate desired indicia location and a desired orientation; calculating an optimal indicia location on the planar surface according to the desired indicia location; and imparting the indicia at the optimal indicia location on the planar surface.
- 17. The method of claim 16, wherein the step of imparting the indicia comprises the steps of:
placing a laser emitting device adjacent the planar surface; and emitting light from the laser in a pattern to impart the indicia image.
- 18. The method of claim 17, wherein the step of imparting the indicia further comprises the step of transmitting orientation data to the laser emitting device.
- 19. The method of claim 17, wherein the step of emitting light from the laser in a pattern to impart the indicia is effected using a picture-imparting laser.
- 20. The method of claim 17, wherein the step of emitting light from the laser in a pattern is effected according to a computerized image file.
- 21. The method of claim 20, wherein the computerized image file has been modified to incorporate data regarding desired orientation.
- 22. The method of claim 16, wherein the step of imparting the indicia comprises the steps of:
placing a laser emitting device adjacent the planar surface; transmitting orientation data to the laser emitting device; and emitting light from the laser in a pattern to impart the indicia image.
- 23. The method of claim 16, further comprising the step of receiving the workpiece at a fixed position in a workstation.
- 24. The method of claim 16, wherein the indicia comprises logo information.
- 25. The method of claim 16, wherein the indicia comprises text information.
- 26. The method of claim 25, wherein the indicia comprises window specification information.
- 27. The method of claim 25, wherein the indicia comprises NFRC ratings.
- 28. The method of claim 26, further comprising the steps of:
determining window specification data by testing the workpiece; and transmitting said window specification data to an indicia imparter.
- 29. The indicia positioning apparatus of claim 1, wherein said indicia positioning apparatus is incorporated into a workpiece processing line.
- 30. The indicia positioning apparatus of claim 29, wherein said workpiece processing line is a glass processing line.
- 31. The indicia positioning apparatus of claim 29, wherein said workpiece processing line is a processing line for insulated glass assembly units.
- 32. The indicia positioning apparatus of claim 1, wherein said x-track members and y-track members are all positioned horizontally.
- 33. The indicia positioning apparatus of claim 32, wherein said indicia positioning apparatus is disposed over a glass cutting table at a distance adapted to provide for etching of a workpiece placed on said cutting table.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit for priority of U.S. Provisional Application Serial No. 60/322,558, filed Sep. 12, 2001, which is incorporated herein by reference in its entirety.
Provisional Applications (1)
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Number |
Date |
Country |
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60322558 |
Sep 2001 |
US |